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Sabt100p PDF

MD0803025CE
A6

Blu-ray Disc Home Theater Sound System


SA-BT100P
SA-BT100PC
Colour
(K).......................Black Type

Specifications
Main unit SA-BT100P/PC 250 W per channel (6 Ω), 1 kHz, 10% THD
OGENERAL Surround Ch:
Power supply: AC 120 V, 60 Hz 125 W per channel (3 Ω), 1 kHz, 10% THD
iPod connector: DC OUT 5V 500 mA MAX Center Ch:
Power consumption: This unit 140 W 250 W per channel (6 Ω), 1 kHz, 10% THD
Power consumption in standby mode: Subwoofer Ch:
approx. 0.3 W 250 W per channel (6 Ω), 100 Hz, 10 % THD
Dimensions (W×H×D): Total RMS TTL power:
With transmitter: 1250 W
430 mmx96 mmx327 mm FTC TTL Output Power:
(16-15/16” X 3-25/32” X 12-7/8”) Front Ch:
Without transmitter: 104 W per channel (6 Ω), 120Hz to 20 kHz, 1.0% THD
430 mmx90 mmx327 mm Surround Ch:
(16-15/16” X 3-9/16” X 12-7/8”) 34 W per channel (3 Ω), 120Hz to 20 kHz, 1.0% THD
Mass: This unit approx 4.1 kg(9.1 lbs) Center Ch:
Operating temperature range: +0 °C to +40 °C 101 W per channel (6 Ω), 120Hz to 20 kHz, 1.0% THD
(+32 °F to +104 °F) Subwoofer Ch:
Operating humidity range: 35 % to 80 % RH 95 W per channel (6 Ω), 45 Hz to120 Hz, 1.0% THD
(no condensation) Total FTC TTL power:
OAMPLIFIER SECTION 472 W
RMS TTL Output Power: Audio Input:
Front Ch:

© 2008 Matsushita Electric Industrial Co. Ltd.. All


rights reserved. Unauthorized copying and
distribution is a violation of law.

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SA-BT100P / SA-BT100PC

*6
AUX: The total combined maximum number of recognizable picture
x1 contents and folders: 9999 picture contents and 300 folders.
*7
Digital Audio Input: AVCHD format V1.0

Optical: OVIDEO SECTION

x1 Signal system: NTSC

OFM TUNER SECTION Video output

Frequency Range: Output level: 1.0 Vp-p (75 Ω)

87.9-107.9 MHz (200-kHz step) Output connector: Pin jack (1 system)

87.5-108.0 MHz (100-kHz step) Component Video Output (1080i/720p/480p/480i)

Antenna terminals OY output level: 1.0 Vp-p (75 Ω)

75 Ω (unbalanced) OPB output level: 0.7 Vp-p (75 Ω)

ODISC SECTION OPR output level: 0.7 Vp-p (75 Ω)

Discs played: Output connector Pin jack (Y: green, PB: blue, PR: red) (1
system)
(1) BD-Video:
HDMI AV output
BD-ROM Version 2
Output format:
(2) BD-RE:
480p (525p)/1080i (1125i)/720p (750p)/1080p (1125p)
Version 3 (Single Layer, Dual Layer), JPEG*6
Output connector:
(3) BD-R:
Type A (19 pin)
Version 2 (Single Layer, Dual Layer)
HDMITM (Deep color)
(4) DVD-RAM:
*7 *4 O This unit supports “HDAVI Control 3” function.
DVD Video Recording format, AVCHD format , JPEG
Note:
(5) DVD-R/DVD-RW/DVD-R DL:
1. Specifications are subject to change without notice.
DVD-Video format*1,DVD-Video Recording format, AVCHD
format*1,7 Mass and dimensions are approximate.

(6) +R/+RW/+R DL: 2. Total harmonic distortion is measured by the digital spectrum
*1 *1,7 analyzer.
Video , AVCHD format
Solder:
(7) DVD-Video
This model uses lead free solder (PbF).
DVD-Video format
Mechanism:
(8) CD-Audio
This model uses BD/DVD Drive (VXY2001 SERIES)
CD-DA
Wireless Features:
(8) CD-R/RW
This Model supports wireless surround (e.g:SH-FX67)
CD-DA, JPEG*5, MP3
Optical pick-up System with 2 lenses
Wavelength: 782 nm (CDs)/662nm
(DVDs)/405nm (BDs)
LaserSpecification
Class 1 LASER Product
Wavelength: 782 nm (CDs)/662 nm
(DVDs)/405 nm (BDs)
Laser power: No hazardous radiation is
emitted with the safety
protection
SD CARD SECTION
Refer to their respective original service manuals for *1.
SD card slot: Output connector (1 system)
SD card: SD Memory Card*2 formatted
FAT12, FAT32*3. JPEG*4,
AVCHD format*7
*1
Finalizing is necessary.
*2
includes SDHC card
includes miniSD cards (need a miniSD Adaptor)
includes microSD cards (need a microSD Adaptor)
*3
Does not support long file name
*4
The total combined maximum number of recognizable picture
contents and folders: 3000 picture contents and 300 folders.
*5
The total combined maximum number of recognizable picture
contents and folders: 999 picture contents and 99 folders.

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SA-BT100P / SA-BT100PC

CONTENTS
Page Page
1 Safety Precautions 6 1.3. Protection Circuitry 7
1.1. GENERAL GUIDELINES 6 1.4. Safety Parts Information 7
1.2. Before Repair and Adjustment 6

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SA-BT100P / SA-BT100PC

2 Prevention of Electrostatic Discharge (ESD) to 12.3. Checking & Repairing SMPS P.C.B. 63
Electrostatically Sensitive (ES) Devices 9 12.4. Checking & Repairing DSP P.C.B. 64
3 Precaution of Laser Diode 10 12.5. Checking & Repairing Digital P.C.B. 65
4 About Lead Free Solder (PbF) 11 13 Caution for Replacing Parts 68
4.1. Service caution based on legal restrictions 11 13.1. Notice after replacing Digital P.C.B. 68
5 Service Navigation 12 13.2. Items that should be done after replacing parts 68
5.1. Service Information 12 13.3. Standard Inspection Specifications after Making Repairs 68
6 Accessories 13 14 Voltage and Waveform Chart 69
7 Operation Procedures 14 14.1. DSP P.C.B. (IC3001 ~ IC3004) 69
7.1. Remote Control Key Buttons Operations 14 14.2. DSP P.C.B. (IC3101 ~ IC3104) 70
7.2. Main Unit Key Buttons Operations 15 14.3. DSP P.C.B. (IC3201 ~ QR3601) 71
7.3. Using the VIERA Link “HDAVI Control™” 16 14.4. D-Amp P.C.B. 72
7.4. Using the iPod 17 14.5. Main P.C.B. (IC100 ~ IC509) 73
7.5. Playing Secondary Video and Audio 19 14.6. Main P.C.B. (IC801 ~ QR7001) 74
7.6. Basic Connections 20 14.7. Panel P.C.B. (IC6001 ~ Q6003) 75
7.7. Disc and SD Cards Information 23 14.8. SMPS P.C.B. (IC5701 ~ QR5801) 75
8 Operation Instructions 26 14.9. Waveform Chart 76
8.1. Taking out the Disc from BD/DVD Drive Unit when Disc 15 Illustration of IC’s, Transistors and Diodes 78
cannot be ejected by OPEN/CLOSE button 26 16 Wiring Connection Diagram 79
9 Service Mode 27 17 Block Diagram 81
9.1. Self-Diagnosis and Special Mode Setting 27 17.1. Digital 81
9.2. Special Mode Setting 30 17.2. IC Terminal (Digital) Chart 82
9.3. Service Mode at glance 32 17.3. Digital P.C.B. Regulator 84
9.4. Service Mode Table (Wireless - e.g. SH-FX67) 37 17.4. DSP 85
10 Assembling and Disassembling 39 17.5. IC Terminal (DSP) Chart 86
10.1. Disassembly Flow Chart 41 17.6. System Control 88
10.2. Main Components and P.C.B. Locations 42 17.7. Video 89
10.3. Disassembly of Top Cabinet 43 17.8. Audio Selector 90
10.4. Disassembly of Rear Panel 43 17.9. Audio 91
10.5. Disassembly of Front Panel 43 17.10. Digital Audio Amp 92
10.6. Disassembly of BD/DVD Drive Unit 44 17.11. Power 93
10.7. Disassembly of Panel/ Headphone/ Power / Open/close 18 Schematic Diagram Notes 95
P.C.B. 45 19 Schematic Diagram 97
10.8. Disassembly of SD P.C.B. 46 19.1. Digital Circuit 97
10.9. Disassembly of Lid 46 19.2. DSP Circuit 113
10.10. Disassembly of Ipod Cradle P.C.B. 47 19.3. Main Circuit 119
10.11. Disassembly of AC Inlet P.C.B. 48 19.4. Panel, Power Button, Open/Close Circuit 125
10.12. Disassembly of Main P.C.B. 49 19.5. Headphone, SD, Wireless Adapter, Ipod Cradle Circuit 126
10.13. Disassembly of D-Amp P.C.B. 50 19.6. D-Amp Circuit 127
10.14. Replacement of Digital Amp IC (IC5000) 51 19.7. SMPS Circuit 129
10.15. Disassembly of SMPS P.C.B. 51 19.8. AC Inlet Circuit 131
10.16. Replacement of Switch Regulator IC (IC5701) 52 20 Printed Circuit Board 133
10.17. Replacement of Switch Regulator Diode (D5702) 53 20.1. Digital P.C.B. 133
10.18. Replacement of Regulator Diode (D5801) 54 20.2. DSP P.C.B. 134
10.19. Replacement of Regulator Diode (D5802) 55 20.3. Main P.C.B. 135
10.20. Replacement of Regulator Diode (D5803) 56 20.4. Panel, Power Button, Open/Close, Headphone, SD P.C.B.
10.21. Disassembly of Wireless Adapter P.C.B. 57 136
10.22. Disassembly of DSP P.C.B. 57 20.5. Wireless Adapter, Ipod Cradle, AC Inlet P.C.B. 137
10.23. Disassembly of Digital P.C.B. 58 20.6. D-Amp P.C.B. 138
10.24. Disassembly of Stand 59 20.7. SMPS P.C.B. 139
11 Service Fixture and Tools 60 21 Basic Troubleshooting Guide 141
12 Service Position 61 21.1. Troubleshooting Guide for F61 and/or F76 141
12.1. Checking & Repairing Main P.C.B. 61 22 Terminal Function of ICs 147
12.2. Checking & Repairing D-Amp P.C.B. 61 22.1. IC1103 (MFI341S2095): IC COPROCESSOR 147

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SA-BT100P / SA-BT100PC

22.2. IC6001(C0HBB0000057): IC FL Driver 147 24 Replacement Parts List 153


23 Exploded Views 149 24.1. Component Parts List 154
23.1. Cabinet Parts Location 149 25 Schematic Diagram for printing with letter size 175
23.2. Packaging 151

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SA-BT100P / SA-BT100PC

1 Safety Precautions
1.1. GENERAL GUIDELINES
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, carry out the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. LEAKAGE CURRENT COLD CHECK


1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MΩ and 5.2MΩ.
When the exposed metal does not have a return path to the chassis, the reading must be

1.1.2. LEAKAGE CURRENT HOT CHECK


1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to
the customer.

Figure 1

1.2. Before Repair and Adjustment


Disconnect AC power to discharge unit AC Capacitors as such C5700, C5701, C5702, C5703, C5704 through a 10 Ω, 10 W
resistor to ground.
Caution:
DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.
Current consumption at AC 120 V, 60 Hz in NO SIGNAL mode volume minimal should be ~ 900 mA.

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SA-BT100P / SA-BT100PC

1.2.1. Caution for fuse replacement

1.3. Protection Circuitry


The protection circuitry may have operated if either of the following conditions are noticed:
• No sound is heard when the power is turned on.
• Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
“shorted”, or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outlines below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.
Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.

1.4. Safety Parts Information


Safety Parts List:
There are special components used in this equipment which are important for safety.
These parts are marked by in the Schematic Diagrams & Replacement Parts List. It is essential that these critical parts
should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards. Do not modify the original design
without permission of manufacturer.
Table 1
Ref. No. Part No. Part Name & Description Remarks
1 J0KD00000126 FERRITE CORE [M]
5 REXX0640-J BLACK WIRE (AC-SMPS) [M]
6 REXX0641-J RED WIRE (AC-SMPS) [M]
28 VXY2001-SER BD DRIVE UNIT [M]
33 RGR0382A-A2 REAR PANEL [M] P
33 RGR0382A-B2 REAR PANEL [M] PC
38 RKM0592-K TOP CABINET [M]
A2 K2CB2CB00021 AC CORD [M]
PCB2 RFKB4368A DIGITAL PCB [M] (RTL)
PCB3 RFKB4370A MAIN PCB [M] (RTL)
PCB11 REPX0622V SMPS PCB [M] (RTL)
PCB12 REPX0622V AC INLET P.C.B [M] (RTL)
IC103 RFKWEDF001PA IC EEPROM [M] (RTL)
IC3002 RFKWBT100DS1 IC FLASH ROM [M]
IC3102 RFKWBT100DS2 IC FLASH ROM [M]
IC51001 MN2WS0043AP IC DV LSI [M]
IC51302 C3FBSC000029 IC NAND FLASH ROM [M]
IC51303 C3ZBL0000027 IC EEPROM [M]
DZ5701 ERZV10V511CS ZENER [M]
L5701 ELF15N035AN LINE FILTER [M]
L5702 ELF22V035B LINE FILTER [M]
L5703 ELF22V035B LINE FILTER [M]
T5701 ETS42BM19GAC MAIN TRANSFORMER [M]
T5751 ETS19AB281AG BACKUP TRANSFORMER [M]
T7001 G4D1A0000117 SWITCHING TRANSFORMER [M]
PC5701 B3PBA0000402 PHOTO COUPLER [M]

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SA-BT100P / SA-BT100PC

Ref. No. Part No. Part Name & Description Remarks


PC5702 B3PBA0000402 PHOTO COUPLER [M]
PC5720 B3PBA0000402 PHOTO COUPLER [M]
PC5799 B3PBA0000402 PHOTO COUPLER [M]
F1 K5D802APA008 FUSE [M]
IP7001 K5H7512A0010 PROTECTOR [M]
IP58301 ERBSE3R00U PROTECTOR [M]
TH5701 D4CAA2R20001 THERMISTOR [M]
TH5860 D4CC11040013 THERMISTOR [M]
P5701 K2AB2B000010 AC INLET [M]
C5700 F1BAF1020020 1000pF [M]
C5701 ECQU2A104MLC 0.1uF [M]
C5702 ECQU2A104MLC 0.1uF [M]
C5703 ECQU2A104MLC 0.1uF [M]
C5704 F1BAF1020020 1000pF [M]

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SA-BT100P / SA-BT100PC

2 Prevention of Electrostatic Discharge (ESD) to


Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).

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SA-BT100P / SA-BT100PC

3 Precaution of Laser Diode


CAUTION :
This product utilizes a laser diode with the unit turned "on", invisible laser radiation is emitted from the pickup lens.
Wavelength: 662 nm (DVD)/782 nm (CD)/405 nm (BD)
Maximum output radiation power from pickup: 100 µW/VDE
Laser radiation from the pickup unit is safety level, but be sure the followings:
1. Do not disassemble the pickup unit, since radiation from exposed laser diode is dangerous.
2. Do not adjust the variable resistor on the pickup unit. It was already adjusted.
3. Do not look at the focus lens using optical instruments.
4. Recommend not to look at pickup lens for a long time.

10

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SA-BT100P / SA-BT100PC

4 About Lead Free Solder (PbF)


4.1. Service caution based on legal restrictions
4.1.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that
of the normal solder.

Definition of PCB Lead Free Solder being used


The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)

Service caution for repair work using Lead Free Solder (PbF)
• The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
• To put lead free solder, it should be well molten and mixed with the original lead free solder.
• Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
• Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt
the lead free solder.
• Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30
degrees C (662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
• The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)

Note
* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

11

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SA-BT100P / SA-BT100PC

5 Service Navigation
5.1. Service Information
The service manual contains technical information which will allow service personnel’s to understand
and service this model.
Please place orders using the parts list and not the drawing reference numbers.

If the circuit is changed or modified, the information will be followed by supplement service manual to be filed with
original service manual.
1) This service manual does not contain the following information, because of the impossibility of servicing at
component level.

* Schematic Diagram, Block Diagram and P.C.B. layout of Digital P.C.B..


* Parts List for individual parts of Digital P.C.B..
* Exploded View and Parts List for individual parts of BD/DVD drive.

2) The following category are recycle modeule part. Please send them to Central Repair Center.

* Digital P.C.B. (BT100P/PC : RFKB4368A)

3) For BD/DVD Drive, it depends on area to defferent recycle system.


Please refer to service policy in detail.

* BD/DVD drive (VXY2001-SER)

12

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SA-BT100P / SA-BT100PC

6 Accessories
• Note: Refer to “Replacement Parts List” (Section 25) for the part number.

AM loop antenna
Remote control

AC cord FM Indoor Antenna


(For SA-BT100 & SH-FX67)

Video cable Speaker cable sticker

Speaker cables

13

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SA-BT100P / SA-BT100PC

7 Operation Procedures
7.1. Remote Control Key Buttons Operations
Remote control
14 1 Turn the unit on and off
2 Select the source
[BD/SD]: Select disc drive or SD card drive
[FM/AM]: Select FM/AM tuner
[iPod]: Select iPod as the source
1 15 3 Numbered buttons
Select preset radio stations and title numbers, etc./Enter numbers
4 Cancel
2 5 Basic playback control buttons
[ , ]: Select preset radio stations
[ , ]: Select radio station manually
3 16
6 Show on-screen menu
7 Show Pop-up menu
8 Show Top Menu/Direct Navigator
9 Show sub menu
17 10 These buttons are used when operating a BD-Video disc that
includes JavaTM applications (BD-J). For more information about
4 operating this kind if disc, please read the instructions that came
18
with the disc.
The [A] and [B] buttons are also used with the "Title View", "Picture
View" and "Album View" screens
5 11 Show Setup menu
12 Remove interference during radio reception
13 [SOUND]: Set the sound effect
[SLEEP]: Set the sleep timer
6 19 [CH SELECT]: Select speaker channel
[MUTING]: Mute the sound
7 14 Transmit the remote control signal
20 15 TV operation buttons
Aim the remote control at the Panasonic TV and press the button.
[ TV]: Turn the TV on and off
8 21 [TV/VIDEO]: Switch the input channel
[ VOL]: Adjust the TV volume
This may not work properly with some models.
9 22 16 Select the source
BD/DVD/CD SD FM AM IPOD D-IN AUX
10
23 17 Adjust the volume of the main unit
11 24 18 Select audio
19 Start up and play a disc automatically
12 25 20 [ , , , ]: Menu selection
[OK]: Selection
13 [ , ]: Select preset radio station
[ ] ( ),[ ] ( ): Frame-by-frame
21 Show FUNCTIONS menu
22 Return to previous screen
23 [PIP]:Switch on/off Secondary Video (Picture-in-picture)
[SECONDARY AUDIO]:Switch on/off Secondary Audio
24 Show status messages
25 Enjoy surround sound

Wireless system
1 2 1 Unit on/off button [POWER , ]
2 Use this button to turn the unit on and off.
: This unit is on.
POWER : This unit is off.
AUTO OPERATION ON/OFF
AUTO OPERATION ON/OFF POWER indicator
The indicator lights red when the wireless system is turned on and
lights green when the wireless link is activated. When the wireless
link is inactive for a long time, it turns red.

14

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SA-BT100P / SA-BT100PC

7.2. Main Unit Key Buttons Operations


Main unit
1 2 3 4 5 6 7 8 9 10

SW 7.1CH
BOOST D.S.P. SELECTOR

11 12 13 14 15

18
Place your finger on the section
and open it diagonally downwards.
16

17

1 POWER button (POWER / ) 8 Select the radio station manually


Press to switch the unit form on to standby mode vice versa. In Search /Slow-motion/Skip
2 standby mode, the unit is still consuming a small amount of power. Search: Press and hold (During play)
Standby/on indicator ( ) Slow-motion: Press and hold (During pause)
When the unit is connected to the household AC outlet, this Skip: Press
indicator lights up in standby mode and goes out when the unit is 9 Stop
turned on. 10 Start play
3 Open or close the disc tray 11 Disc tray
4 SW BOOST (Subwoofer boost) button 12 Remote control signal sensor
Turn Subwoofer boost on/off 13 Display
5 SW BOOST (Subwoofer boost) indicator 14 Adjust the volume of the main unit
Lights when Subwoofer boost is on 15 Volume indicator
6 7.1CH D.S.P. indicator It is possible to set the indicator to turn on/off.
Illuminated during 7.1ch source playback. 16 SD card slot
7 Select the source 17 Connect iPod
BD/DVD/CD SD FM AM IPOD D-IN AUX 18 Headphone terminal
Rear panel terminals
CAUTION
Do not place objects in front of the unit. The disc tray may collide with
objects when it is opened, and this may cause injury.

The unit’s display


1 2 3

DISC iPod SD SLP TUNED MONO ST M DTS 96/24


W2S D D
W4S PL x HD
NEO:6
4 5 6 7
1 Drive indicator 5 Main display section
Lights when disc is ready to play. 6 iPod indicator
DISC
iPod Lights when iPod is ready to play. Illuminated during iPod repeat playback

SD Lights when SD card is ready to play. Illuminated during iPod shuffle playback
The indicator blinks when reading data. 7 Audio signal indicator
2 SLEEP indicator DTS Lights when DTS decoder is being used.
3 Radio broadcast display
DTS Lights when DTS-HD decoder is being used.
TUNED Lights when receiving a radio broadcast.
DTS Lights when DTS-ES decoder is being used.
MONO Lights when set to monaural reception.
DTS 96/24 Lights when DTS 96/24 decoder is being used.
ST Lights when set to stereo broadcast reception.
D Lights when Dolby Digital decoder is being used.
M Flashes during preset channel registration.
Lights when Dolby Digital Plus decoder is
4 Wireless link indicator D being used.
Lights when Dolby Pro Logic II decoder is
Lights when speaker setting is set to 5.1ch and PL being used.
W2S link with wireless system is activated. Lights when Dolby Pro Logic IIx decoder is
PL x being used.
Lights when speaker setting is set to 7.1ch and Lights when Dolby TrueHD decoder is
W4S link with wireless system is activated. HD being used.
Lights when DTS NEO:6 matrix decoder is
The indicator blinks when the wireless link is inactive for NEO:6 being used.
a long time.

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7.3. Using the VIERA Link “HDAVI Control™”


(VIERA LinkTM H DAVI ControlTM )
What is VIERA Link HDAVI Control ?
VIERA LinkTM is a new name for EZ SyncTM. VIERA Link HDAVI Control , based on the control
VIERA Link HDAVI Control is a convenient function that offers linked functions provided by HDMI which is an industry
operations of this unit, and a Panasonic TV (VIERA) under HDAVI standard known as HDMI CEC (Consumer
Control . You can use this function by connecting the equipment with an NOTE Electronics Control), is a unique function that we
HDMI cable. See the operating instructions for connected equipment for have developed and added. As such, its operation
operational details. with other manufacturers equipment that supports
HDMI CEC cannot be guaranteed.
Preparation This unit supports HDAVI Control 3 function.
1 Confirm that the HDMI connection has been made HDAVI Control 3 is the newest standard (current as
2 Set VIERA Link to On of December, 2007) for Panasonic s HDAVI Control
3 To complete and activate the connection correctly, turn on all VIERA Link compatible equipment. This standard is compatible
HDAVI Control compatible equipment and set the TV to the corresponding with Panasonic s conventional HDAVI equipment.
HDMI input mode for this unit.
Please refer to individual manuals for other
manufacturers equipment supporting VIERA Link
Setting the TV audio for VIERA Link HD AVI Control function.
Select between AUX and D-IN to work with the linked operations. Confirm
the audio connection to the AUX terminal (for AUX ) or OPTICAL IN terminal It is recommended that you use Panasonic s
HDMI cable.
(for D-IN )
Recommended p art num ber:
1 Press [ , SELECT] to select AUX or D-IN . RP-CDHG10 (1.0 m/3.3 ft.), RP-CDHG15 (1.5 m/
2 Press [SETUP]. 4.9 ft.),RP-CDHG20 (2.0 m/6.6 ft.), RP-CDHG30
3 (When D-IN is selected) (3.0 m/9.8 ft.), RP-CDHG50 (5.0 m/16.4 ft.), etc.
Press [ , ] to select TV SOUND .
4 Press [OK]. Non-HDMI-compliant cables cannot be utilized.
5 Press [ , ] to switch AUX or D-IN and press [OK].

Whenever the connection or settings are changed, reconfirm the points above.

What you can do with HDAVI Control

One touch play Speaker control


You can turn on this unit and TV, and start playing with a single press You can select whether audio is output from the unit s speakers or the
of a button. TV speakers by using the TV menu settings. For details, refer to the
Press [ONE TOUCH PLAY]. operating instructions of your TV.
This unit s speakers will be automatically activated ( right, Speaker Home theater
control). This unit s speakers are active.
When this unit is in standby mode, changing the TV speakers to this
This function also works if you press [ ] (PLAY) on this unit s unit s speakers in the TV menu will automatically turn the unit on and
remote control when this unit is in standby mode. select AUX * or D-IN * as the source.
Playback may not be immediately displayed on the TV. If you miss The TV speakers are automatically muted.
the beginning portion of playback, press [ ] or [ ] to go back to You can control the volume setting using the volume or mute button
where playback started. on the TV s remote control. (The volume level is displayed on the
main unit s FL display.)
Automatic input switching To cancel muting, you can also use the home theater remote control
If you turn off this unit, TV speakers will be automatically activated.
When you switch the TV input to TV tuner mode, this unit will
automatically switch to AUX * or D-IN * .
[This function does not work when the iPod selector (SIMPLE mode) TV
is chosen.] TV speakers are active.
When you start disc play, the TV will automatically switch its input The volume of this unit is set to 0 .
mode for this unit. This function works only when BD/DVD/CD , SD , AUX * or
D-IN * is selected as the source on the home theater system.
Audio output is 2-channel audio.
Automatic lip-sync function (for HDAVI Control 3)
Delay between audio and video is automatically adjusted, enabling
you to enjoy smooth audio for the picture Power off link
This function works only when BD/DVD , SD , AUX * or D-IN * is When the TV is turned off, this unit goes into standby mode
selected as the source on this unit. automatically.
This function works only when BD/DVD/CD , SD , IPOD , AUX *
or D-IN * is selected as the source on this unit.

* AUX or D-IN works depending on the TV SOUND setting ( above, Setting the TV audio for VIERA Link HDAVI Control ).

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7.4. Using the iPod


Preparation
To view videos/photos from the iPod.
Ensure the video connection to the VIDEO OUT terminal on this unit.
Operate the iPod menu to make the appropriate video/photo output settings for your TV.
To display the picture, turn on the TV and select the appropriate video input mode.
Before connecting/disconnecting the iPod, turn the main unit off or reduce the volume of the main unit to its minimum.

1 Open the Dock for iPod.


About dock adapter
Place your finger on the section Attach the dock adapter which should be supplied
and open it diagonally downwards. with your iPod to the dock for the stable use of the
NOTE
iPod. If you need an adapter, consult your iPod
dealer.
Dock for iPod
About recharging the battery
iPod will start recharging regardless of whether this
unit is on or off.
Main unit
IPOD will be shown on the main unit s display
during iPod charging in main unit standby mode.
Check iPod to see if the battery is fully recharged.
If you are not using iPod for an extended period of
2 Connect the iPod (not included) firmly. time after recharging has completed, disconnect it
from main unit, as the battery will be depleted
Recharging starts when the iPod is inserted. naturally. (Once fully recharged, additional
e.g., recharging will not occur.)
iPod

Dock adapter
(not included)

Main unit
Hold the dock when connecting/
disconnecting the iPod.

Compatible iPod
Name Memory size Compatibility depends on the software version of
your iPod.
iPod touch 8 GB, 16 GB Audio/video cannot be recorded or transmitted to
iPod nano 3rd generation (video) 4 GB, 8 GB NOTE iPods via this system.
Panasonic makes no warranty over iPod data
iPod classic 80 GB, 160 GB management.
iPod nano 2nd generation (aluminum) 2 GB, 4 GB, 8 GB For more information, refer to the operating
iPod 5th generation (video) 60 GB, 80 GB instructions for iPod.
The contents of the operating instructions and
iPod 5th generation (video) 30 GB
those displayed on iPod may differ partially, but this
iPod nano 1st generation 1 GB, 2 GB, 4 GB will not fundamentally affect use of music
playback.
iPod 4th generation (color display) 40 GB, 60 GB
iPod 4th generation (color display) 20 GB, 30 GB
iPod 4th generation 40 GB
iPod 4th generation 20 GB
iPod mini 4 GB, 6 GB

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Playback
This system features two different iPod playback modes.
The first of these is EXTENDED mode, for playback of music contents. With this mode, the menu screen on the system can be used to search for
playlists and artist names, and to play music. The second mode is SIMPLE mode, which can be used for playback of three types of contents
music, photos, and videos. With this mode, simple operations such as play, stop, and search can be performed on the display of your iPod.

Enjoy music (EXTENDED mode) Enjoy videos/photos (SIMPLE mode)


1 Press [iPod] to select IPOD . You can also play music using SIMPLE mode.
The iPod automatically switches to this unit s display mode.
iPod Music menu appears on the TV. 1 Press [iPod] to select IPOD .
If the menu screen is not displayed, press [SETUP].
2 Press [SETUP] to switch the iPod to its own
iPod Music display mode.
Playlists
Proceed operations through display of iPod.
Ar tists If the iPod Music menu ( left) is displayed, press [SETUP].
Alb ums
SIMPLE will be shown on the main unit s display.
Son gs
Podcasts
Audiobooks
3 Switch the TV input to video in.
Playbac k Mode
4 Play a slideshow or video on your iPod.
OK
The picture will be displayed on your TV.
You can also use the remote control to operate iPod menu.
Items Selection/playback method [ , ]: To navigate menu items
Playlists Search from all playlists. [OK]: To go to the next menu
[RETURN]: To return to the previous menu
Artists Search by artist name.
Albums Search by album title.
Songs Search from all songs registered on iPod.
Podcasts Search by episode for radio programs
downloaded from iTunes store.
Audiobooks Search by title from audiobooks purchased from
iTunes store or audible.com.
Basic controls (For music and videos only)
Playback Shuffl e
Mode* Off: Cancel Buttons Functions
Songs: Play all songs on iPod in random order.
Albums: Play all songs on album in random [ ] (PLAY) Play
order.
[ ] Pause
is displayed on the unit s display when
Press [ ] (PLAY) to restart play.
Songs or Albums is selected. [ ] Playback start position may not be
Repeat stored in memory in certain cases.
Off: Cancel
One: Play single song repeatedly. [ , ] Skip
All: Play all songs from selected item (e.g., (Press and hold)
Playlists, Albums, etc.) repeatedly. Search
[ , ]
is displayed on the unit s display when
One or All is selected. You can enjoy surround sound effect when you press [ PLIIx] or
* [NEO:6]
Playback modes during connection/when disconnected
System may be operated in same playback mode as set with
iPod when connected. Playback may also be continued on iPod
with same settings as made on system after disconnection.

2 Press [ , ] to select an item and press [OK].


Play will start from the selected song if this operation is
repeated several times.
Press [RETURN] to return to the previous screen.
e.g.,
Playing condition
iPod

Song
Good morning
Artist Ronaldo
Happy days
Album
2:43
45 of 1230
Playing
position Pause Play
Skip Skip
RETURN

Clear/display iPod Music menu during playback.


Press [TOP MENU].

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7.5. Playing Secondary Video and Audio


Playing secondary video (picture-in-picture) and secondary audio
Secondary video can be played from a disc compatible with the picture-in-picture
function. Only the primary video is played during search/
For the playback method, refer to the instructions for the disc. slow-motion or frame-by-frame.
NOTE
Secondary video
To turn on/off secondary video
Press [PIP].
Secondary video is played.
PiP ON is displayed.
Press the button to turn it ON and OFF.

To turn on/off audio with the secondary video


Press [SECONDARY AUDIO]. Primary video
The secondary audio is played.
Secondary Audio ON is displayed.
Press the button to turn it ON and OFF.

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7.6. Basic Connections


7.6.1. Speaker Cables and Transmitter Connection
Do not place the unit on amplifiers or equipment that may become hot. The heat can damage the unit.
Turn off all equipment before connection and read the appropriate operating instructions.

Speaker cables and transmitter connection

Sheet of speaker cable Speaker cable for front Speaker cable for front Speaker cable for surround
stickers speaker (L) (White) speaker (R) (Red) speaker (L) (Blue)

Speaker cable for surround Speaker cable for center Digital transmitter
speaker (R) (Grey) speaker (Green)

Preparation
Attach the speaker cable stickers to make connection Set the surround selector at the rear of the wireless
easier. system to tis center.
e.g., Center speaker
SURR SURR SURR SPEAKERS
NCEINTES
LS / RB LB / RS

AC IN

SURR I/D SET

L R SURROU ND (3 6 )
SIDE SIDE AMBIOPHONIQUES
CENTER

5
Speaker cable sticker
CENTER

5
Do Do not Do not
(included)

Digital transmitter
Insert fully until you
Main unit hear a click. Wireless system
SURROU ND OPTICAL IN VIDEO OUT PR AUX
BACK SURROU ND AM ANT
OUT EXT
L SPEAKERS
SPEAKERS LOOP ENCEINTES
LOOP DIGITAL LS / RB LB / RS
DIGITAL ANT TRANSMITTER
Y PB R GND
COMPONENT VIDEO OUT FM ANT
AC IN
75

SURR I/D SET


AC IN
6 5 2 1 L R SURROU ND (3 6 )
6 6 R 6 L FRO NT SIDE SIDE AMBIOPHONIQUES
SUBWOOFER CENTER AV OUT

Purple Green Red White Blue Grey

Connect to the terminals of the


same color.

Subwoofer
Speaker cable (included)
Surround Surround
Front speaker (R) Front speaker (L) speaker (L) speaker (R)

Front Front Surround Surround

Center speaker

Center

Do not use a front speaker as a surround speaker or vice versa. Verify the type of speaker with the label on the rear of the
speaker.
Do not insert or remove the digital transmitter while the main unit is on.
NOTE
Insert the wires fully.
: White
: Blue

Push!
Be careful not to cross (short-circuit) or reverse the polarity of the speaker wires as doing so may damage the speakers.

Do not

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7.6.2. Connecting to a Television with HDMI & Video Cable


Connection to a TV
Do not connect through the video cassette recorder. Due to copy guard protection, the picture may not display properly.

With an HDMI cable

HDMI AUDIO OUT


OPTICAL
OUT
compatible AV IN
L
TV

R Audio cable * Optical


(not included) digital audio
The optical digital cable *
audio cable can be (not included)
Main unit HDMI cable (not included) used when connecting
to televisions with
SURROU ND
BACK SURROU ND OPTICAL IN VIDEO OUT PR AUX
AM ANT
optical out terminals OPTICAL IN VIDEO OUT PR AUX
AM ANT
OUT
SPEAKERS
L
EXT

LOOP
( right). L
EXT

LOOP
LOOP LOOP
DIGITAL ANT DIGITAL ANT
Y PB R GND Y PB R GND
COMPONENT VIDEO OUT FM ANT COMPONENT VIDEO OUT FM ANT
75 75

AC IN
6 5 2 1 1
6 6 R 6 L FRO NT AV OUT L FRO NT AV OUT
SUBWOOFER CENTER

Please use High Speed HDMI cables that have the HDMI logo (as shown on the cover).
It is recommended that you use Panasonic’s HDMI cable.
Recommended part number:
NOTE RP-CDHG10 (1.0 m/3.3 ft.), RP-CDHG15 (1.5 m/4.9 ft.), RP-CDHG20 (2.0 m/6.6 ft.),
RP-CDHG30 (3.0 m/9.8 ft.), PR-CDHG50 (5.0 m/16.4 ft.), etc.
NECESSARY SETTINGS
"HDMI Video Mode" : "On"/"HDMI Audio Output" : "Off"

With this connection, you can use VIERA Link "HDAVI Control"

* These audio connections will enable you to play audio from your television through your home theater system

With Video cable

Video cable

VIDEO IN
OPTICAL
TV OUT

AUDIO IN AUDIO OUT

L L
Optical
Audio cable * digital audio
R R
(not included) cable *
The optical digital (not included)
Main unit Video cable (included) audio cable can be
used when connecting
SURROU ND
BACK SURROU ND OPTICAL IN VIDEO OUT PR AUX
AM ANT
to televisions with OPTICAL IN VIDEO OUT PR AUX
AM ANT
OUT
L
EXT
optical out terminals L
EXT

SPEAKERS LOOP LOOP

DIGITAL
LOOP
ANT
GND
( right). DIGITAL
LOOP
ANT
GND
Y PB R Y PB R
COMPONENT VIDEO OUT FM ANT COMPONENT VIDEO OUT FM ANT
75 75

AC IN
6 5 2 1 1
6 6 R 6 L FRO NT AV OUT L FRO NT AV OUT
SUBWOOFER CENTER

Optional connections
For those who want to enjoy higher picture quality and have a TV equipped with an HDMI terminal
For those who want to enjoy higher picture quality and have a TV equipped with a COMPONENT VIDEO IN terminal
NOTE For those who have a Set Top Box (Satellite receiver, Cable box, etc) or video cassette recorder

*These audio connections will enable you to play audio from your television through your home theater system

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7.6.3. Radio Antenna and AC Power Supply Cord Connections


Radio antenna connections

FM Indoor antenna AM loop antenna

FM indoor antenna (included) AM loop antenna (included)


Affix this end of the antenna where Stand the antenna up on its base.
reception is best. Place the antenna where reception
is best.
Adhesive tape Red
Main unit White
SURROU ND OPTICAL IN VIDEO OUT PR AUX
BACK SURROU ND

OUT
L
AM ANT
EXT Click!
SPEAKERS LOOP
LOOP DIGITAL
DIGITAL ANT TRANSMITTER
Y PB R GND
COMPONENT VIDEO OUT FM ANT
75

Black
AC IN
6 5 2 1
6 6 R 6 L FRO NT AV OUT
SUBWOOFER CENTER

1
2

Push! 3

Keep loose antenna cables away from other wires and cables.

Optional connections
NOTE
Using FM/AM outdoor antenna (optional)

AC power supply cord connections

AC power supply cord

Main unit Wireless system

SURROU ND OPTICAL IN VIDEO OUT PR AUX


BACK SURROU ND AM ANT
OUT EXT SPEAKERS
L ENCEINTES
SPEAKERS LOOP LS / RB LB / RS
LOOP DIGITAL
DIGITAL ANT TRANSMITTER
Y PB R GND ACI N
COMPONENT VIDEO OUT FM ANT
75
SURR I/D SET

AC IN L R SURROU ND (3 6 )
6 5 2 1 SIDE SIDE AMBIOPHONIQUES
6 6 R 6 L FRO NT AV OUT
SUBWOOFER CENTER

AC power supply cord AC power supply cord


(included) (included)

To a househeld AC outlet To a househeld AC outlet


(AC 120V, 60Hz) (AC 120V, 60Hz)

Power consumption
The main unit and the wireless system consume a small amount of power when they are turned off (Main unit: approx. 0.3 W, wireless
system: approx. 0.2 W). To save power when they are not to be used for a long time, unplug them from the household AC outlet.
NOTE You will need to reset some memory items after plugging in the main unit.

The included AC power supply cords are for use with the main unit and wireless system only. Do not use them with other equipment.
Also, do not use cords for other equipment with the main unit or wireless system.

When the AC power supply cord is connected for the first time, "PLEASE WAIT" is displayed on the main unit’s display for about
30 seconds and power is turned off automatically.

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7.6.4. Setting up the unit

Turn on the main unit and wireless system


Turn on the power of the main unit and the wireless system after all connections are complete.

AUTO OPERATION ON/OFF Preparation


1 indicator Turn on the TV and select the appropriate video input on the TV.
VIDEO1
POWER AUTO OPERATION ON/OFF

1 Press [POWER , ] on the wireless


system.
AUTO OPERATION ON/OFF indicator lights red when the
wireless system is turned on and lights green when the wireless link is activated.
2 Press [POWER /I ] on the main unit.
Standby/on indicator ( ) goes out when the unit is turned on.
2 Standby/on indicator ( ) When the link between the main unit and the wireless system is e.g., W2S
activated, W2S or W4S is illuminated in the main unit s display.
SD SL
W2S

If W2S or W4S is flashing in the main unit s display, check that the digital transmitter
at the back of the main unit is inserted correctly.

7.7. Disc and SD Cards Information


7.7.1. Packaged Discs
The chart shows the different type of retail/commercial discs you can use, and also includes the industry-standard logos that should appear on
the discs and/or packaging.
Type of media/ Features Indicated as Type of media/ Features Indicated as
Logo Logo
BD-Video High Definition (HD) BD-V BD-Video High quality movie and DVD-V
movie and music discs music discs

Compact Discs (CD’s) that CD


contain audio and music
CD Operation and sound
quality of CDs that do
not conform to CD-DA
specifications (copy
control CDs, etc.)
cannot be guaranteed.

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7.7.2. Recorded Discs


This chart shows the different type of discs recorded with DVD recorders, DVD video cameras, personal computers, etc. that you can use.
Finalized This mark means you must finalize the disc with the DVD recorder, etc. before playback. For details about finalizing, refer to
the operating instructions for your equipment.
Type of media/ Features Indicated as Type of media/ Features Indicated as
Logo Logo

BD-RE Version 3 of the BD-V DVD-R DL DVD-Video Format DVD-V


BD-RE Recording Version 1.2 of the DVD DVD-VR
Format Finalized Video Recording
JPEG format JPEG Format
AVCHD format AVCHD
BD-R Version 2 of the BD-R BD-V
Recording Format

+R/+RW/+R DL +VR (+R/+RW Video DVD-V


Recording) Format
DVD-RAM Version 1.1 of the DVD DVD-VR Finalized AVCHD format AVCHD
Video Recording Format
JPEG CD-DA format CD
JPEG format CD-R/RW
AVCHD format AVCHD MP3 format JPEG
Finalized JPEG format JPEG
DVD-R/RW DVD-Video Format DVD-V
Version 1.1 of the DVD DVD-VR It may not be possible to play the above discs in some cases
Finalized Video Recording due to the type of discs, the condition of the recording, the
Format recording method and how the files were created.
AVCHD format AVCHD When a disc recorded in the AVCHD format is being played, the
video may be paused for a few seconds at portions spliced, due
to deletion or editing.

7.7.3. SD Cards
This chart shows the different type of cards recorded with Panasonic High Definition Video Camera or personal computers, etc. that you can use.
Type of media Features Indicated as
A miniSD Card and a microSD Card must be used with the
SD Memory Card * attached adaptor that comes with the card. ADAPTER

JPEG format JPEG


(from 8 MB to 2 GB) Useable memory is slightly less than the card capacity.
AVCHD AVCHD
SDHC Memory Card If the SD card is formatted on a PC, you may not be able to
(from 4 GB to 16 GB)
format
use it on this unit. In this case, format the card on this unit.
* Including miniSD Card and microS Card We recommend using a Panasonic SD card.
Keep the Memory Card out of reach of children to prevent
When using from 4 GB to 16 GB SD cards, only SD cards that
swallowing.
display the SDHC logo can be used.
When a card recorded in the AVCHD format is being played, the
This unit is compatible with SD Memory Cards that meet SD Card
video may be paused for a few seconds at portions spliced, due to
Specifications FAT12 and FAT16 formats, as well as SDHC Memory
deletion or edition.
Cards in FAT32 format.
Switch teh write-protect switch to the "LOCK" position to protect the
In these operating instructions, the cards shown in the table
content from accidental erasure.
are comprehensively called SD cards.

7.7.4. Regarding BD-Video

Enjoy Final Standard Profile functions such as picture-in-picture. The various functions differ depending on the disc.
When playing a set of two or more BD-Video discs, the menu screen may continue to display even if the disc has been ejected.
Dolby TrueHD, Dolby Digital Plus, DTS-HD Master Audio and DTS-HD Resolution Audio are output as Dolby Digital when "BD-Video
Secondary Audio" is set to "On".

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7.7.5. Note about using a DualDisc

The digital audio content side of DualDisc does not meet the technical specifications of the Compact Disc Digital Audio (CD-DA) format so play
may not be possible.

7.7.6. Tips for making MP3/JPEG Discs

File format MP3 JPEG


Playable media CD-R/RW *1 CD-R/RW *1 , DVD-RAM *2 , BD-RE *3 , SD card
Extension Files must have the extension ".mp3" or ".MP3". Files must have the extension .jpg or .JPG .
Picture resolution between 34k 34 and 5120k 3840 pixels
(sub sampling is 4:2:2 or 4:2:0)
Bit rates 32 kbps to 320 kbps
Sampling frequency 44.1 kHz/48 kHz
Reference ID3 tags: version 1, 2.2, 2.3, 2.4 MOTION JPEG: not supported
ID3 is a tag embedded in MP3 track to provide information SD card: JPEG conforming DCF *4 (Design rule for
about the track. Camera File system)
This unit supports the versions listed above but only titles Thawing Time: approx. 2 sec. (7M pixels)
and the names of artists can be displayed.
If there is a large amount of still picture data etc. within a
MP3 file, play may not be possible.
English alphabet and Arabic numerals are displayed correctly. Other characters may not be displayed correctly.
The display order on this unit may differ from how the order is displayed on a computer.
Depending on how you create the media (writing software), files and folders may not play in the order you numbered
them.
This unit is not compatible with packet-write format.
Depending on the recording conditions, the media may not play.
Operation may take time to complete when there are many files and/or folders and some files may not display or be
playable.
*3
*1 ISO9660 level 1 or 2 (except for extended formats), Joliet Discs must conform to UDF 2.5.
*4 Design rule for Camera File system: unified standard established
This unit is compatible with multi-session.
This unit is not compatible with packet writing. by Japan Electronics and Information Technology Industries
*2 Discs must conform to UDF 2.0. Association (JEITA).

Structure of MP3 and still pictures (JPEG) folders e.g., Root


You can play MP3 and still pictures (JPEG) with this unit by making folders on disc as shown P0000001.jpg
P0000002.jpg
( right).
Folder structure created on a DVD-RAM, BD-RE or an SD card is not displayed. 001 002 Folder

MP3 files and folders in CD-R/RW P0000003.jpg


P0000004.jpg
Prefix with 3-digit numbers in the order you want to play them. P0000005.jpg

Still pictures (JPEG) in CD-R/RW 003 Folder


Files inside a folder are displayed in the order they were updated or taken. 004 Folder P0000006.jpg
P0000007.jpg
When the highest level folders are DCIM folders, they are displayed first on the tree. P000000 8.jpg
P0000009.jpg
P0000010.jpg
Order of play P0000011.jpg
P0000012.jpg

7.7.7. Discs that cannot be played


BD-Video discs recorded at a rate of 50 frame per second DVD-Audio
BD-RE with the cartridge Video CD and SVCD
DVD-RAM that cannot be removed from their cartridges WMA discs
2.6 GB and 5.2 GB DVD-RAM DivX discs
3.95 GB and 4.7 GB DVD-R for Authoring PAL discs
Version 1.0 of DVD-RW HD DVD
+R 8 cm (3z), DVD-ROM, CD-ROM, CDV, SACD, Photo CD, Other discs that are not specifically supported
MV-Disc and PD

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SA-BT100P / SA-BT100PC

8 Operation Instructions
8.1. Taking out the Disc from BD/DVD Drive Unit when Disc cannot be
ejected by OPEN/CLOSE button
8.1.1. Forcible Disc Eject
8.1.1.1. When the power can be turned off.
1. Turn off the power and press [SKIP REV] and [PLAY] keys on the front panel simultaneously for 5 seconds.

8.1.1.2. When the power can not be turned off.


1. Press [POWER] key on the front panel for over 10 seconds to turn off the power forcibly, and press [SKIP FWD] and [PAUSE]
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8.1.2. When the Forcible Disc Eject can not be done.


1. Turn off the power and pull out AC cord.
2. Remove the Top Cover and BD/DVD Drive.
3. Insert Eject Pin (JZJ0484) into the hole on the bottom of BD/DVD Drive and slide the Eject Pin in the direction of the arrow to
eject tray slightly.

26

Downloaded from www.Manualslib.com manuals search engine


SA-BT100P / SA-BT100PC

9 Service Mode
9.1. Self-Diagnosis and Special Mode Setting
Self-Diagnosis Function provides information for error to service personnel by Self-Diagnosis Display when any error has occurred.
U**, H** and F** are stored in my memory and held.
• You can check latest error code by transmitting [0] [1] of Remote Control in Service Mode.
Automatic Display on FL will be cancelled when the power is turned off or AC input is turned off during self-diagnosis display
is ON.

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Downloaded from www.Manualslib.com manuals search engine


SA-BT100P / SA-BT100PC

9.1.1. Error Code Table 1


Error Code Diagnosis contents Description Monitor Display Automatic FL display
U30 Remote control code error Display appears when main unit and remote No display
controller codes are not matched.

* is remote controller code of the


main unit.
Display for 5 seconds.
U59 Abnormal inner temperature Display appears when the drive temperature No display
detected exceeds 70 C.
The power is turned off forcibly.
For 30 minutes after this, all key entries are
U59 is displayed for 30 minutes.
disabled. (Fan motor operates at the highest
speed for the first 5 minutes. For the remain-
ing 25 minutes, fan motor is also stopped.)
The event is saved in memory as well.
U71 HDMI incompatible error Display this error when the equipment (com- No display
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Hec Hms For Mac

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HEC-RAS (Hydrologic Engineering Centers River Analysis System) put out by the US Army Corps is a freely available software package used for hydraulic modeling of rivers. It is the primary software package used all over the nation for floodplain mapping related to FEMA and NFIP.It is also used for a lot of other work involving rivers such as designing bridges, culverts, river restoration.

Aug 05, 2020  Download HEC-HMS for free. HEC-HMS - The Hydrologic Modeling System (HEC-HMS) is designed to simulate the complete hydrologic processes of dendritic watershed systems. The software includes many traditional hydrologic analysis procedures such as event infiltration, unit hydrographs, and hydrologic routing.

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The Hydrologic Modeling System (HEC-HMS) is designed to simulate the precipitation-runoff processes of dendritic drainage basins. It is designed to be applicable in a wide range of geographic areas for solving the widest possible range of problems. This includes large river basin water supply and flood hydrology, and small urban or natural watershed runoff. Hydrographs produced by the program are used directly or in conjunction with other software for studies of water availability, urban drainage, flow forecasting, future urbanization impact, reservoirspillway design, flood damage reduction, floodplain regulation, and systems operation.

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HEC-HMS 4.6 is now available! The Hydrologic Modeling System (HEC-HMS) is designed to simulate the complete hydrologic processes of dendritic watershed systems. The software includes many traditional hydrologic analysis procedures such as event infiltration, unit hydrographs, and hydrologic routing. The Hydrologic Modeling System (HEC-HMS) is designed to simulate the complete hydrologic processes of dendritic watershed systems. The software includes many traditional hydrologic analysis procedures such as event infiltration, unit hydrographs, and hydrologic routing. 1) Create new HEC-HMS project and name it as Lab4 or any other name you would like to give. Save it in a new folder. Use some logical name for this new folder so you do not mix files from multiple labs. 2) Create a basin model to include one sub-basin with the following characteristics:. Area = 700 km1.2.

The program is a generalized modeling system capable of representing many different watersheds. A model of the watershed is constructed by separating the water cycle into manageable pieces and constructing boundaries around the watershed of interest. Any mass or energy flux in the cycle can then be represented with a mathematical model. In most cases, several model choices are available for representing each flux. Each mathematical model included in the program is suitable in different environments and under different conditions. Making the correct choice requires knowledge of the watershed, the goals of the hydrologic study, and engineering judgement.

HEC-HMS is a product of the Hydrologic Engineering Center within the U.S. Army Corps of Engineers. The program was developed beginning in 1992 as a replacement for HEC-1 which has long been considered a standard for hydrologic simulation. The new HEC-HMS provides almost all of the same simulation capabilities, but has modernized them with advances in numerical analysis that take advantage of the significantly faster desktop computers available today. It also includes a number of features that were not included in HEC-1, such as continuous simulation and grid cell surface hydrology. It also provides a graphical user interface to make it easier to use the software. The program is now widely used and accepted for many official purposes, such as floodway determinations[1] for the Federal Emergency Management Agency in the United States.

See also[edit]

References[edit]

Hec-hms Download For Mac

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^FEMA Approved Hydrology ModelsArchived 2008-09-16 at the Wayback Machine

External links[edit]

HEC-HMS Homepage at the Hydrologic Engineering Center

Retrieved from 'https://en.wikipedia.org/w/index.php?title=HEC-HMS&oldid=829136261'

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© (Macall B. Polay / HBO)Emilia Clarke appears in a scene from ‘Game of Thrones.’ (Macall B. Polay / HBO)

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Global SMT & Packaging July 2010 US edition

www.globalsmt.net

The Global Assembly Journal for SMT and Advanced Packaging Professionals

False top coatings of a counterfeit component revealed layer by layer Wafer-level solder sphere placement and its implications Steps toward closing the software quality gap

Volume 10 Number 7 July 2010 ISSN 1474 - 0893

David David Raby Raby Interview Interview Inside Inside NEW NEW PRODUCTS PRODUCTS INDUSTRY INDUSTRY NEWS NEWS INTERNATIONAL INTERNATIONAL DIARY DIARY



Contents

Volume 10, No. 7 July 2010

Global SMT &amp; Packaging is distributed by controlled circulation to qualified personnel. For all others, subscriptions are available at a cost of £181.50 for the current volume (twelve issues). No part of this publication may be reproduced, stored in a retrieval system, transmitted in any form or by any means electronic, mechanical, photocopying, recording or otherwise without prior written consent of the publisher. No responsibility is accepted for the accuracy of information contained in the text, illustrations or advertisements. The opinions expressed in the articles are not necessarily those of the editors or publisher. ISSN No. 1474-0893 © Trafalgar Publications Ltd Designed and Published by Trafalgar Publications Ltd, Bournemouth, United Kingdom Printed by Ovid Bell, Fulton, MO, USA.

Contents 2

Foxconn and the power of tier one EMS companies Trevor Galbraith

European edition

12

Technology Focus

10 False top coatings of a counterfeit component revealed layer by layer Art Ogg, World Micro 14 Wafer-level solder sphere placement and its implications Andrew Strandjord, Thomas Oppert, Thorsten Teutsch, and Ghassem Azdasht, PacTech—Packaging Technologies, Inc.

30

26 Steps toward closing the software quality gap Frederick R. Hume, Data I/O Corporation, and Mary Beth Soloy, Ford Motor Company Special Features

52

30 Interview—David Raby, STI Electronics 32 Show report: SMT/HYBRID/PACKAGING rises above the ashes

regular columns

4

Desoldering braid/solder wick Bob Willis

20 Strong global growth throughout supply chain Walt Custer and Jon Custer-Topai Other Regular Features

6 Industry News 36 SMT Answers 38 New Products

48 Association News 50 IMAPS Europe 52 International Diary

With Inovar’s Shop Floor Tracking, products are tracked from initial kit release until the completed assembly is moved into finished goods.

www.globalsmt.net

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 1


Editorial

Trevor Galbraith

Editorial Offices

Europe Global SMT &amp; Packaging Trafalgar Publications Ltd Unit 18, 2 Lansdowne Crescent Bournemouth Dorset BH1 1SA United Kingdom Tel: +44 (1202) 388997 E-mail: news@globalsmt.net Website: www.globalsmt.net United States Global SMT &amp; Packaging PO Box 7579 Naples, FL 34102, USA Tel: +1 (239) 245-9264 Fax: (239) 236-4682 E-mail: news@globalsmt.net China Global SMT &amp; Packaging Electronics Second Research Institute No.159, Hepin South Road Taiyuan City, PO Box 115, Shanxi, Province 030024, China Tel: +86 (351) 652 3813 Fax: +86 (351) 652 0409 Editor-in-Chief Trevor Galbraith Tel: +44 (0)20 8123 6704 (Europe) Tel: +1 (239) 245-9264 x101 (US) E-mail: editor@globalsmt.net Managing Editor Heather Lackey Tel: +1 (239) 245-9264 x105 E-mail: hglackey@globalsmt.net

Circulation &amp; Subscriptions Kelly Grimm Tel: +1 (239) 245-9264 x106 E-mail: subscriptions@globalsmt.net

Advertising

Global SMT &amp; Packaging offers effective print, web, email and video advertising opportunities. Contact your local sales rep today. Americas—Derek Laborie (print &amp; video) Tel: +1 (239) 245-9264 x102 Mobile: +1 (603) 661-5828 dlaborie@globalsmt.net Sandy Daneau (digital) Tel: +1 (239) 245-9264 x104 Cell: +1 (603)-686-3920 sdaneau@globalsmt.net Europe—Andy Kellard Tel: +44 7766 951665 akellard@globalsmt.net Asia/Pacific— Debasish P. Choudhury Tel: +91 120 6453260 dchoudhury@globalsmtindia.in Nitesh Madan +91-9818429457 nmadan@globalsmtindia.in Asia— Carol Chen tancarole@yahoo.com.tw

Editor-in-Chief

Foxconn and the power of tier one EMS companies There have been many column inches expounded on the recent suicides at Foxconn plants, particularly in their South China facility in Shenzhen. While these deaths are tragic, if you compare the number of suicides to the national average per capita, then the Foxconn deaths actually fall below the national average. This is not to say that working and living condition in a Foxconn plant are any great shakes, but the bigger story is the ramifications these sensationalist headlines produce. Not four months ago there was an incident in Juarez where some workers were wrongly told the bus was not available at the end of their shift to take them into town. When one suspicious worker walked outside to verify this and found they had been lied to, a small riot ensued and they started a bonfire at the end of one of the production lines. The negative press was quickly followed by an announcement from Foxconn corporate about their intention to revive attempts to build the industry’s first ‘lights-out” factory. The furor over the suicide jumpers produced another strong reaction from the world’s largest CEM. It started with announcement to double factory workers salaries to around $132 per month. This in itself was a little suspicious. According to the company, this will add 10-12% to the bottom line, but what about these razor thin profit margins of 2-3% we keep hearing about? Nevertheless, it was a generous response to a baying global public that was starting to impact on their biggest customer, Apple. Steve Jobs was duly dispatched to Shenzhen and did a less than convincing PR job. The next step by the EMS giant was more menacing—according

to recent reports, they are planning to move the majority of their manufacturing outside of China. Even to a country the size of China, this is a serious threat. 400,000 workers would be laid-off, making the difficult job the Chinese government has containing social unrest even harder. This reminded me of the time when Hungary applied for membership of the European Union. A condition of membership was to stop all the capital gains and other tax incentives they offered foreign companies for inward investment. At the time, the biggest reaction came from Flextronics who were the country’s biggest employer. They threatened to pullout if these rules were implemented and the country was forced to go back to the European Union and negotiate a more acceptable phase-out of these incentives over ten years. The power of tier one manufacturers should not be underestimated. Given the number of jobs (albeit low-paid and sometimes in less than desirable conditions), the taxes paid and the spending power of the employees back into the local economy, they make a significant contribution. Notwithstanding the strange number surrounding the recently announced wage hike in Southern China, tier one manufacturers perform a very necessary job in very demanding conditions. These conditions are not set by themselves, or even their customers, but by us, the consumer. The constant goal of smaller, faster, cheaper looks like it may finally be finding its lowest point. —Trevor Galbraith.

Correction: Dr. George Riley, author of the article “New Opportunities for Controlling Pressure in Flip Chip Assembly,” printed in our March issue, is employed by flipchips.com and not Sensor Products Inc.

2 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

www.globalsmt.net


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Title

Desoldering braid/solder wick

Bob Willis

Desoldering braid/ solder wick May be low tech but still vital in rework and repair areas

Figure 1. Manual desoldering using solder braid.

Solder wick or braid is supplied in two forms, tin plated or plain copper woven braid which is impregnated with flux. Today the bare copper option is the most popular and most often seen in production. The flux coating helps provide protection to the copper braid during storage and helps the solder wet the braid and capillary quickly during soldering. If is often seen in production that braid held in an operator’s toolbox does not have the same wicking or capillary action during desoldering. This is due to the copper braid ageing, so don’t lock it away or order a large stock to save money—new is best!! Also, don’t let braid supported with liquid flux become part of your standard shop floor operation!! Copper is the preferred braid as it is far easier to see soldering, or rather the desoldering action, taking place. The solder can be seen to wick up into the braid when new material is used along with the correct gauge. It also provides a simple guide to the solderability or the age of the braid being used.

Desoldering single-sided through hole joints with copper braid Solder braid is used in two main applications during assembly: • On conventional through hole boards for solder short removal and on single-sided, non-plated through hole boards for desoldering terminations. Heated vacuum desoldering systems, however, are the preferred method for professional desoldering of plated through hole boards • For the removal of solder from surface mount and area array pads after component removal or during solder short removal on SOIC or on other fine pitch components.

The basic method for using braid is as follows: Solder short removal on through hole and surface mount component terminations. Select a braid width the same size or slightly smaller than the short being removed. This allows the desoldering operation to be seen. It also reduces the heat input required to allow the solder to

4 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

reflow. Clean and tin the iron bit, making sure the bit is the correct size and temperature. Normally the tip temperature would be 600˚F for work on printed circuit boards. The size of the tip would be the same size as the braid width. Before desoldering, make sure the end of the braid is free from solder. The more braid and solder in contact will affect the time to reflow or the time required on the joint area for all the solder to be removed. Apply the braid onto the surface of the solder short and place the iron tip on to the braid. By tinning the bit the solder on the tip will speed up heat transfer to the braid and the whole desoldering operation. This is often where damage occurs, when operators do not tin the bit and try to speed up heat transfer by applying pressure to the braid that is not necessary. When the solder becomes a liquid, it will wet up the braid by capillary action, but also based on the type and age of the braid. After the solder short has been removed from the joint, check that the solder remaining on the adjacent joints

www.globalsmt.net


Desoldering braid/solder wick

Figure 2. Avoid having excess braid when desoldering on pads with a wide tip tool.

Figure 3. Avoid braid which has become unwoven.

meets your inspection standard. If it does not, resolder the terminations to meet the standard requirements

may be removed. If all leads have been correctly desoldered, no damage can occur on the pads.

Desoldering non-plated through hole joints Select a braid width the same size or slightly smaller than the solder joint being desoldered. This allows the desoldering operation to be seen it also reduces the heat input required to allow the solder to reflow. Clean and tin the bit on the iron making sure the bit is the correct size and temperature. Normally the tip temperature would be 600F for work on printed circuit boards. The size of the tip would be the same size as the braid width. Before desoldering make sure the end of the braid is free from solder. The more braid and solder in contact will either affect the time to reflow or the time required on the joint area for all the solder to be removed. Staff are often observed on the shop floor using a solder loaded braid tail several inches long before cutting the braid tail off. Apply the braid onto the surface of the solder joint and place the iron tip on to the braid. By tinning the bit, the solder on the tip will speed up heat transfer to the braid and the whole de-soldering operation. This is often where damage occurs, when operators do not tin the bit and instead try to speed up heat transfer by applying unnecessary pressure to the braid. It is relatively simple to see solder left between surface pads, normally referred to as sweat joints. After the solder has been removed from the joint, check that the leads of the component are free from the pads and that no damage is visible on the pads. Using tweezers or snip-nose pliers should allow the leads to move freely in the hole. When all leads have been checked the component

Solder removal from surface mount pads In the first place, only remove solder from surface mount pads when it is really necessary. In most cases it is not. It is, however, for many fine pitch and all BGA applications due to the difficulty of replacing the new components or printing paste onto the repair site. Select a braid width the same size or slightly smaller than the pad being reworked. This allows the desoldering operation to be seen; it also reduces the heat input required to allow the solder to reflow. Clean and tin the bit on the iron ensuring the bit is the correct size and temperature. Normally the tip temperature would be 600˚F for work on printed circuit boards. The size of the tip would be the same as the braid width or slightly smaller. Before desoldering, ensure the end of the braid is free from solder. The more braid and solder11—Underfill in contact withreservoir the pad will affect the time to reflow or the time required on the pad area during solder removal. Try and avoid having excess braid when desoldering on pads with a wide tip tool, as shown in Figure 2. It requires more heat/time. Also avoid braid which has become unwoven as shown in Figure 3. Cut the damaged braid and start again— the capillary action will be faster during desoldering. Apply the braid onto the surface of the pad and place the iron tip on to the braid. By tinning the bit, the solder on the tip will speed up heat transfer to the braid and the whole de-soldering operation.

www.globalsmt.net

This is often where damage occurs, when operators do not tin the bit and instead try to speed up heat transfer by applying unnecessary pressure to the braid. As the braid and solder are directly in contact with the pad, more care needs to be taken during this operation. It is perfectly feasible to desolder pads in this manner provided care is taken and no pressure is applied to the pads. It is not the heat which lifts or misplaces pads, it is the combination of heat and pressure. You can hold the solder on the pad in a liquid for a number of seconds without damage to the bond. If you apply pressure during this stage the pad is lifted. This is due to the bond between the copper and the laminate becoming weak. Remove the heat, and within a minute the original strength of the bond is retained. Remember not to leave pads with no or very little solder on for weeks after desoldering as the pad solderability will deteriorate. In the case of nickel gold plated boards after desoldering, the nickel could be exposed. This will become unsolderable in a matter of days. The most important things to remember: • Use the right size of braid • Use new copper braid • Don’t apply pressure with your iron • Practice makes perfect in everything you do!!!! Bob Willis is a process engineer providing engineering support in conventional and surface mount assembly processes.He runs production lines for suppliers at exhibitions and also provides seminar and workshops world wide. Bob will be presenting Master Classes at SMT Nurenberg in Germany for those engineers visiting the show. For further information on how Bob may be able to support your staff contact him via his web site, bobwillis.co.uk.

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 5


Basic printed Industry Newsboard repair and rework for copper tracks and pads, part 2

Industry News OSEO assigns € 9.9 million in support to the CUIVRE project OSEO has assigned an overall support package of € 9.9 million for the realization of a collaborative project called CUIVRE (French for copper). This three-year project will allow a simplification and shortening of the metallization steps in the microelectronics fabrication cycle whilst at the same time improving the electrical performance. The CUIVRE project, certified by the Minalogic Competitive Cluster, aims to provide the microelectronics industry with further development of an innovative process for the deposition of copper patterns on wafers (ECPR). This process, developed by Replisaurus Technologies, uses an electrochemical-based metallization technique providing a simpler way to apply copper interconnect patterns and certain types of components whilst at the same time ensuring better form factors and increased geometrical accuracy. This innovative and environmentally-friendly technology represents a direct response to changes in the semiconductor market needs thanks to the uniformity of the deposited pattern and a reduction of the costs, the number and the complexity of the traditional wafer metallization and processing steps. The goal of the research program is to demonstrate stable process performance and industrial applicability by effectively integrating it into an actual fabrication flow. Etek Europe launches second user division—Etek Used SMT

Etek Europe Ltd launched a new division to the growing business—Etek Used SMT. Etek Used SMT has been launched to provide quality, second user SMT equipment to the global electronic manufacturing industry, allowing customers the opportunity to purchase second user, but still retain the peace of mind that every piece of euipment has been serviced by an Etek engineer. Etek Used SMT also provides ex-demo equipment for sale, all of which are available with the unique Etek Warranty to give complete peace of mind, guaranteed to operate and perform consistently. www.etekusedsmt.com VERMES Technik is now VERMES Microdispensing GmbH VERMES Technik, the manufacturer of fast piezoelectric dispensing valves, has been spun out of the Woellner Group and

turned into VERMES Microdispensing GmbH. The two new stockholders are Essemtec and Promess. VERMES focuses on fast, highly accurate micro dispensing valves. VERMES’ valves for the MDS 3000 series are well known in many industries such as biology and pharmaceutics, medical technology, chemistry and food technology, mechanical construction, precision engineering automotive, and electronics. Because of its excellent properties the company is the preferred choice for LED and LCD production lines, especially in Asia. The valves can dispense all media from low to high viscosity, and are especially well suited for abrasive and filled media. www.vermes.de Juki selects Microscan’s machine vision solution for its JX series placement systems Juki Automation Systems has integrated Microscan’s Visionscape® machine vision solution into the JX-100 placement systems. Microscan’s machine vision solution, including Visionscape® software, application-specific software for part placement, NERLITE® lighting, and custom electronics and mechanics, allows the JX-100 to place BGAs, microBGAs, fine-pitch QFPs and other leaded devices down to 15 mil pitch. This, in turn, allows Juki customers to purchase a highperformance, cost effective pick-and-place machine. For more information regarding the

6 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

advantages of electronics manufacturing solutions, traceability and cost savings, view a recent interview with Bob Black, Microscan President Jeff Timms, and Global SMT &amp; Packaging Magazine at http://www.microscan.com/en-us/ TrainingAndResources/Videos/ ApexExpo2010JeffTimmsInterview.aspx. Vi TECHNOLOGY welcomes Koen Gutscoven as worldwide sales VP Vi TECHNOLOGY is pleased to welcome Koen Gutscoven as worldwide sales vicepresident to head up Vi TECHNOLOGY worldwide sales activities. Koen joined ICOS Vision Systems in 1994 as sales manager Asia, and was promoted in 1999 to VP marketing &amp; sales of automatic vision and inspection systems to the semiconductor final assembly industry, where he knows all key players. He was responsible for the Americas, South East Asia, Japan, Korea, China, Hong Kong, Taiwan, Philippines and Europe, including customer application support and internal sales administration. www.vitechnology.com GEM Expo attracts leading names in SMT industry Trafalgar Publications Ltd. announces that many of the biggest names in the SMT industry will be participating in GEM Expo 2010, scheduled to take place October 5-7, 2010 at Expo Center Norte in São Paulo, Brazil. Major companies such as FUJI, Juki, Panasonic, Asymtek, BTU International, MIRAE, Aqueous Technologies, KIC and many more have confirmed their attendance at Brazil’s first dedicated EMS manufacturing event. The show is also supported by all of the key distributors in the region including Hi-Tech, PSP, Celtra, SMA and others. The show will feature IPC Training courses, a series of workshops by international experts and a comprehensive vendor conference. www.gemexpobrazil.com Fabrico and Henkel partner to provide Loctite® bonding, joining &amp; sealing solutions Fabrico is working with Henkel to offer custom, high-performance Loctite® solutions for liquid adhesives for a

www.globalsmt.net


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www.globalsmt.net

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 7


Industry News

variety of applications, including coating, gasketing, and potting. The two companies blend Fabrico applications and converting expertise with Loctite high-value products to provide customers with exceptional bonding, joining, fastening, and assembly solutions. www.fabrico.com, www.henkel.com SEHO Academy to provides efficient training, higher knowledge, added value and reduced costs SEHO Systems GmbH introduces the SEHO Academy, an innovative, flexible training concept. By investing in the professional development of its staff, every company can achieve added value and reduce its production costs sustainably. It always is worthwhile to train employees in the professional operation of soldering systems, and the SEHO Academy was developed to help companies do this. SEHO’s training concept, designed to provide employees with required qualifications, delivers optimal performance in practice. Customers can select one or several training blocks from the existing courses to best suit their individual needs. The seminars are subdivided into three categories: REFLOW, SELECTIVE and WAVE. Each category offers both basic training courses on maintenance of soldering systems as well as optimization of processes and workflow. www.seho.de JJS Electronics extends EMS capabilities UK and Czech Republic-based JJS Electronics has extended its EMS capabilities even further with the appointment of Richard Barratt to the new post of principal NPI engineer. Joining the company as part of the ongoing expansion taking place at its state-of-theart Lutterworth facility following recent growth, the new recruit brings with him extensive new product introduction experience. www.jjselectronics.com Aqueous Technologies sells several machines during IPC APEX Expo Accurex Solutions Pvt. Ltd. of Bangalore, India has purchased the Trident III automatic defluxing and cleanliness testing system. Accurex provides complete engineering services that ensure that both system hardware and software are capable of

performing all testing functions required by customer specifications and test requirements documents. The Trident III will help Accurex evaluate its customers’ test requirements and develop efficient test strategies. Advance Circuit Technology of Rochester, NY, also purchased a Trident III. The Trident III will join contract electronics manufacturer ACT’s impressive repertoire of manufacturing solutions that work together to exceed customer requirements. Finally, Consysis of San Diego, CA, purchased a Zero-Ion g3 ionic contamination (cleanliness) tester. www.aqueoustech.com DYMAX earns export achievement certificate

DYMAX Corporation was recognized by the U.S. Department of Commerce for its innovation and exportation to foreign companies. DYMAX officers were presented the chamber’s Export Achievement Certificate at company headquarters in Torrington, CT, in April. The award recognizes companies that have shown growth in exports, remained in good financial standing, and demonstrated a willingness to talk with other businesses about expanding their export market. Foreign exports are driving DYMAX’s growth and most of the company’s manufacturing and research and development jobs are related to their exports. www.dymax.com DRAM growth approaches record territory, setting stage for best year ever How hot was the DRAM market in the first quarter? So hot that during the first three months of 2010, global DRAM sales exceeded the total for the initial six months of 2009. So hot that the first quarter delivered the third highest quarterly DRAM revenue seen during the past 11 years. So hot that DRAM pricing actually rose in the first quarter compared

8 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

to the fourth quarter of 2009, defying the normal double-digit seasonal decline. Worldwide DRAM revenue in the first quarter of 2010 neared $9.5 billion, up 9.7 percent from $8.7 billion from the fourth quarter of 2009, and up a stunning 181.6 percent from $3.4 billion in the first quarter of 2009. Second-half demand also promises to be even more robust than in the first half as supply growth for the year will not be able to significantly exceed the expansion in demand. www.isuppli.com Televés invests in innovative SIPLACE line The Spanish company Televés S.A., a market leader in radio and TV installation solutions, has been at the forefront of innovations since its foundation in 1958. One of Televés’ main success factors is the 25 years of close cooperation with Siemens Electronics Assembly Systems (SEAS). In order to be prepared for further innovations and growing product demands, Televés invested once again in a new SMT production line consisting of the latest SIPLACE SX2 and SIPLACE CA (chip assembly) machines. With the new SIPLACE line Televes acquired the potential to cover all future requirements with optimum flexibility combined with bare-die and classic component processing. www.siplace.com Rutronik awarded ESD and Dry Pack certifications Rutronik Elektronische Bauelemente GmbH’s systematic implementation of its quality management has currently been confirmed by a further two certificates: The Electrostatic Discharge (ESD) Protective Measure certification ensures Rutronik’s customers will not receive any components damaged in advance by electrostatic discharge. The Dry Pack Packaging System certificate confirms that Rutronik repackages all moisture-sensitive components solely in accordance with the internationally-approved standards (J-STD 033B.1, J-STD 020D and JEP 113-B). www.rutronik.com

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Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 9


False top coatings of a counterfeit component revealed layer by layer

False top coatings of a counterfeit component revealed layer by layer

Art Ogg, World Micro, Roswell, Georgia, USA Much has been written about the curse of counterfeit electronic components having such a compounding effect on the security and economy of the United States. This paper will demonstrate one of the techniques used by those responsible for polluting the open market inventories of the world with counterfeit components. This sample of a counterfeit component and the photos shown are examples of a real inspection rejection event that successfully detected what could have been a tragic failure in an aerospace, military or mission critical system somewhere in the world. It is the intent of this paper to share the knowledge and experience it took to detect this counterfeit component, with the hope that every organization may benefit from this information.

Introduction The general inspection processes employed to detect the fraudulent examples shown below are contained in the current IDEASTD-1010 inspection standard published by the Independent Distributors of Electronics. See their website at WWW. IDofEA.ORG. The experience of the individual quality inspector can be measurably enhanced by participating in the Professional Inspector Certification Program, also conducted by the IDEA. This effective program of training quality inspectors is known as the IDEA-ICE-3000 Exam.

The suspicious top surface topography was compared to the bottom surface. The bottom surface displayed the typical small and grainy topography of a factory fresh component (Figure 2).

Counterfeit example This is a study conducted on Maxim part number MAX154XXXX. This component is characterized as an ADC single semi flash, 400KSPS 8-bit parallel, 24 pin SOIC component.

Visual inspection #3 During the visual inspection, what appeared to be a false top coating that did not belong on this component was noted. The top and sides were observed under 40X power microscopy to confirm there was indeed a layer that did not come from the factory. In Figure 3, the false top coating is captured in the red highlighted box. The photo is taken from the side of the component looking over the top of the part.

Visual inspection #1 Using the IDEA-STD-1010 visual inspection standard, these components were subjected to the multipoint inspection process. It was immediately noticed that the top surface was very shiny and the texture was smooth. Additionally, the topography of factory fresh components has a small textured surface compared with the somewhat larger texture exhibited by these parts (Figure 1).

Visual inspection #2 As noted above, the top surface had a very smooth and shiny surface. Each of the components in this lot were inspected and found to be equally shiny and smooth. A highly reflective surface on an electronic component is not normally what an inspector would expect to see under examination.

Visual inspection #4 The leads on this component were also given a thorough visual inspection under high-powered microcopy. There were no traces of alteration or counterfeiting

Keywords: Counterfeit Detection, IDEA-STD-1010

Figure 1. Top surface of modified part.

10 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

Figure 2. Bottom surface of modified part.

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False top coatings of a counterfeit component revealed layer by layer

Figure 3. False top known as blacktopping.

activity detected. This will be an important data point in the conclusion of this paper. See Figure 4 to observe that there are no issues of lead coplanarity, corrosion or retinning that may have been the result if subjected to a rework process. Date code comparison Maxim components will routinely have a component date code on both the top and the bottom surfaces. Not all manufacturers take this manufacturing step, but Maxim is one. Notice in Figure 1, the last line has the date code of 9812. This tells the inspector the component was allegedly manufactured during the twelfth (12th) week of 1998. However, notice the date code on the bottom of this component in Figure 2. The bottom line has a date code of 9609. Occasionally a certified inspector will see a variation between the two date codes on a Maxim part of one or maybe even two weeks. Any variance over two weeks is a variance that needs further explanation. This is a very big “red flag” to an inspector. In this case, the markings tell us that the bottom section of this component was manufactured two years and three weeks prior to the top portion being attached. This is impossible and will never happen. The overconfident counterfeiter has made the assumption that the inspector will not compare the top and bottom date codes and reject the lot based upon the lengthy variations in dates. They will also assume that most facilities have no inspection procedure at all and the parts will be received and shipped without anyone taking a look for component flaws such as these.

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Figure 4. Component leads pass inspection.

Resistance to solvents The experienced professional inspector has learned that, in most cases, a mixture of three parts mineral spirits and one part alcohol will remove the ink from a counterfeited component. The reason this happens is the counterfeiter will seldom cure the ink like the original component manufacturer (OCM) does during their production runs. The process where this solution is used to test the ink is known as the “Marker Permanency Test” and is documented in MIL-STD-883. This solution and test procedure was administered to a sample of the components. The results were negative. This is another important data point to be discussed in the conclusion. The experienced professional inspector has also learned that pure acetone will typically remove a false top coating placed on a component. An acetone wash was administered to the top surface of this component with negative results. Component measurements The experienced inspector has been trained to download the component’s datasheet from the Internet. This document has several very important tables, drawings and explanations about the component. One of the more important data points contained in the datasheet is the measurements. In the case of this particular Maxim component, the thickness has a specification of between 1.73 mm and 1.99 mm. A random sample of five parts was taken from the lot and measured. The average thickness between these five parts was 2.36 mm. This resulted in +.63 mm above the shallowest

measurement of 1.73 mm (36%) and +.37 mm (19% out of specification) thicker than the high end of the thickness specification. These components were far above the allowable thickness of acceptability. This will weigh heavily in the preliminary conclusions and how to proceed with proving these parts to be counterfeit. Preliminary conclusions Acceptable inspection findings 1. The texture and topography of the bottom surface is consistent with a factory fresh part. 2. The component leads remain untouched and are in pristine shape. 3. The components are not affected by the normal solvents used to validate if parts are indeed counterfeit.

Unacceptable findings 1. The parts have an untypical shiny reflective top surface. 2. The top surface topography is not consistent with a factory fresh component. 3. High power microscopy shows the addition of a false top coat on the top surface. 4. There is a two-year variance between the top surface date code and the bottom surface date code. This should never happen to a part coming from the factory. 5. The thickness specification has been exceeded by 19% above the high end of the thickness specification. At this point, when the unacceptable findings of this inspection are weighed against the acceptable findings, there is more than enough evidence detected thus far to reject these components due to

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 11


False top coatings of a counterfeit component revealed layer by layer

Figure 5. Clear epoxy top coat material.

quality issues. The inspector has now applied most of the thorough inspection protocols found in the IDEA-STD-1010 inspection standard. The parts could be rightfully rejected at this point. In an attempt to learn more about the techniques being used by this counterfeiter, the decision was made to proceed further. The goal was to reconstruct the steps the

Figure 7. Original component surface.

Figure 6. Clear epoxy removed.

counterfeiter must have taken to produce the modified parts shown in this report Removal of the clear and shiny top coating The use of the solvents normally used to remove false top coats and uncured ink stampings resulted in failure. Apparently, the counterfeiter has used a process to prevent their use in testing parts for uncured ink stampings. The second attempt to remove the clear top coating also resulted in failure. A razor blade was used to scrape the coating from the top. This step caused more material to be removed than was desired. The decision was made to discontinue this procedure. A piece of the clear coating that was removed from the top appears in Figure 5. The piece, shown in this photo, is estimated to be one-fifth the size of a period used in this report. Under very high-powered

Figure 8. Layers of counterfeiting rework.

microscopy (300X), it was established that the thin clear top coating is actually just partially clear. The top layer of the false coating directly below the clear coat can be easily observed. Apparently, over time the clear epoxy coating has absorbed some quantity of the material used in the false top coat directly below it. It has become dark in color as shown in Figure 5. Small pieces of 3M 401Q Imperial™ Wetordry™ 2,000 grit sandpaper was applied to one side of the component as shown in Figure 6. ESD tape was applied to the left side of this component to protect it from the abrasive qualities of the sanding. The right side was slowly abraded until the clear top coating was removed. The sanding process continued until the part markings were still visible on the right side, but all of the highly reflective material had been removed. All that remains in this photo on the right side depicts the beginning of the false top coat. A calibrated caliper was used to measure the thickness of the component to the right of the red line. The thickness of the clear coating was determined to be .05 mm thick. The component was further abraded to remove the entire thickness of the false top coat applied to this part. The same process and sandpaper used to remove the clear epoxy was also used to remove the false top coating. Once the entire false top coating had been removed, the component thickness was once again measured with the calipers. The component was now back to its original thickness and measured 1.86 mm, placing it well within the 1.73 mm-1.99 mm specification. Figure 7 shows the original component

12 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

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False top coatings of a counterfeit DL Trade Ad 4_9:Layout 1 5/1/09 3:49 PM component Page 1 revealed layer by layer

surface the component would have had when it left the factory. At this point the part has had all of the material placed on it by the counterfeiters to conceal the true identity of the part. Important items to notice Figure 7 shows the original top surface and markings as it came from the factory. Notice the original P/N was MAX154ACWG and the date code was 9609, shown on the bottom line. Figure 1 shows this same part at the beginning of this investigation prior to any testing or chemical analysis being conducted. Notice the new P/N placed on the part by the counterfeiters is MAX154BEWG and the date code is 9812. The original date code on the part is two years and three weeks older than the newer date code placed on the false top coat. The original P/N has a suffix of “ACWG,” meaning it had an operating temperature of (0˚C to + 70˚C). The second P/N placed on the part has a suffix of “BEWG,” meaning it had an operating temperature of (-40˚C to +80˚C). Figure 8 illustrates the layers of rework that were done on the counterfeit component. Layer 1 is the original component measuring 1.86 mm thick with the original part number ink stamped showing MAX154ACWG. Layer 2 shows the original part number and the original date code of 9609. Layer 3 is a .45 mm thick false black topping placed on the top to hide the original P/N. It was made from a material that would not dissolve in acetone. This is very unusual since most false coatings will wash away using this solvent. Layer 4 is the new part number of MAX154BEWG and a new date code of 9812. Layer 5 is the clear coating of epoxy that is .04 mm thick. Epoxy is a material that is not affected by an acetone wash. It was placed there to prevent failure of the marker permanency test used by a certified inspector. Overall conclusions The workmanship on these parts is exceptional. The materials used, the clear epoxy top coating and the black topping placed over the original top surface were chosen to prevent detection by the usual marker permanency test and the use of acetone for testing false top coatings. An inexperienced inspector may not have detected these reworked parts. The

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visual attributes that gave them away were that the top surface topography did not match the bottom surface, the clear coating was shiny and reflective, and the date code on the top did not match the one on the bottom. The ultimate proof, however, was the remarked part number that was for a part that can operate in a much wider temperature range, meaning it is more expensive, and that the original date of the part was two years younger than the remarked date code. By definition, this is a

reworked part. Art Ogg, World Micro’s director of quality, is responsible for World Micro’s quality initiatives, product quality, ISO certifications, technical documentation and quality team. Prior to joining World Micro, Mr. Ogg held senior management positions with Seagate Technology and Digital Equipment Corporation. He brings 40 years of high tech electronics experience to his position, and is noted expert and regular speaker at industry trade events.

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 13


Wafer-level solder sphere placement and its implications

Wafer-level solder sphere placement and its implications

Andrew Strandjord, Thomas Oppert, Thorsten Teutsch, and Ghassem Azdasht, PacTech—Packaging Technologies, Inc., Nauen, Germany There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing, electroplating, or sphere dropping1. The choice between these technologies is highly influenced by the following criteria: the bump size &amp; pitch requirements, cost and overall yield. As the bumping industry evolves, many of the deficiencies and trade-offs associated with the three bumping technologies are no longer acceptable. As a consequence, a significant transition is occurring toward a fourth bumping alternative: solder sphere placement2. This technique offers wide flexibility in bump size (40760 µm), very high bump yields (&gt;&gt;99%) and low cost (sphere price dominated). Keywords: Solder Bumping, Solder Sphere, Ball Placement, Sphere Transfer, Flip Chip, WLCSP

Figure 1. Ultra-SB2™ solder sphere placement tool.

Introduction Solder bumping is often separated into several different categories: flip chip bumping (FC), wafer level chip scale packaging (WLCSP) and ball grid array (BGA). This categorization and affiliated nomenclature is partially based on the solder bump size and the type of equipment used to create the bump. Pushing the limits of each of the three traditional bumping technologies has allowed some overlap between these bumping classifications. But for the most part, volume manufacturing of flip chip, WLCSP, and BGA bumps are carried out using different processes steps on different types of equipment. Solder sphere placement is a technique that has been

shown to completely bridge this technology gap. The basic principle of this technology is to simultaneously pick up preformed solder spheres using a patterned vacuum plate and then accurately place them onto the bond pads of the wafer. The solder sphere placement technique allows a single technology to be used for an array of different bumping applications. These include: • All wafer sizes from 100 to 300 mm and fan-out substrates • All solder alloys (lead based, lead-free, polymer core) • FC, WLCSP, and BGA bump sizes (60760 μm spheres) This up-and-coming technology has been associated with several different names in the literature. These include: gang ball placement, solder ball transfer, wafer level solder sphere transfer, ultra solder ball bumping, and solder sphere placement. The versatility of this technology can be further enhanced by coupling several other technologies into the solder sphere placement system. These include adding: 2D inspection capabilities, single sphere removal and replacement capabilities (repair and rework), and in-situ solder reflow (inert atmosphere hotplate). The ultimate solder sphere placement system incorporates all of these discrete technologies into a single tool in order to increase versatility and assure high yields.

Figure 2. Solder sphere reservoir filled with solder spheres.

14 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

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Wafer-level solder sphere placement and its implications

allowed the technique of solder sphere placement to expand within the industry. Typical lead-free spheres (SAC alloys) range in price between $25-50 per million when purchased in volume. As the volume of sphere consumption continues to increase, the cost will continue to come down. Spheres of other alloys, including polymer core and copper core spheres, are also starting to become more prevalent within the industry as alternatives to SAC alloys. Figure 3. Sphere placement head positioned over the solder sphere reservoir.

Figure 4. Sphere placement head lowered onto sphere reservoir. Vacuum and ultrasonics applied to reservoir.

Figure 5. Shear placement head with solder spheres passing over deionizing air knife to remove any excess spheres.

Figure 6. A pre-fluxed wafer is automatically placed onto the vacuum wafer chuck.

The final configuration of the tool is often dictated by the product distribution (flip chip vs WLCSP vs BGA volumes). Wafers or substrates for WLCSP and BGA applications have relatively large solder bumps and have relatively few interconnects compared to flip chip applications. These larger spheres are placed in extremely high yields by the solder sphere placement tool and the

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added expense of incorporating inspection and rework capabilities might not be justified. High I/O flip chip applications, on the other hand, often require very high bump yields in order to achieve high die yields. In these applications, integration of all the options makes good economical and throughput sense. The recent availability of highly uniform solder spheres at lower costs has

Process flow A predetermined number of spheres are automatically dispensed into a sphere reservoir (Figure 2). The amount of spheres in this reservoir is important in order to achieve high transfer yields. This value is approximately 20-30% more than the number of I/O on the wafer. The fixture which picks up the spheres consists of two main components: a vacuum head which is mounted to a high precision x-y-z translation stage and a tooling plate which contains small holes that is mechanically mounted to the vacuum head (Figure 3). The tooling plate is patterned with openings that correspond directly with the locations of the I/O pads on the wafer. This tooling is created using similar methods to that of making a nickel-plated surface-mount stencil. There are a large number of vendors who can now manufacture these stencils using electroforming techniques. The size of openings in the tooling plate is designed to be slightly smaller than the size of spheres that will be placed onto the wafer. The sphere placement head is then lowered onto the sphere reservoir and the vacuum is applied to the vacuum port (Figure 4). The vacuum alone is not sufficient to efficiently transport and relocate the solder spheres into each opening in the stencil template. The application of ultrasonics is applied to the reservoir to aid in sphere movement. Optimization of the ultrasonic amplitude and frequency, in addition to the vacuum, is required for each spheres size and I/O density in order to maximize sphere relocation to the template. Even with this optimization, an unwanted sphere can occasionally adhere to the stencil. This is commonly a result of static electricity. Removal of these extra spheres is accomplished passing the head over a deionizing air knife (Figure 5). The placement head is then moved over to the transfer station within the tool. A prefluxed wafer has been pre-positioned from a wafer cassette onto the

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Wafer-level solder sphere placement and its implications

Figure 7. Optical sensor extended between the wafer and placement head. Aligning the template to the wafer and also inspecting for missing or unwanted spheres.

Figure 8. Tooling head lowered on wafer to bring spheres into contact with the fluxed wafer pads.

Figure 9. Raise placement head and insert optical sensor over wafer.

Figure 10. SB2 repair head positioned over a pad with a missing solder bump.

vacuum chuck at this station (Figure 6). The application of tacky flux is applied in a separate tool prior to being loaded into the sphere placement tool. For WLCSP and BGA applications, screen-printing or stencil printing are used to apply this flux.

For flip chip applications, spin coating is used to apply the flux. The important criteria for all applications include flux thickness and viscosity. The solder transfer head is then moved over the wafer chuck and a bidirectional

16 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

optical sensor is extended in between the head and the chuck (Figure 7). This inspection system allows the spheres within the apertures of the stencil template to be aligned to the bond pads on the wafer. In addition to alignment, this sensor performs a 2D scan of the stencil template to confirm that all apertures contain a solder sphere and also inspects for unwanted stray spheres that may still be attached to the template. The tool software can then make a decision based on user criteria to continue to the transfer step, return further cleaning at the air knife station, or go completely back to the sphere pickup station to fill in empty apertures with spheres. The solder placement head is then lowered toward the wafer until the solder spheres penetrate the flux and touch the wafer bond pads (Figure 8). The mechanical downward force is adjusted to help drive the spheres onto the pads. The vacuum is then released and a N2 back pressure is applied to the placement head to assist in releasing the spheres. The head is then raised and the optical inspection sensor is reinserted over the wafer, and the wafer is scanned to quantify transfer yields (Figure 9). This scan will document the x-y coordinates of any missing or misplaced spheres that may have moved after the transfer process. For flip chip applications, where high bump yields are an absolute requirement to give high die yields, integration of rework/repair capabilities is critical. It is common for high-end applications, such as microprocessors, to have hundreds of interconnects per die. Even small bump yield losses can translate into high die yield losses. A repair head, which is based on the SB2 ™ sphere bumping process3, is used to repair any defects identified in the 2D inspection (Figure 10). For missing bumps, a sphere is dropped onto the pad where the bump is missing. This process has no mechanical contact with the wafer and solder bumps are deposited at a rate of 6-10 spheres per second. For misplaced or damaged spheres, the capillary head of the SB2 tool is lowered over the sphere, the capillary heated, and a vacuum is applied to the tube, which removes the sphere. In both cases a laser pulse can be added to help liquify the flux or melt the solder sphere. The wafer is then ready for final reflow. For most WLCSP and BGA devices the wafers are placed back into the wafer cassette. Once all 25 wafers are bumped, the cassette is moved over to a linear

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SEM

IC We ON s #91 t 1


Wafer-level solder sphere placement and its implications

conduction oven for reflow. Alternatively the wafers can be moved over to a reflow chamber located within in the tool (Figure 11). This is more common for fine pitch flip chip devices. After reflow, the wafers are placed back into the process cassette and cleaned in a batch process using a combination of ultrasonics, solvents and water rinsing (Figure 12). Conclusions The wafer level solder sphere placement tool can perform flip chip, WLCSP, and BGA bumping operations (Figure 13). The configuration of the tool is dictated by the product distribution (Tables 1 and 2). Defects in the ppm range result in die yields greater than 99%. Wafer throughputs are between 20-45 wafers per hour. Acknowledgements The authors would like to thank all the engineers and technicians of PacTech for their help in developing the solder sphere placement technology. References 1. D. S. Patterson, P. Elenius, and J. Leal, “Wafer Bumping Technologies – A comparative analysis of Solder Deposition Processes and Assembly Considerations”, EEP Vol. 19-1, Advances in Electronic Packaging, Hawaii, 1997, pp. 337-351.

M. Whitmore, M. Staddon, D. Manessis: “Development of a Low Cost Wafer-Level Bumping Technique”, International Wafer-Level Packaging Conference, 2004.

Figure 11. Solder bumps reflowed on heated vacuum chuck.

Figure 12. Bumped, reflowed and cleaned wafer.

Process Step

Equipment

Process Step

Equipment

1. Flux deposition

Stencil or screen printer

1. Fluxing

Spin coating

2. Sphere transfer

Basic solder sphere placement

2a. Sphere transfer

Integrated solder sphere placement tool

3. Reflow

Linear oven

4. Wafer clean

Solvent and/or DI water tools

d. Hot plate reflow

5. Inspection

2D scanner

3. Wafer clean

Table 1. Process steps for WLCSP and BGA applications.

b. 2D inspection c. Rework

Solvent and/or DI water

Table 2. Process steps for flip chip applications.

J. Ling, T. Strothmann, D. Stepniak, P. Elanius, “Flex-On-Cap Solder Bump for 300mm Wafer”, Semicon, Singapore, 2001. T. Flynn, C.W. Argento, and J.Obrien, “Electro-plated flip chip Wafer Bumping Interconnect Technology Solutions for the 21st Century”, Proceedings of International Symposium on Microelectronics, Chicago, Illinois, October 26-28, 1999, pp. 8-12. 2. K. Tatsumi, K. Shimokawa, E. Hashino, Y. Ohzeki, T. Nakamori, and M.Tanaka, “Micro-Ball Bumping Technology for flip chip”, The International Journal of Microcircuits and Electronic Packaging, Volume

Figure 13. SEM image of 60 μm flip chip bumps and 300 μm WLCSP solder bumps.

22, Number 2, Second Quarter 1999 (ISSN 1063-1674), pp.127-136. Andrew Strandjord, Thorsten Teutsch, Axel Scheffler, Thomas Oppert, Ghassem Azdasht, and Elke Zakel, “WLCSP Production Using Electroless Ni/Au Plating and Wafer Level Solder Sphere Transfer Technology”, IWLPC, San Jose, CA, October 14th, 2008.

18 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

Andrew Strandjord “Solder Ball Transfer for flip chip and WLCSP”, Advanced Packaging, March 19, 2008. 3. P . Kasulke, W. Schmidt, L. Titerle, H. Bohnaker, T. Oppert, E. Zakel, “Solder Ball Bumper SB2-A flexible manufacturing tool for 3-dimensional sensor and microsystem packages”, Proceedings of the International Continued on page 25

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Addressing package advancement challenges with innovative contactor probe technology

SEM

IC We ON #63 st 56

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Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 19


Integrated testing, modeling and failure Strong global growth throughout supplyanalysis chain of CSPnl for board level reliability

Walt Custer and Jon Custer-Topai

Strong global growth throughout supply chain Using global semiconductor shipments as a measure of world electronic manufacturing activity, Chart 1 shows the magnitude and timing of our most recent global recession (&amp; recovery) relative to the “Internet Bubble” crash of 2001/2002. Recovery was much quicker in 2010, thanks to dramatically better inventory control. Ten years ago, large finished goods and electronic component stocks had to be consumed (or written off) before new purchases could resume. That is not the case today. Chart 2 is a companion to Chart 1, showing 3-month growth (rather than actual US$) of monthly world semiconductor shipments. 3/12 chip growth recently peaked (at a whopping +58%) in March. The early-2010 massive chip shipment growth rates were of course calculated relative to the deep trough of early 2009. As we look to the second half of this year, growth will slow (chip shipments will still be increasing but at a more moderate pace). 2010 should still end with almost a 20100604

25

30% semiconductor expansion compared to last year. From Chart 1 note that world April 2010 chip shipments exceeded their precrash high of 2008. The global electronics industry has quickly recovered (to pre-crash levels)! Global electronic equipment shipment growth (Chart 3) is now in positive territory (3/12 &gt; 1.0) in all regions. Converted to monthly US dollars (Chart 4), the vast majority of the present electronic equipment production expansion is in SE Asia—but all regions are improving. Looking forward, semiconductor shipments (Chart 5) are projected to jump 28.6% in 2010 followed by an added 5.6% in 2011, with further growth until at least 2012. Semiconductor capital spending (Chart 6) is forecasted to increase 83.5% this year and then an additional 13.9% in 2011. Spending for capital equipment (Chart 7) remains highly volatile! Feast or famine is the rule! World printed circuit shipments

World Semiconductor Shipments

US$ Billions (3-month average)

20100604

3-Month Growth Rates on $ Basis

1.6

3/12 Rate of Change

1

2

1.4

8

6

3

13

10

5 4

1.2

15

End markets • Worldwide IT spending will increase by 3.8% this year at constant currency, to $1.47 trillion; hardware to grow 6.4% at constant currency; IT market will increase by 13.7% in China, and by 13.8% in India.—IDC • Digital information grew 62%y/y in 2009 to 800 billion gigabytes (0.8 Zettabytes).—EMC

Global Semiconductor Shipments

Monthly US$

20

are also strong (Chart 8) with SE Asia dominating global production. On a consolidated (world) basis PCB shipments dropped about 20% in 2009 but now appear to be on track for 28% growth this year (up from Custer Consulting Group’s +20% growth estimate made in early 2010). Most supply chain prognosticators have recently revised their 2010 forecasts upwards due to stronger than expected demand. The global recovery is certainly well underway as we move into the normal late summer/early autumn “busy season.”

7

9 11

12

1 10

0.8

2009 recession much sharper but shorter than 2001

5

0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10

SIA

Chart 1.

20 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

0.6 0.4 1591591591591591591591591591591591591591591591591591591591591591591591591591591 5/10 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10

Total $ Shipments from All Countries to an Area SIA website: www.sia-online.org/

Chart 2.

www.globalsmt.net


Strong global growth throughout supply chain

• Chinese electronics manufacturing

export delivery value increased 24.4% y/y and 5.7% m/m to CNY 267.8 billion in April 2010.—MIIT • Global smart homes market will grow at a 16.5% CAGR from 2009 to 2014 to $13.4 billion by 2014. Computers &amp; peripherals • Worldwide mobile PC shipments grew 43.4% y/y to 49.4 million units in 1Q10.—Gartner • Global PC shipments will rise 22% to 376.6 million units in 2010 plus an additional 10 million media tablets.— Gartner • Notebook sales rose 21% to $36.1 billion in 1Q’10. —Gartner • Worldwide media tablets shipments will reach 7.6 million in 2010.—IDC • Netbook shipments are expected to grow from 36.3 million in 2009 to 58 million in 2010.—ABI Research • Stereo 3-D PC market shipments will rise from rising from nearly one million to 75 million by 2014.—Jon

users in April 2010 reaching a total of 786.5 million.—MIIT Consumer electronics • U.S. household spent $1,380 (on an average) on consumer electronics products in the past 12 months, an increase of $151 from last year.—CEA • Global 3D TV shipments are expected to grow from 4.2 million units in 2010 to 12.9 million units in 2011, 27.4 million units in 2012 and 78.1 million units in 2015.—iSuppli • U.S. videogame hardware, software and accessories sales fell to $766.2 million in April from $1.03 billion a year earlier.—NPD Group Automotive electronic systems are expected to rise from $125 billion in 2009 to $244 billion by 2017.—Strategy Analytics Global commercial navigation system shipments will grow from 3 million units in 2010 to 7.5 million units in 2015.—ABI Research

expected to increase 4.6% y/y to $10.4 billion in 1Q10.—IDC • HDD industry will deliver more than 300,000 petabytes of storage capacity over the next five years to enterprise datacenters and clouds.—IDC • Worldwide hardcopy peripheral shipments grew 9.1% y/y to 28.7 million units in 1Q10.—IDC Mobile communications • Worldwide mobile phone sales to end users grew 17% to 314.7 million units in 1Q10.—Gartner • Worldwide converged mobile device (smartphone) market grew 56.7% y/y to 54.7 million units in 1Q10.—IDC • Handset navigation shipments will rise from 30 million units in 2010 to 181 million units in 2015.—ABI Research Forecast • Touch screen shipments expanded 29% y/y to 606 million units in 2009.—DisplaySearch 20100620

20100620

Global Electronic Equipment Shipment Growth

1.6

• China added 8.497 million phone

Peddie Research

• Worldwide server market revenue is

Converted @ Constant 2008 Exchange Rates

Taiwan/China Europe Japan USA 0

3/12 rate of growth in local currency

1.5 1.4

World Electronic Equipment Monthly Shipments

100

$ Billions

N America

Europe

Japan

SE Asia

80

1.3 1.2

60

1.1 1

40

0.9 0.8

20

0.7

Europe = Eurostat EU27 NACE C26 (computer, electronic &amp; optical products)

0.6

1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 02 03 04 05 06 07 08 09 10 00 01

0 1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 02 03 04 05 06 07 08 09 10 00 01

CALENDAR YEAR

Source: Custer Consulting Group

Chart 3.

Chart 4.

20100622

Worldwide Semiconductor Market by Geography WSTS Forecast 350.0

20100622

Worldwide Semiconductor Capital Spending

+28.6% +5.6% 320.0

300.0 250.0

213.1

204.4

200.0 150.0

227.4

247.7 255.6 248.6

-9%

291.0

307.4

70.0 60.0

226.3

138.9 140.8

63.4 +83.5 %

44.0

30.0

47.5

+13.9 %

54.1

58.3

51.7

49.4

-41%

25.9

20.0 10.0

50.0

Asia Pacific Japan Europe N. America

60.0

40.0

166.3

149.4

$ Billions

50.0

100.0

0.0

CALENDAR YEAR

0.0 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 37.2 32.8 31.9 47.5

51.3 46.7 42.3 64.1

39.8 33.1 30.2 35.8

51.2 30.5 27.8 31.3

62.8 38.9 32.3 32.3

88.8 45.8 39.4 39.1

103.5 44.1 39.1 40.7

116.5 46.4 39.9 44.9

123.5 48.8 41.0 42.3

124.0 48.5 38.2 37.9

119.6 38.3 29.9 38.5

159.9 44.8 38.2 48.1

169.6 47.3 40.1 50.4

177.1 49.2 41.6 52.1

Other Capital Spending Automated Test Equip Packaging &amp; Assembly Equip Wafer Fab Equip

WSTS 6/2010

Gartner 6/2010

Chart 5.

Chart 6.

www.globalsmt.net

2006 17.9 4.1 5.4 32.5

2007 18.7 3.6 5.2 36.0

2008 13.3 2.4 4.0 24.2

2009 9.3 1.1 2.7 12.7

2010 12.1 2.7 5.5 27.2

2011 16.3 3.0 5.6 29.1

2012 17.5 2.8 5.0 33.0

2013 16.9 2.1 3.4 29.3

2014 14.8 2.3 3.9 28.4

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 21


Strong global growth throughout supply chain

20100622

Semiconductor Capital Equipment Shipments by Area 16.0

$ Billions

14.0

13.0 12.9 11.7

12.0 10.0

11.3

11.0

10.1

9.8

8.0

9.4

8.7 8.8

10.3

11.2 10.811.0 9.8

9.6 9.6

9.4 7.6

10.6

8.0 8.0

7.8

6.6

6.0

7.5 6.6

5.7

5.6 4.1 4.1

4.0

4.7

5.1

5.6 4.4

4.9

5.7

5.4 4.6

4.5 3.1

2.7

2.0 0.0 ROW China Taiwan Korea N America Japan Europe

1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 01 02 03 04 05 06 07 08 09 10 00

1.1 1.5 1.7 1.6 1.2 0.3 0.8 0.4 0.4 0.7 0.9 0.5 0.8 4.4 4.9 2.3 0.8 2.4 2.2 1.4

2.5 1.2 3.2 1.8 1.5

2.5 0.9 3.5 2.6 1.7

2.0 0.9 3.9 2.6 1.9

1.1 1.0 3.0 3.4 1.6

1.0 0.5 2.2 1.8 1.0

0.7 0.3 1.7 1.5 0.7

0.4 0.4 1.4 1.0 0.6

0.5 0.3 1.5 0.9 0.4

1.1 0.4 1.3 0.8 0.5

1.1 0.5 1.6 1.1 0.5

0.8 0.6 1.6 1.0 0.6

0.5 1.1 1.4 1.3 0.5

1.2 1.0 1.1 1.5 0.7

0.3 1.9 2.0 1.5 1.2 2.2 0.8

1.5 0.9 1.7 1.1 1.4 2.0 0.9

0.7 0.5 1.9 1.2 1.4 2.1 0.9

0.7 0.4 2.2 0.9 1.7 2.0 0.9

0.7 0.3 1.4 2.3 1.6 2.1 0.9

0.7 0.2 1.6 1.2 1.4 1.6 0.8

0.7 0.4 1.3 1.0 1.4 2.5 0.7

0.7 0.4 1.4 1.3 1.3 2.0 0.9

0.8 0.4 1.6 1.8 1.8 2.3 0.9

1.0 0.6 1.8 1.5 1.8 1.9 0.9

1.0 0.9 1.9 2.0 1.8 2.7 0.9

0.9 0.5 2.1 1.8 1.9 2.3 0.9

0.8 0.7 2.0 2.5 1.8 2.3 0.8

0.6 1.2 3.2 1.8 1.5 2.1 0.6

0.8 0.5 3.2 1.6 1.7 2.6 0.8

0.8 0.5 2.3 1.6 1.6 2.4 0.7

0.7 0.8 2.4 1.7 1.8 2.4 0.7

0.8 0.5 1.5 1.4 1.3 1.9 0.5

0.8 0.4 0.8 1.2 1.1 1.7 0.6

0.4 0.2 0.4 0.5 1.4 1.1 0.6

0.1 0.1 0.3 0.3 1.1 0.8 0.4

0.2 0.1 0.7 0.4 0.7 0.3 0.2

0.5 0.4 1.4 0.8 0.7 0.5 0.2

0.6 0.3 2.0 1.1 0.9 0.6 0.3

0.8 0.4 2.2 1.9 0.9 0.9 0.3

www.semi.org, 6/2010

Chart 7.

EMS, ODM &amp; related assembly • EMS industry had 11 merger &amp; acquisitions in 1Q10.—Lincoln International • Solar contract manufacturing is expected to grow from 1,100 MW in 2010 to 4.1 GW in 2014.—iSuppli Ability Enterprise set up production base in eastern China for cameras, video recorders, optical lenses, digital photo frames, LCD monitors and projectors. Adeptron received a US$ 1.3 million EMS contract from a defense OEM customer and a $1.5 million assembly order for smart grid applications. Aero Stanrew obtained BE EN 9100:2003 and ISO 9001:2008 certifications. Assel added a NORDSON Asymtek SL-940 conformal coating system and a TC2600 V4 IR oven. Assembly Contracts entered a contract manufacturing partnership with Cinterion. Bogart invested in a MYDATA P&amp;P SMT line with jet printer MY500 and vaporphase reflow soldering system. Celestica: • received a manufacturing order for LumiSmart devices from Cavet Technologies. • received an outsourcing agreement from HP Ireland that included the transfer of 140 workers. China Wireless Technologies will open a handset assembly plant in India by 2012. Compal earned US$0.064 EPS in 1Q10, becoming world‘s most profitable NB contract manufacturer. CSM added an Asymtek Century C-740

automated, conformal coating application system. Diversified Systems ended operations. Elcoteq: • Bangalore received Excellent Award from Quality Circle Forum of India. • becomes Sharp’s partner for the KIN Windows phones. • elected Jorma Vanhanen chairman and Heikki Horstia deputy chairman. • sold ZAO Elcoteq (St Petersburg, Russia) operation to Optogan CJSC. 20100620

3500

Electronqiue Lacroix Tunisia obtained EN9100 certification. Elprog added an Assembléon pick &amp; place machine and screen printer. EPE moved to larger facility to accommodate 150% growth over past three years. EPIC Technologies received Volkswagen Group Award, 2010. Etek Europe launched used SMT division. Flextronics: • celebrated production of 25,000 Redbox DVD rental kiosks in Creedmoor, North Carolina. • expanded Citrix Systems’ partnership to include joint design of new hardware products. • was named ‘Strategic Partner of the Year’ and ‘Best-in-Class’ supplier by LSI. • expanded notebook PC capacity in China to 15 million units/ yr. • received solar panel manufacturing contract from SunPower. • added 1,500 workers at its NB PC production in Taiwan. Foxconn /Hon Hai: • installed safety nets and asked workers to sign ‘no suicide’ agreement at its Shenzhen, China plant. • employees were arrested for stealing $60,000 in processors at the Santa Teresa plant in Mexico. • received Dell enterprise notebook orders for 2011. • plans to ship 24 million 4G iPhones in 2010. Frontline India added a DEK Horizon 03iX platform.

World PCB Monthly Shipments

Converted @ Constant 2008 Exchange Rates N America

Europe

Japan

SE Asia

3000 2500 2000 1500 1000 500 0 1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 99 00 01 02 03 04 05 06 07 08 09 10

Source: Custer Consulting Group

CALENDAR YEAR

Chart 8.

22 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

www.globalsmt.net


Surface Mount Technology

AOI solutions to reduce defective PCBAs

automotive

consumer computer telecom Innovative by Synapse

3DSPI

Fast and Compact

Large board

5K

SERIES

Dual-lane

7KDL SERIES

CREATING VALUE www.vitechnology.com


Strong global growth throughout supply chain 20100620

World PCB Shipments (with forecast)

Converted @ Constant 2008 Exchange Rates 60

50

$ Billion Assumptions: Europe = composite European SIA &amp; local PCB assoc data Japan &amp; N. America from JPCA &amp; IPC data Taiwan/China based upon 44 rigid &amp; flex company composite Rest of Asia growth = Taiwan/China 44 company composite Data scaled to match Henderson Ventures annual totals 2007 based upon sum of monthly totals

+28%

-20%

40

30

20

31.6 38.6 31.2 29.4 31.7 37.6

42.9 51.7 54.3 51.1 40.9 52.6

1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 01 02 03 04 05 06 07 08 09 10 11 99 00

CALENDAR YEAR Source: Custer Consulting Group - synthesized from Henderson Ventures annual estimates and N. American, Japanese &amp; Taiwan/China monthly PCB shipments and SIA European chip shipments

Chart 9.

Hanza Intressenter acquired all outstanding shares of Hanza from HSF Group. Incap received a rotor component manufacturing supply contract from ABB Oy, Machines. Interphase Engineering expanded its design &amp; contract manufacturing services. Itron added 40 new jobs and $4 million in new equipment. Jabil implemented carbon footprint, on-demand program throughout entire organization. JJS Electronics: • appointed Richard Barratt principal NPI engineer. • developed training process which promotes step-by-step analysis supported by pictorial guidance. Kimball Electronics received a manufacturing contract for Third Eye retroscopes from Avantis Medical Systems. King Jim began offering EMS services in Malaysia. Kitron received a NOK 45 million/year contract for electronics manufacturing and assembly of industrial tools from Atlas Copco Tools. LaBarge: • received ANSI/ESD S20.20 certification at its Appleton (WI), Pittsburgh (PA) and Tulsa (OK) manufacturing facilities. • received a $1.5 million electronic assemblies contract from Northrop Grumman for F-16 fighter fire control radar system. Macrotron Systems moved to 75,000 SF

manufacturing plant in Fremont, CA. Nortech Systems acquired Trivirix. PartnerTech added six Trumpf machines at its new Myslowice, Poland, plant. Plexus: • received a solar inverter EMS contract from Sustainable Energy Partners. • invested in a 1,800 SF Renewable Energy Lab. Proxy Electronics (Sweden) filed for bankruptcy protection. Sanmina-SCI Israel Medical Systems is spending $10 million to build a plant in Suzhou, China. Season Group expanded into the U.S. with the acquisition of DC Electronics and its San Antonio facility. SinoHub commenced operations at its new 77,500 SF mobile phone manufacturing facility in Shenzhen, China. SMTC began providing Kontron with PCB and module level assembly manufacturing in Chihuahua, Mexico, and Dongguan, China. Sparton received a $830,000 manufacturing contract for SP3004D digital compass for military warfare equipment. Spectrum Control received $13.1m multiyear contract for complex microwave assembly. Stadium Electronics appointed Peter O’Keeffe business improvement manager. Suntron consolidated its Manchester, NH, and Lawrence, MA, operations into a larger facility in Methuen, MA. Surface Mount Technology: • completed renovation of SMT

24 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

Engineering, LLC.

• will add 25,000 additional SF of manufacturing space by 4Q’10. Televés S.A. invested in a SMT production line consisting of Siplace SX2 and Siplace CA (chip assembly) machines. Vega Grieshaber KG (Schiltach, Germany) implemented Siplace Facts for its SMT production inventory management system. Victron: • opened Victron de Mexico. • passed UL DQS’ tri-annual audit of ISO14001:2004 Environmental Management System, and ISO9001:2008 and ISO13485:2003 quality systems. Videoton Electronics Assembly Services received a EMS manufacturing contract from Linak for furniture electronics. Xenterio appointed Ernst Gockel sales &amp; marketing manager. Materials &amp; process equipment Industrial automation electronics equipment (excluding software and services) revenue declined 14.3% y/y to $74.9 billion in 2009.—IMS Research Azuma renewed its PCB copper plating lines. 3M: • Electronic Solutions Division introduced a halogen-free embedded capacitance material. • released its material library for ANSYS simulation software. Agilent Technologies acquired Varian. AIM appointed Andy Dolan business development manager. Arlon and Rogers Corporation resolved their patent infringement litigation. BASF will expand its annual methanesulfonic acid capacity in Ludwigshafen, Germany, to 30,000 tons. Chemtura opened a Technical Center of Excellence in Nanjing, China for the AsiaPacific region. ChipChecker launched electrical inspection services. Co-Tech • is developing copper foils for electric car batteries. • will ship 15,000 tons of copper foil in 2010. CyberOptics named Daniel Good VP of corporate development and Tim Skunes VP of technology and business development. DEK expanded its presence in South America in partnership with Fuji Do Brasil. DKN Research began supplying substrates for printable electronics engineering trials. Dow Electronic Materials: • opened a new research and

www.globalsmt.net


Strong global growth throughout supply chain

• development center in Seoul, Korea. • received Excellent Supplier award from

HannStar Board. Dow Europe raised epoxy products prices in Europe. Electro Scientific Industries received Provectus Award for advanced IP processes. EMC will ramp up CCL capacity at each of its plants in Taiwan and China in 4Q. Europlacer opened 3,000 SF facility in Tampa, Florida. Fabrico and Henkel entered a partnership for Loctite bonding, joining &amp; sealing solutions. Furukawa Electric will expand capacity for general grade copper foil for rigid PCBs to 1,200 tons/ month with construction of 2nd factory in Taiwan which is scheduled for operation at end of fiscal 2014. GCT started production at its diamond coating facility in Weingarten, Germany. GOEPEL electronic and InterElectronic Hungary entered a partnership to distribute AOI systems for electronic assemblies in Hungary and Romania. Isola received OHSAS 18001:2007 and DIN EN ISO 14001:2004 3-year recertification from TÜV Rheinland (Technical Inspection Authority). Kester appointed Michael Fullbrecht European sales manager. Laird released a low-cost high-performance thermal substrate for LED module applications. Mallinckrodt Baker: • named former Rohm &amp; Haas CEO Raj Gupta chairman. • is expanding its solar panel and flatscreen TV businesses. Manncorp introduced two “HighThroughput Flex Lines” turnkey SMT lines, which include twin MC-385 pick and place machines and “Box Builder Line” with MC-387 placer. Nissan Chemical developed a organicinorganic hybrid polymer for optical printed circuit boards. Park Electrochemical: • elected Emily Groehl to its board of directors. • appointed Dr. Ke Wang director of research &amp; development and W. Douglas Leys director of advanced material applications. • introduced E-710 Easycure low temperature cure epoxy prepreg. Seica named Zero Defects International its North American sales agent for bare board flying probes. Siemens Electronics Assembly Systems (SEAS) introduced capacity-on-demand business models: SIPLACE Peak Demand and SIPLACE Floating Demand. Sun Chemical named Toryon

www.globalsmt.net

Technologies its national distributor for circuit product materials. Taiflex PV’s back sheet factory in China began production in July. Tamura started volume production of a flexible black light absorber for flexible circuits designed as LED module substrates. Taiwan Glass Industrial plans to raise glass fabric capacity by 20,000 tons in 2H’11. Ticona acquired Dupont LCP and PCT product lines. T-Tech introduced its Quick Circuit QCJ5 advanced prototyping system. TUC expanded its CCL front-end processing capacity to 300,000 units/ month. Unimicron began offering Shocking Technologies’ XStatic™ voltage switchable dielectric material to its customers. Vi TECHNOLOGY appointed Koen Gutscoven worldwide VP of sales. Viking: • formed an equipment supply and service division for the electronics production industry. • Test named Peter Collins sales manager Walt Custer is an independent consultant who monitors and offers a daily news service and market reports on the PCB and assembly automation and semiconductor industries. He can be contacted at walt@custerconsulting.com or visit www.custerconsulting.com. Jon Custer-Topai is vice president of Custer Consulting Group and responsible for the corporation’s market research and news analysis activities. Jon is a member of the IPC and active in the Technology Marketing Research Council. He can be contacted at jon@custerconsulting.com.

Wafer-level solder sphere placement and its implications— continued from page 18

1. Electronics Manufacturing Technology Symposium (22nd IEMT), Berlin, April 27-29, 1998. Elke Zakel, Lars Titerle, Thomas Oppert, Ronald G. Blankenhorn, “High Speed Laser Solder Jetting Technology for Optoelectronics and MEMS Packaging”, Proceedings of the International Conference on Electronics Packaging (Tokyo, Japan), Apr. 17-19, 2002. Andrew Strandjord is senior manager of advanced packaging at PacTech USA. He received his Ph.D. in organic chemistry from the University of Minnesota. strandjord@pactech-usa.com Mr. Oppert is vice president global sales &amp; marketing at PacTech in Nauen, Germany. He earned a master’s degree in electrical engineering from the Technical University of Berlin in 1995. Thomas Oppert has co-authored more than 50 technical papers related to semiconductor packaging. oppert@pactech.de Dr. Thorsten Teutsch is president of PacTech-USA. He received his Ph.D. in physical chemistry and surface science from Fritz-Haber Institute of the Max Planck Society. Teutsch@pactech-usa.com Mr. Ghassem Azdasht is co-founder and CTO of PacTech GmbH. He studied mechanical engineering and laser technologies at the Technical University Berlin. Mr. Azdasht has authored of over 100 publications and patents related to wire bonding, flip chip, and laser assembly. azdasht@pactech.de

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 25


Steps toward closing the software quality gap

Steps toward closing the software quality gap Frederick R. Hume, Data I/O Corporation, and Mary Beth Soloy, Ford Motor Company

The production programming process of loading firmware into the semiconductor device must be controlled if the quality and integrity of the software content in the outgoing product is to be assured. Keywords: Quality, Firmware, Production Programming

A few years ago, while visiting a successful United States manufacturer of networking and communications equipment, the host provided a tour of the facility including a walk through their programming center filled with equipment from many vendors. A colleague asked, “Do you ever find circuit boards on the factory floor that contain devices mis-programmed with the wrong software?” Our host’s response was “It happens all the time.” It is surprising that a gap in quality methods of this apparent frequency was accepted as matter-of-fact. In an era when Six Sigma and statistical methods have been widely deployed to drive out process variation throughout the factory, here was an example of a leading manufacturer that seemingly had no demonstrable control of the programming process for loading firmware1 into their products. The circuit boards containing the mis-programmed devices had to be identified during test, thus reducing first-pass yield, and required rework before delivery to final assembly. While one might suspect that this firm’s experience is an anomaly, a deviation from good manufacturing practice isolated to a few firms, these gaps in quality methods are far more common than one could have expected. The sophisticated quality methods that industry has deployed have been focused primarily on hardware,

things that are visible, that are built by their factory. However, the software is generally built outside of the factory and then released to the factory electronically to be loaded into the device or product as a data file. In this way, it circumvents the normal quality control processes used with hardware production so mistakes in the loading of the data file are not found until circuit boards fail to operate correctly. In most cases, the result is scrap and/or rework in the factory, but in some cases the defect is not discovered until the product is in the field. A leading wireless handset manufacturer recently delivered 200,000 phones to a well-known Fortune 50 service provider in the US. Half of the phones operated correctly; the other 100,000 did not and had to be returned to the manufacturer. The subsequent investigation found that the phones were built on two production lines. One line was using the correct programming algorithm; the other wasn’t. The expense to identify which phone was built on which production line and then to return the incorrectly programmed phones to the factory for rework ran into the millions of dollars. This error could have been identified earlier or eliminated with the use of a simple data collection plan and a statistical test such as Chi-Square to show

Figure 1. Typical firmware supply chain. 1 The term firmware used in this article refers to the software programmed into a semiconductor device such as a microcontroller or Flash memory that contains non-volatile memory. This software often represents a firm’s most valuable intellectual property.

26 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

www.globalsmt.net


Tsunami growth waves followed by modest swell

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Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 27


Steps toward closing the software quality gap

the difference in production output from the different lines. A typical firmware supply chain is shown in the flow chart in Figure 1. Many firms assume that because their software, or source code, is under revision control during development and release they have a quality process. Unfortunately, their process may fail to account for the multitude of mistakes that are possible when loading the software into a semiconductor device shown as production programming in the flow chart in Figure 1. Production programming involves selecting the appropriate data file to be loaded into the semiconductor device, selecting the appropriate algorithm for the device, actual setup of the programming equipment, physical handling of the devices during programming, and operation of the programming equipment. Mistakes in any of these may lead to defective devices on the circuit board or to devices that contain the wrong firmware. Table 1 identifies a number of the common mistakes possible at this step that lead to scrap and rework and, if not detected during test, may lead to field failures. While these fifteen are the most common mistakes, more than forty potential mistakes have been identified. Although many of the common mistakes are easily identifiable and have minor consequences, some of them are not easily detected and have severe financial consequences in terms of the scrap and rework. In cases where the mistakes are not detected until products are deployed at the customer’s location, the damage to a firm’s reputation may be more significant than the cost of the corrective action. This is an opportunity to utilize a Cause and Effects Matrix or Failure Mode Effects Analysis (FMEA) to plan for what could go wrong and put prevention in place based on the severity, occurrence and ease of detection. Figure 2 graphs the frequency and impact of the fifteen common mistakes from Table 1. While these data do not have statistical significance, since they are drawn by one programming equipment manufacturer from the experience of its customers in a variety of industries and countries, we have no reason to believe that they are not representative of many other firms’ experiences as well. As you can see from this chart, some of the frequently recurring mistakes have substantial impact (1, 7, and 10). With respect to mistakes in handling

Category

Common mistakes in:

Failure to create jobs correctly

1. Handling of data files 2. Choosing the appropriate algorithm or adapter or both 3. Identifying the device to be programmed

Failure to run the programming job correctly

4. Starting or stopping jobs

Failure to operate equipment correctly

7. Setting up the equipment

5. Acting on machine error messages 6. Setting up the job 8. Selecting package files 9. Loading software/firmware 10. Physically handling devices 11. Preventative maintenance

Failure to achieve statistical process control

12. Extracting information from equipment log files 13. Supervisory monitoring of the programming process Correlating yield statistics across equipment platforms Detecting non-conforming lots

Table 1. Common mistakes in firmware process control. Source: Data I/O Corporation.2

data files (item 1 in the chart above), an electronics manufacturing firm in China recently told us that they used more than one hundred types of data files and “sometimes the operator just programs the wrong data.” These errors tend to occur most often when the firm is using a manual process to load the firmware into the semiconductor device or circuit board. Automated methods for loading firmware can eliminate many of these mistakes and particularly the ones that have the greatest financial impact. Also, automation provides a means for closing the loop around the process achieving effective process control by generating log files that can tie revision levels of the firmware to manufacturing dates or serial numbers. This provides a high-integrity means to ensure configuration control and traceability of the finished product that extends beyond hardware to include the firmware. Yield and trend information can also be extracted from the log files. One automotive electronics manufacturer located in the Southeast of the USA uses automated equipment to load the firmware that also connects to barcode scanning equipment. This Poka-Yoke/ Mistakeproofing enables them to ensure that the algorithm and data file are the correct ones, both for the semiconductor device and for the circuit board. Automated methods for loading firmware also provide a means for remotely monitoring the programming process even when it is conducted in factories halfway

around the world. Statistical information, such as knowing the number of devices being programmed each day, enables a firm to track production levels, yield, and other vital manufacturing data including downtime to ensure effective control regardless how disintegrated the supply chain. A recent IBM survey3 of 1,130 CEOs of electronics manufacturing companies found that 43% of them were worried about counterfeiting and piracy, but it appears there is a disconnect between Mahogany Row and the factory floor as the programming process presents one of the greatest vulnerabilities with respect to the potential loss of a firm’s intellectual property. With manual programming, multiple copies of the firmware reside on multiple sets of equipment in an unprotected state and subject to theft. Using automated programming solutions, however, it is possible to encrypt data files and transmit them to remote manufacturing sites securely. Once there, the files remained stored in an encrypted state on a secure server. Access to the data files can be restricted to authorized personnel. Files remain encrypted until decrypted inside of the automated programming equipment where they are not easily accessed by operators. System level software incorporated in the automated equipment also has the means to program encrypted serial numbers that contain vital information about the manufacturing process such as when, where, who. Even if a manufacturer

Extracted from calls for assistance to the firm’s customer service organization. “The Enterprise of the Future; The Global CEO Study 2008.” IBM Institute for Business Value. May 2008

2 3

28 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

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Steps toward closing the software quality gap

of software IP and injection of malware as wireless. As the electronic 3600CPH = 120 + (8mm) feeders component units SQ foot print = L (42”) x W (42”) (ECUs) within the MaX Board Size: 558.8mm (22.0”) x 609.59mm (24.0”) vehicle proliferate and the data communication 4000C = Traditional Dependability + New Technology between the vehicle and the external world increases, the exposure is magnified. There is no reason ® to assume that automotive electronics systems will not become future targets for criminal activity. The production programming process of loading firmware into the semiconductor device must be controlled if For more info visit: www.goppm.com the quality and Email: ppm@goppm.com or Call: 603.895.5112 integrity of the Windows is a registered trademark of Microsoft Corporation software content in the outgoing product is to be provides for the real-time monitoring of assured. Automation of this process, while yield and job statistics to ensure effective not a panacea, can substantially reduce process control. Security software can the potential for mistakes that result in also be added to program encrypted serial scrap and/or rework. Automation also numbers to further ensure traceability and configuration control over the firmware supply chain throughout the software life cycle.

is unable to prevent the theft of its intellectual property, it can later read back the encrypted serial number to ascertain when and where the loss occurred. This is particularly useful if a firm subcontracts production to facilities outside of its direct control. The point of production programming (deployment) is also the easiest place in the software life cycle (requirements, design, coding, testing, deployment and operations) to add malware4 without the risk of detection. Malware has become so commonplace that a recent study found that each US adult had a 66% chance of experiencing at least one data exposure in 20085. We are now beginning to see the increasing risk with wireless handsets as they begin to take over many of the functions normally performed by personal computers and store sensitive data. Rich Cannings, security leader for the Android operating system (OS), recently said, “The smartphone OS will become a major security target. Attackers can already hit millions of victims with a smartphone attack, and soon that number will be even larger. I think this will become an epiphany to malware authors.”6 The point of production programming must be protected since malware injected at this point circumvents the extensive filtering for spam and malicious content provided by the wireless carriers. Fortunately the same methods that protect the software from theft at this point also provide protection from the injection of spurious content. Automotive electronics systems share the same vulnerabilities to the theft

Severe Not Easily Detectable

Lesson 1 :

$28,750.00

5

1

7

Frederick R. Hume is president and CEO of Data I/O Corporation, Redmond, WA. Mary Beth Soloy, ASQ CQE, CRE, CSSBB, is the global product development quality functional lead with Ford Motor Company.

10

FINANCIAL IMPACT

9 15

Not Severe Easily Detectable

3

4

14

6

13

8

2

11

Seldom

Occasionally

FREQUENCY Figure 2. Frequency and impact of the fifteen common mistakes

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12

Frequently

4 Malware, short for malicious software, is software designed to infiltrate or damage a product and may take a variety of forms such as hostile, intrusive, or annoying software. 5 Chang, Frederick R. “Is Your Computer Secure? SCIENCE, Vol. 325, p550, 31 July 2009 6 Cannings, Rich, Usenix Security Symposium, 13 August 2009

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 29


Interview

Interview—David Raby, STI Electronics David Raby is CEO of one of America’s most successful tier 3 EMS manufacturing companies. A past president of SMTA, David and his father, Jim Raby, have grown STI Electronics from a small contracting house to a multi-faceted business with a unique business model. Trevor Galbraith spoke to David about the origins and evolution of STI Electronics. David, your father, Jim Raby, founded the business. Can you tell us the origins of STI Electronics? Actually, the whole family founded the company, but it was based on Dad’s expertise. He had spent his career with NASA and the US Navy studying and testing electrical connections as well as developing manufacturing, quality and training specifications for their contractors. In 1982, we incorporated Soldering Technology International—Mom (Ellen) was the only “full time” employee—and began conducting seminars around the country teaching government contractors how to successfully and efficiently build military hardware to MIL-STD-2000. By 1984, the business had outgrown Mom &amp; Dad’s living room in Ridgecrest, California and we opened an office in San Dimas, California. Dad left his government job and began consulting on a full time basis. I left my “real job” in early 1985 to manage the business side and hope we could all make a living for some period of time. We also soon began to do some hand solder training of companies’ operators and, because of their requests, began selling training kits very similar to the ones we still sell today. In 1993, we moved back home to Madison, Alabama, and eventually changed our name to STI Electronics. At the end of 2008, we moved about 500 yards into our current 54,000 ft2 building in Madison. The business is divided into three unique business segments. Can you explain the rationale behind this and how the three business units integrate with each other? We are unusual in the combination of businesses we operate, but we believe they

all complement each other. Our original consulting business led to what is now our Engineering Services department, which includes our Prototype and Manufacturing area, our Analytical/Failure Analysis Lab, and our Microelectronics Lab. If you are working with any of those areas, you are building (or contemplating building) a product and should be able to benefit from our Training Resources department. Training Resources consists of Training Services, which provides IPC and NASA certifications as well as customized training, and Training Materials, which provides training kits, dummy parts and other training materials and aids. If you are using either of the above departments, you are building hardware and can use our Distribution Sales department, which provides primarily benchtop equipment as well as consumable manufacturing materials (solder, flux, etc…). If you use our Distribution Sales department, obviously you are a candidate for our Engineering Services and Training Resources areas…. From the outside, they may seem like an odd combination of businesses, but the reality is that anyone who uses one probably has a need for at least one and probably both of the others. It also helps our customers tremendously

30 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

when they have issues arise, because of the unmatched variety of expertise we have under one roof. One of our biggest challenges through the years has been educating customers of one department on all of our capabilities in other areas. STI invented and patented embedded active die technology. Can you explain the features and benefits of this technology and the most likely applications? STI’s Imbedded Component/Die Technology (IC/DT) is helping customers

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Interview

address size, weight, and power problems (SWAP). IC/DT is all about size reduction—utilization of the smallest form factor components and bare die available today. This reduction in component size allows STI to imbed these bare die minus their secondary packaging to achieve the lowest size and weight possible. Utilizing these small form factor devices and lowest power driven devices allows STI to meet and reduce power requirements and thus gain battery life and minimize power consumption while maximizing heat dissipation. SWAP is a major driver in military and some industrial applications. IC/DT also helps with component obsolescence because, as die size shrinks over time, the wiring out format does not change, but the package size does, which drives redesign of the printed circuit boards. Guidance systems and power supplies are great applications for IC/DT, as well as sensors and monitoring devices. You have a well-equipped failure analysis laboratory. Typically, what differentiates your lab from other facilities, and is the business US-based or further afield? The percentage of international business in our Analytical/Failure Analysis Lab is higher than in any other segment of STI. We perform analysis work from the component level through printed circuit board fabrication all the way to fully assembled system level analysis. We also perform material qualifications from the component level thru PCB fabrication and ultimately at the fully assembled state. This level of detail allows STI to differentiate ourselves from the competition because not only can we perform analytical services for customers, but with our prototype line we also have the capability to replicate the variables of their processes and truly understand the problems. The ability to use all our departments’ expertise to give solutions that are proven and correct is the main difference between our lab and other labs. STI have been involved in IPC Standards from the early days of the association. Recently, you were awarded a contract with IPC to update the existing IPC-A-610 and J-STD-001 training and certification programs from the D to the recently released E revision of the standards. Can you tell us about what was changed as part of the update? Many changes have been made to the documents as IPC’s staff and industry committee volunteers work to make sure

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the IPC-A-610 and J-STD-001 documents are in agreement with each other and contain new component package styles and technology as needed. The most notable changes in the E revision of J-STD-001 are the addition of criteria for non-collapsing solder balls to the BGA section, that materials criteria have been combined in one section, and the criteria for solder sleeves has been expanded to match IPC/WHMA-A-620. The most notable changes for IPC-A-610 include the addition and/or replacement of drawings with actual hardware photos, all damaged criteria moved to one section, and added new criteria for SMT termination style “flattened post.” In 2008 you quadrupled the size of your manufacturing plant. Have you managed to find sufficient contract work to feed this expansion, and how many lines do you have now? When we moved into the new facility in mid-December of 2008, we brought our prototype line from our previous facility and added a complete new SMT line. We’ve also added a third small but very capable SMT line inside of our cleanroom. In addition to size and SMT line capacity, we’ve added a tremendous amount to our capabilities including a high speed aqueous cleaner, a flying probe tester and a conformal coater. Of course, we had no idea what 2009 was going to be like for the industry, but we actually managed to grow our manufacturing business by more than 35% during that year and have continued at roughly the same pace in 2010. This week, we added a business development/sales manager to help guide our centralized sales force to help drive our overall sales and fill up the manufacturing area. You have extensive capabilities in your microelectronics lab and cleanroom. What kind of advanced packaging technologies can you undertake, and how does this feed into the SMT assembly side of the business? Our Microelectronics Lab operates in a 3,000 ft2 class 1,000 cleanroom. We now have the capability to build multichip modules, sensors and miniaturized hybrid packages for military and industrial customers. We are starting to acquire customers and build volume production hardware in this facility. The knowledge and experience from our manufacturing floor is definitely a plus in the cleanroom production, and, as well, the engineers

from microelectronics are always available to the manufacturing floor. Will the end of the NASA space program have a negative effect on your business? Today there are still several scenarios being discussed regarding the future of NASA, but right now I don’t expect any to have a tremendous effect on STI. Even if the manned program does end, the unmanned programs still require the engineering, workmanship and training that STI provides. Because of our history, we take a lot of pride in working with NASA, and we definitely want that to continue, but it does not make up a high percentage financially of our overall business. Your sales division stocks a large number of different solder, adhesive, encapsulants and other materials. Was this division badly affected during the downturn, and what percentage of the overall business is it? Last year was not a good year to be selling benchtop equipment and consumable supplies. I was very glad to have our diversification because this division took a pretty bad hit, but we weathered it without losing any people and have already begun to enjoy growth again. As I mentioned earlier, overall our sales were up last year, but our Distribution Sales department dropped to less than 20% of our total sales. Looking forward five years, where do you think STI Electronics will be? We will be the top training company in the world. (I wish I was smart enough to know exactly what things we will be teaching.) We will be known for our quality manufacturing and lab services. IC/DT will be an accepted technology for several applications. Our Distribution Sales will be providing the best quality materials (I don’t know whose) and outstanding service. I have no idea where we’ll be regarding sales volume or head count but I do believe we will be well known around the world because of our reputation of doing things the right way. I’ll also have a daughter headed off to her first year of college, so as a father, I’ll be terrified. David, many thanks for joining us today. Trevor Galbraith.

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 31


Show report: SMT/HYBRID/PACKAGING rises above the ashes

Show report: SMT/HYBRID/

PACKAGING rises above the ashes

After more than 20 years of travelling to Nuremberg every year for SMT/ HYBRID/PACKAGING, I have come to the conclusion that it is not only the most consistent event in the electronics calendar, but also the best organized. Perhaps that’s why it’s the most consistent! Being a non-Productronica year, European manufacturers used this platform to roll out new equipment, upgrades and improvements. Here is a selection of companies I visited during the show. NORDSON Dage probably had one of the biggest new product introductions with the 4000 Plus BondTester. Dage already own this market worldwide with over 4,500 machines in the field. This latest version is a complete redesign offering improved data integrity, accuracy, a stepback before sheer of ± 1µm, camera assisted tool alignment and improved automation.

Among the new applications the 4000 Plus offers are fatigue testing, crack initiation and growth, creep and relaxation tests. On the materials testing front, it has the option of additional Borescope for fine pitch applications and a hot bump pull test. Data I/O were celebrating their best Q2 ever and at the same time delivered

their first customized X-series Roadrunner to a Siemens customer in Hungary. Kyzen introduced Exaklean 5612 to the European market for the first time. This readyto-use stencil cleaner contains the Kyzen inhibitor package that makes it compatible with all pastes, fluxes and adhesives. The Exaklean 5612 does not need a rinse cycle, is PH neutral, fast drying and has a low odor. This makes it a more economical alternative using less waste and no need for the operator to monitor the cleaning cycle. In other news from Kyzen, they have started a contract cleaning service from their facility in Belgium. The company hopes to expand these services over the coming months. MIRTEC were fortunate to make two sales of their newly introduced SPI system on the first day of the show. The company is expanding their manufacturing facilities in Korea to meet the surge in demand for their inspection products. MIRTEC introduced a real game-changer at APEX earlier this year with their new ISIS (Infinitely Scalable Inspection Sensor), comprising a 15 megapixel camera. JUKI officially unveiled the EPV monitoring system on their FX2070 placement machine. This ultimate quality-monitoring system takes no less than five

32 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

photographs of every component from each nozzle. The first photo determines if the component is present after pick up. The second determines if has tombstoned or changed position. The third takes a photo of the pads on the board as a reference designator. The fourth checks the alignment during placement, and the fifth checks that the placement is still good after the nozzle has retracted. This new system is factory fitted on all new FX2070 machines and will soon be available on 2080’s. Europlacer introduced the RC5.15 software, which contains an NPI wizard that leads the operator through the setup for quick, efficient NPI programming. The company have also relocated some staff recently and added two more support staff in the United States. Viscom launched the S2088BO-II, a desktop system for automatic optical wirebond inspection. Developed to inspect medium and small product runs and reliable defect detection on die, ball-wedge, wedgewedge and security bonds, the S2088BO-II inspects everything from aluminum thick wire and aluminum or gold thin wire connections, down to diameters of 17 μm. The inspection library includes inspection patterns for die, ball-wedge, wedge-wedge and security bonds as well as for damaged and misplaced components. Another new product from Viscom was their vVision software. A new, GUI based software interface on a Windows®7 platform. It is fully touch-screen operated and simplifies the operation of Viscom

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Title

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Electronics Exhibition October 26-27, 2010

Recognized as our industry’s strongest technical program

A technology showcase featuring products and services from leading suppliers to our industry

2010 October 24-28, 2010 &gt;&gt; Orlando, Florida Walt Disney World Swan &amp; Dolphin Resort

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Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 33


Show report: SMT/HYBRID/PACKAGING rises above the ashes

inspection equipment, while allowing access for experienced programmers to go deeper into the software to fine-tune inspection routines. Mentor Graphics’ Valor Division revealed that their MSS system has now been fully beta tested in a Chinese facility and has the unique ability to see work orders in advance and predict potential bottlenecks. This new software system can balance jobs across multiple lines, reduce the three-day inventory rule and achieve real job scheduling. The latest release of Valor V-Plan 2.1 in June 2010 can now program the entire line from end to end, producing machine code, DFM programs and documentation. Essemtec are never short of new product introductions. They kept up their blistering pace with the COBRA pick and place machine. Constructed on a composite frame, it offers better damping and stability. The COBRA has a unique v-shaped clamping system for boards, a carbon-fibre gantry on linear motors with magnesium heatsinks, all designed to reduce weight and increase speed. The COBRA boasts 240 feeders and an IPC placement speed of 15,000 cph. It is available from September 2010. The Tucano printer is high precision printer with a cycle time of 12 seconds and a price tag of €47,000. It has automatic stencil alignment and a maximum board size of 608 x 540 mm. The other big news from Essemtec was the acquisition of Vermes Microdispensing GmbH. The company currently offers two types of microdispensing valves, the MDS 3200 for high viscosity materials and the MDS 3010 for low/medium viscosity materials, capable of dispensing materials of 0-300 mpas and a droplet size of &lt; 1 nlitre. DEK were demonstrating their dual layer stencils using their VectorGuard Platinum products. The double layer stencil is fabricated through a two-step lithography and nickel electroforming process before being mounted on the VectorGuard tensioning frame. The mesh layer of the two-

layer structure serves to hold the stencil intact while accurately controlling the flow of paste to the second layer. The circuit layer determines the thickness and shape of the print deposits to deliver high tolerance, fine dimension printing. Ideal for accuracy-critical applications such as solar cell manufacture or LTCC manufacture. DEK also introduced the Sentinel inspection system onto their Galaxy, Europa/Photon and Horizon printers. Sentinel operates concurrently with the print cycle to bring 100% inspection at line beat rates and provides full verification and traceability. Marrantz introduced a new iSpector desktop model. The iSpector Desktop offers 10 µm resolution using eight 1-megapixel cameras and one 2-megapixel centre camera, using a telecentric lens. The system uses three angled light sources and an 18-LED centre light. It has a GUI software interface and sells for €65,000. The iSpector Desktop is available from August. Assembléon is now leasing entry level machines from as little as €55 per day, plus a residual payment at the end of the lease. The new True Capacity on Demand system, where manufacturers rent heads to meet peaks in demand, is gaining popularity. Assembléon also introduced their new Twin Placement Robot. This robotic feeder picks from reels or trays and is an ideal plug-in for the DRAM or memory market. The TPR handles a maximum component size of 45 x 45 mm with a placement accuracy of ± 25 µm. The placement speed from tapes is 16,000 cph (IPC) and from the trays it is 13,000 cph (IPC). ERSA introduced the ECOCELL selective soldering system. The ECOCELL offers two integrated preheaters. Up to four boards can be processed simultaneously, and dual solder bath systems offer the possibility to efficiently process multiple panels. Both the miniwave and the multiwave baths have the possibility to use different alloys in each bath. This function, together with the possibility to perform maintenance on a multiwave bath

34 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

while the other bath is operating, reduces downtime to an absolute minimum. The ECOCELL has a tightly controlled spray fluxing system, and the under-board IR preheaters can be upgraded to convection systems for heavy-duty boards. SEHO won a local environmental award for a novel approach to harnessing the ambient heat that escapes from the top of their reflow oven chambers. A collector between the machine’s two outer hoods collects the wasted heat from the reflow soldering machine. In addition, this heat recovery concept also covers the exhaust system of the reflow oven, the cooling aggregate, and the cyclone unit used for process gas cleaning. This reclaimed heat can be transported to the manufacturing building either for use in a heat sink for the generation of tap water or in a preheating system for the fresh air supply. Warming of tap water in the manufacturing area is ideal because the soldering machine’s uptime is identical to the usage period of tap water, and water heating is the most efficient way to use wasted heat.

That is a short overview of some of the new products released at SMT/HYBRID/ PACKAGING 2010. This year the show attracted 555 exhibitors and 22,300 visitors. Next year, the show moves back to the May timeslot, and we can safely predict it will be another success. —Trevor Galbraith

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Presenting...

s” s: ice rie rv go Se ate on. c lli ct tra wo mi on o t 0 “C int $10 0: n &lt; 01 ke d r 2 bro n an fo w een illio Ne s b m ha $100 &gt;

What is AOI Resolution?

The 2010 GLOBAL Technology Awards The ONLY global awards program in the industry A GLOBAL Technology Award sends the message that your product or service is an innovation and quality leader in an industry crowded with competing products. Sponsored by Global SMT &amp; Packaging magazine, the GLOBAL Technology Awards are now in their sixth year of recognizing and celebrating innovation in the electronics manufacturing industry. Entries are being accepted now through July 31st. Entries are invited from equipment, materials and EMS companies of all sizes. In addition to the award statue, winners receive publicity in a special awards issue of each of Global SMT &amp; Packaging magazine’s five editions (US, Europe, China, Korea &amp; South East Asia) as well as on the Global SMT &amp; Packaging and GLOBAL Technology Award websites and in the Global SMT &amp; Packaging email newsletters. Winners also receive a small poster for use at trade shows and an image and logo for use in advertising, websites and other promotional materials.

Enter now: http://awards.globalsmt.net

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Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 35


SMT Answers

SMT Answers SMT Answers, found online at answers.globalsmt.net, offers a place for members of the electronics manufacturing community to ask and answer questions—it’s a community-based ‘help board.’ Registration is not required for participation. Here are some recent questions and answers. Jump online any time to ask your own questions or help others out. When we solder FR1 board, we are facing problems with bubbles. What would be the possible reasons and how do we eliminate this issue?

the solder from the hole. Not all the holes were outgassing, we could test it with soldering iron. Outgassing continues when the solder remelts. The cause of the plating issue was the borehole’s surface roughness. You can test the holes like this: http:// www.youtube.com/watch?v=HCh_oyts9WE —Istvan

A: Most likley humidity. Check your screen printers humidity and temprature controls and make sure they are functioning properly. This has been the problem when we had bubbles or blow holes. This may require a solder paste brand change. —jt A: The laminate might have absorbed moisture. You could try baking it before use. A: We used to have issues with FR4 boards where the plating of the through holes

Tombstoning small parts on HASL boards—is there a solution or are we going to have to look into another kind of board? were not continuous and had a rough surface . The boards had outgassing during wave soldering what formed large boubles inside the solder joint and pushed out

36 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

A: No, you should not have to get new boards, although HASL finish is where I have seen all tombstoning. If you went to an ENIG board your tombstoning would

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SMT Answers

most likley go away, but that costs. Try decreasing the amount of paste being deposited onto the pad. You have enough solder that surface tension is pulling the part upright. Also, as I am sure you have done already, make sure that chip is dead center. If you have a glue machine in line you may just want to brute force it and add glue. Most glue cures at about 180˚F before solder reflows. —J Torrez, Production Manager, Transparent Technologies

This is for a Sn/Pb based material. —Dr. Brian Toleno, Director of Technical Service, Henkel

A: Have you tried an ’anti-tombstoning’ paste, available for tin/lead process, through Indium Corp? —Mark

We find it difficult to find a subcontractor to do these short run assemblies. Getting the bare PCBs made is no problem. Having SMT components properly assembled is a problem. Since we are a subcontractor we cannot promise the large board houses any future volume business if they produce the short run prototypes. So we have a “Catch-22” situation in our business. Our past designs have created product for our clients in volumes of 100K-1M PCBs. Yet we find it difficult to produce the prototypes and lead boards that ultimately produce this larger volume. We have thought of investing in table top pick &amp; place, stencil screens and

A: LT (Low Tombstoning) versions of AIM SnPb and SAC solder pastes are available. These work well with convection reflow ovens and vapour phace. —Andrew Clarke, European Business Manager, AIM A: There are several ways to reduce tombstoning without changing the PWB finish. The two main factors are design and materials. See Toleno, B., Poole, N. “A Materials Based Solution for AntiTombstoning”, APEX 2003. In this study, on a board designed to produce tombstones, we reduced the defects from 444 to 211.

Market for short run prototypes? I run a small R&amp;D business in which we do custom electronic and firmware (software) design. Our typical project produces 2 or 3 prototype PCBs and then 10-20 first beta product boards. From there the client usually sends the design off to a large board house for volume production.

reflow ovens. The cost of these tools are affordable; however, the cost of labor to run these tools may be far below breakeven. Has anyone out there dealt with such problem? How did you resolve it? A: I would not recommend setting up a short run facility for your designs. We explored the same situation a few years ago. Instead of producing first prototypes for clients, we now provide a paper design package which includes schematics, PCB gerbers, and component lists. The production of PCB prototypes is now the responsibility of the client company. And as you elude to above, the client does have the clout to negotiate short-run production with a promise of full production runs later. As a part of our contract, we accept built up prototype units back from the client to perform extensive testing, firmware design, and revisions as necessary. Have we lost much business with this approaoh? Not really, once the client understands the economics of this approach. Furthermore, we are preparing to exit this business in the USA as low cost labor in Asian countries will soon dominate.

These questions and answers are the opinion of the author(s). The Publisher does not accept responsibility for the accuracy or veracity of the information contained on this page.

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Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 37


Teaming for improved ruggedized product reliability New Products

New products Seika Machinery introduces PR1 pocket handy BGA solder ball checker Seika Machinery, Inc., introduces M.S. Engineering Co. Ltd.’s PR1 BGA solder ball checker for fast and accurate inspection of BGA soldering and QFP lead sections. The easy-to-use system is the ideal solution for checking BGA solder balls. The handheld system provides fast and accurate inspection of the soldered points and surface of BGAs, and features a conductive body for ESD. It also enables visual inspection of QFP leads as well as chip parts. As an additional benefit, the small checker (50 x 30 x 15 mm, weighing 25 g) fits in a handy pocket and comes standard with a wrist strap for convenience. www.seikausa.com Manncorp adds two higherthroughput PCB assembly systems to turnkey line-up In response to increased interest from OEMs aiming to cut costs by bringing PCB assembly in-house, Manncorp has expanded the top end of its turnkey lines. The two new systems are the “HighThroughput Flex Line” which includes twin MC-385 pick and place machines with a combined placement rate of 10,000 cph, and the “Box Builder Line” with the MC-

Nordson DAGE launch 4000Plus multi-purpose bondtester Nordson DAGE, a subsidiary of Nordson Corporation, introduces the 4000Plus multi-purpose bondtester. The 4000Plus represents the new industry standard in bond testing, providing unsurpassed data accuracy and repeatability and offering complete confidence in results. The system is able to perform a wide range of shear and pull applications as well as new push functionality up to 50kg. The 4000Plus is suitable for the full spectrum of traditional bond tests as well as meeting the requirements of emerging test applications including ribbon pull, new hot bump pull and fatigue. Ergonomically it also sets new standards with innovative user interfaces. www.nordsondage.com

387 placer that houses a huge 224-feeder capacity. The Flex Line enables assemblers to increase throughput by balancing their line and is Internet-priced at $199,995. The Box Builder Line, with its pick and place having an IPC9850-rated speed of 5,500 cph, is particularly suitable for short-run assemblers who require abundant feeder capacity. The Box Builder is Internet-priced at $139,995. www.manncorp.com Major new functionality in the vSure DFM Product Mentor Graphics Corporation announced the release of the vSure™ version 9.0 product, the successor of Valor Enterprise 3000™ Design-for-Manufacturing (DFM)

38 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

product. The enhancements in this release enable designers to more easily perform extensive DFM analysis during the PCB design process, thus improving their productivity, avoiding costly design re-spins, and speeding the time to target highvolume production. Electronics companies can now better meet their aggressive business goals of getting a more competitive product to market on time and at reduced manufacturing costs. go.mentor.com New upgrade possibilities make the KE-2050/60light mounters even more attractive With the 2050Light and 2060Light, JUKI offers a perfect match for current

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VJ Technologies announces IR pre-heaters with advanced control VJ Technologies, Inc. updated its IR Pre-heater Series, designed to preheat assemblies that require additional heat to compliment manual soldering and desoldering of SMT, through-hole and other thermal applications. The IR Pre-heater Series is designed to work in conjunction with hand soldering and desoldering tools. IR Pre-heaters were developed for manual rework or for use with equipment, such as selective soldering systems for preheating boards to help eliminate board warping prior to rework. The pre-heaters also compliment underpowered rework systems lacking effective bottom heating. VJ Technologies’ infrared pre-heaters provide the additional heat and control required for lead-free applications, especially for multi-layer circuits. www.vjt.com LORD Corporation develops thermal conductivity adhesive LORD Corporation has announced the availability of a new low modulus, high thermal conductivity adhesive. Created in response to a market need for a more flexible, high thermal conductivity adhesive, MT-815 can be used in a variety of applications including as a thermal adhesive for large die, in die attach applications, or as a solder replacement. The first in a series of new low modulus,

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Essemtec upgrades MIS 6.6 software suite Essemtec’s Management Information System (MIS) for SMD placement machines has been enhanced with additional functions, including the support of automatic PCB identification with bar code and the splitting of production and placement data for each individual PCB. MIS is a software suite for the complete work-flow management on SMD pick-and-place machines. The system supports production planning, enables set-up optimization and control, includes a component stock management tool, and stores all production and placement data for traceability. MIS version 6.6 has been optimized for tracing both panels and PCB clusters. With the upgrade, MIS now saves production and assembly data with reference to each individual circuit. Therefore, data can be analyzed and tracked for each PCB. This is particularly important for the medical, automotive and aviation industries. www.essemtec.com

40 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

Printable (PSX-P), a new print-friendly thermal management product. Delivering unprecedented process flexibility, Loctite PSX-P allows for thermal management materials to be deposited using traditional screen and stencil printing methodologies and is offered in both medium dry and extended dry version to accommodate varying manufacturing conditions and requirements. The reliability and performance of PSX-P is consistent with that of Loctite PowerstrateXtreme phasechange films but its paste format enables the material thickness to be adjusted as required. www.henkel.com/electronics. SEHO adds features to GoSelective product line

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DYMAX Corporation addresses this condition and offers accurate intensity and dosage measurements for LED curing equipment. The easy-to-operate ACCU-CAL™ 50-LED radiometer offers accurate measurement of curing energy. This radiometer can measure energy levels emitted from lightguides (3 mm, 5 mm, and 8 mm) and LED flood lamps. A specially designed photo-sensor assembly provides repeatable measurements and protection from high temperatures associated with some LED systems on the market. www.dymax.com Techcon Systems introduces updated product catalog Techcon Systems, a product group of OK International, introduces its updated product catalog.The enhanced catalog highlights the new Easy Flow Blue Piston Series, designed with close tolerances to precisely fit inside the syringe barrel. The Easy Flow Blue Series Piston requires less pressure to dispense fluids consistently and prevent air from becoming trapped during the dispensing process. Techon’s new Techkit TS 6500 Series Cartridge Mixer has also been added to the new product catalog. The catalog also features syringes, needles, cartridges, dispensing guns and accessories. www.techconsystems.com Orthodyne Electronics introduces HD series wire bonders Orthodyne Electronics’ new High Density Series wire bonders are designed to address the demand for smaller, thinner and denser discrete power semiconductor packages such as SO-8, PDFN, PQFN, DSO and DrMos. The HD Series includes the 7200HD dual-head semiconductor bonder and the 7600HD semiconductor Bonder, available in one to four head

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Electronics engineers and electronics products manufacturers seeking to use rapidly advancing laser die cutting technology for membrane switches, flexible circuits and other electronic component fabrication can now determine if the materials they use can be handled by modern laser die cutting technology by sending samples for engineering studies and analyses to the new Spartanics Laser Cutting Applications Laboratory for Materials Research. The Spartanics Laser Die Cutting Applications Laboratory for Materials Research provides no-cost detailed engineering analyses of maximum material thicknesses that can be handled with these different substrates, including brand name materials, correlated to laser power and other variables. To arrange for a no-cost materials analysis of suitability for finishing, marking and other detailing with laser die cutting, contact Mike Bacon, Spartanics VP, at mbacon@spartanics.com. www.spartanics.com The thinnest compliant board-to-board interposer Custom Interconnects, LLC announced the thinnest compliant board-to-board

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42 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

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interposer ever developed: the Thinnerposer®. The Thinnerposer® is expected to draw a great deal of interest from the RF design community. Targeted applications for the new Thinnerposer® technology include UAV/UAS, avionics, radar arrays, space probes and orbital satellites—a natural fit for the superior flexibility, impedance matching, and shock/vibration attributes of this product set. www.custominterconnects. com

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JTAG Technologies announced further advances in the boundary-scan tool arena with the latest release of its development and hardware debug tool, JTAG ProVisionT V1.8, that features on the latest tools CD (release 16 - May 2010). ProVision combines advanced automation with the level of control and precision that engineers demand when creating test programs and in-system programming (ISP) routines for PLDs, FPGAs, flash memories, serial PROMs and other devices. Enhancements to the ProVision version (V1.8) include new pin-level ActiveTest, multi-board and scan bridge support for JFT (Python) script routines, and an expanded ProVision model library covering more than 78,00 devices. www.jtag.com The stock you need, when &amp; where you need it; Paragon VMI service cuts cost of component supply In the wake of recent economic challenges, the pressure is on manufacturers to find new ways to remain competitive. Against this backdrop, Bedford-based Paragon’s Vendor Managed Inventory (VMI) service is fast becoming the supply chain management service of choice for production environments in the UK and beyond. Part of Paragon’s Total

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Release dateVersionMore informationSeptember 10, 2019 4.15 August 13, 2019 4.14 July 18, 2019 4.13 June 27, 2019 June 9, 20194.12 May 14, 2019 4.11 April 16, 2019 4.10 March 14, 2019 4.9.0 Release notes February 26, 2019 4.8.0 Release notes January 16, 2019 4.7.0 Release notes December 11,2018 4.6.0 Release notes November 14, 2018 4.5.0 Release notes October 16, 2018 4.4.0 Release notes September 11, 2018 4.3.0 Release notes August 14, 2018 4.2.0 Release notes July 10, 2018 4.1.0 Release notes June 12, #1 DVD Ripper 1.3.0.8 crack serial keygen, 2018 4.0.0 #1 DVD Ripper 1.3.0.8 crack serial keygen 15, 2018 4.0.0 April 10, 2018 3.18 Release notes March 13, 2018 3.17 February 13, 2018 3.16.0 Release notes January 18, 2018 3.15.0 December 17, 2017 3.14.1 Release notes December 12, 2017 3.14 October 10, 2017 3.11 September 12, 2017 3.9.3 Release notes August 15, 2017 3.9.2 July 11, 2017 3.9.1 June 13, 2017 3.9.1 May 9, 2017 3.9.1 Release notes April 11, #1 DVD Ripper 1.3.0.8 crack serial keygen, 2017 3.9 Release notes February 16, 2017 3.8.4 Release notes January 11, 2017 3.8.3 Release notes December 13, 2016 3.8.2 November 15, 2016 3.8.1 October 11, 2016 3.8.0 KB 3193438 August 22, 2016 3.6.0 KB 3179163 May 10, 2016 3.5.0 KB 3155777 April 12, #1 DVD Ripper 1.3.0.8 crack serial keygen, 2016 3.4.0 KB 3142577 January 5, 2016 3.4.0 KB 3133674

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Domaincom.microsoft.autoupdate2KeyUpdateDeadline.DaysBeforeForcedQuitData TypeIntegerPossible valuesvarious (example: 5)CommentsThere is no default value.

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It seems like the people over at Adobe, have outdone themselves this time! They have taken all the elements that made the previous versions of their multiple award-winning image editing software suites, Photoshop, to the next level! Photoshop CC 2018 has more tools than its predecessors and its user interface is much more intuitive and user-friendly! You will be able to convert your black and white photos to colored ones with just a click of your mouse, while thanks to its state of the art raw image processing algorithms, you will be able to edit and alter your photo, without damaging the original photo!

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There are some various Jogos de Clássico de Graça para Baixar of the pen tool which is provided by the Adobe Photoshop CC 2018. The pen tool provided has the capability of making an accurate flow of lines which could be easily be changed by the help of the anchor points. It also provides the feature of making the freehand lines and drawings, this can be achieved by the help of the freeform tool. It also provides you with a tool named the magnetic pen tool which can help you to merge the path created very close to the outline of the object of an image. This feature could be very helpful for separating them from any particular background.

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When you install Office for Mac, the app icons aren’t automatically added to the dock. To add to the dock, drag the app icon from the Launchpad or the Applications folder. The following steps demonstrates how to drag the icons from the Applications folder. Get free icons of Dock in iOS, Material, Windows and other design styles for web, mobile, and graphic design projects. The free images are pixel perfect to fit your design and available in both png and vector. Download icons in all formats or edit them for your designs. Change Dock preferences on Mac. On your Mac, use Dock System Preferences to change the size of the icons in the Dock, reposition or hide the Dock, and more. To change these preferences, choose Apple menu System Preferences, then click Dock. Open Dock preferences for me.

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© Provided by Business Insider Mac computers offer several ways to address your missing or disappearing Dock issue. MacFormat Magazine/Getty Images

You can fix a disappearing Dock on a Mac computer through a few troubleshooting methods.

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© Ryan Ariano/Business Insider This is the second option in the dropdown menu. Ryan Ariano/Business Insider

3. Select 'Dock.'

© Ryan Ariano/Business Insider The logo will appear mostly black with what looks to be little apps along the icon's bottom. Ryan Ariano/Business Insider

4. If 'Automatically hide and show the Dock' is checked, uncheck the box next to it.

© Ryan Ariano/Business Insider You can also choose to show open applications, animate Dock icon when you click them, and more. Ryan Ariano/Business Insider

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1. Click on your desktop screen until you see the 'Finder' menu appear in the top left corner.

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© Ryan Ariano/Business Insider It should appear in the top left next to the Apple icon. Ryan Ariano/Business Insider

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In macOS, one of the easiest ways to launch any application is through the Dock bar which is at the bottom of the screen by default. You can quickly open the app from there or access related options through the context menu.

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123Pet v6.1.0 :: 2007-09-26 :: 50
123Tag 1.1.13 :: 2002-08-18 :: 27
123Tag 1.11 :: 2004-01-05 :: 27
123Tag 1.14.2 :: 2004-07-01 :: 60
123Tag v1.34 :: 2007-11-24
123Violino German 1.01 :: 2004-02-16 :: 53
123WashAll Professional 3.15 :: 2003-07-19 :: 29
128Gamma Encryption 3.5 :: 2002-10-04 :: 100
12GHOST HISPIRITS XP :: 2004-06-15 :: 75
12Ghost SuperGee v6.0.10 :: 2003-01-05 :: 45
12Ghosts HiSpirts XP 5.05 :: 2002-02-02 :: 66
12Ghosts Pro v21.05b :: 2006-07-11 :: 33
12Ghosts Pro v21.60 :: 2004-06-01 :: 20
12Ghosts SuperGee 6.0 :: 2002-10-04 :: 37
12Ghosts SuperGee 6.1.1 :: 2003-02-02 :: 36
12Ghosts SuperGee 6.1.2 :: 2003-02-02 :: 31
12Ghosts SuperGee 6.15 #1 DVD Ripper 1.3.0.8 crack serial keygen 2003-10-19 :: 28
12Ghosts SuperGee Backup 7.02.3738 :: 2003-11-03 :: 80
12Ghosts SuperGee Shredder 7.02.3738 :: 2003-11-03 :: 77
12Ghosts Wash XP 6.0 :: 2002-10-04 :: 22
13 Out Card Game 4.0 :: 2002-08-02 :: 75
1503 A.D : A New World :: 2004-02-02 :: 93
1503 #1 DVD Ripper 1.3.0.8 crack serial keygen The New Wor s/n: ld :: 2004-05-02 :: 81
1503 AD The New World :: 2003-10-06 :: 85
16 VSTi 2.0.3 :: 2005-06-16 :: 54
1930 Ford Screen Saver Retail :: 2002-02-02 :: 25
1939 BattleFleet 1.5 :: 2003-07-19 :: 17
1999 The World Book Encyclopedia :: 2004-03-15 :: 69
1Click & Lock v2.72 :: 2004-07-20 :: 33
1Click DVD Copy :: 2005-06-18 :: 7
1Click DVD Copy 3.0.0.5 :: 2004-07-16 :: 7
1Click Dvd Copy 4.1 :: 2005-01-23 :: 7
1Click DVD Copy 4.1.1.4 :: 2005-03-07 :: 8
1Click DVD Copy 4.1.1.8 :: 2005-05-21 :: 11
1Click DVD Copy 4.2.9.1 :: 2005-11-07 :: 7
1Click DVD Copy 4.2.9.2 :: 2005-12-12 :: 8
1Click DVD Ripper 2.03 :: 2005-05-03 :: 74
1Click DVD to Divx Avi 1.21 :: 2003-12-15 :: 72
1click dvd to mpeg mpg 1.13 :: 2005-08-02 :: 29
1Click DVD to VCD 2.08 :: 2003-12-15 :: 69
1ClickDc :: 2007-03-10 :: 33
1ClickUnzip 3.00 :: 2002-04-24 :: 50
1ClickWebSlideShow 2.0.0.24 :: 2003-04-02 :: 60
1ClickWebSlideShow 2.0.0.27 :: 2003-05-11 :: 37
1ClickWebSlideShow 2.0.0.28 :: 2003-06-01 :: 70
1DVDRiper v1.2.06 :: 2003-07-26 :: 31
1st Audio MP3 Maker 1.13 :: 2002-07-15 :: 58
1st Audio Splitter Extractor 1.25 :: 2005-02-13 :: 52
1st Bulk Email Direct Sender 1.59 :: 2002-07-02 :: 50
1st Bulk Email Direct Sender 2.10 :: 2002-07-15 :: 19
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1st Bulk Email Direct Sender 2002 1.55 :: 2002-08-02 :: 14
1st Bulk Email Direct Sender 2002 1.59 :: 2002-08-02 :: 18
1st Bulk Email Direct Sender 2002 Build 1.59 :: 2002-09-04 :: 36
1st Choice FTP Pro 8.30 :: 2002-03-01 :: 28
1st Choice FTPPro2000 v7.6 :: 2006-07-11 :: 0
1st Choics Browse 98 4.0 :: 2004-01-18 :: 0
1st Class Image Viewer 6.01 :: 2002-05-15 :: 33
1st Desktop Guard 1.4 :: 2004-03-01 :: 80
1st Desktop Guard 1.5 :: 2004-09-17 :: 71
1st Desktop Guard 1.6 :: 2005-07-18 :: 21
1st Desktop Guard v1.7 :: 2006-05-19 :: 50
1st Desktop Guard v1.8 :: 2006-08-13 :: 45
1st Directory Email Spider 2002 1.18 :: 2002-08-02 :: 30
1st Directory Email Spider 2005 1.30 :: 2005-02-22 :: 57
1st Directory Email Spider.2006 v4.50 :: 2006-08-25 :: 70
1st Directory Email Spider.2006 v4.50-DVT :: 2006-08-22 :: 0
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1st Disk Drive Protector v1.4 :: 2006-08-13 :: 50
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1st Email Address Harvester 1.46 :: 2002-07-02 :: 36
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1st Email Address Spider 2.94 :: 2002-07-15 :: 3
1st Email Address Spider 2005 3.01 :: 2005-02-22 :: 28
1st Email Address Spider.2006 v5.48 :: 2006-05-19 :: 38
1st Email Address Spider.2006 v5.50-DVT :: 2006-07-16 :: 55
1st Email Address Spider.2006 v5.58 :: 2006-08-25 :: 93
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1st Email Address Verifier 1.17 :: 2002-08-02 :: 13
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1st Email Address Verifier.2006 v4.60-DVT :: 2006-08-22 :: 100
1st Email Address Verifier.2006 v4.74 :: 2006-10-22 :: 64
1st Email Adress Spider.2006 v5.70-DVT :: 2006-10-22 :: 64
1st Email Adress Verifier.2006 v4.74-DVT :: 2006-10-22 :: 30
1st Evidence Remover :: 2006-06-27 :: 81
1st Evidence Remover 1.6 :: 2003-11-04 :: 55
1st Evidence Remover 1.7 :: 2004-03-01 :: 69
1st Evidence Remover 2.1 :: 2005-08-22 :: 61
1st Evidence Remover 2.3 :: 2007-09-26 :: 25
1st Evidence Remover v2.2 :: 2006-05-19 :: 54
1st Evidence Remover v2.2 REAL :: 2006-07-10 :: 53
1st Fax Extractor 3.02 :: 2005-03-29 :: 33
1st Fax Extractor v5.56-DVT :: 2006-08-22 :: 83
1st Fax Extractor v5.56_ :: 2006-08-25 :: 25
1st Fax Extractor v5.69 :: 2006-10-22 :: 33
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1st Go Warkanoid II Total Edition 2.89 :: 2003-10-02 :: 82
1st Go Warkanoid II Total v2.8.0 :: 2003-01-05 :: 75
1st Go Warkanoid II WildLife 2.8.1 :: 2003-02-16 :: 46
1st Go Warkanoid II Wildlife Multilingual 2.7.7 :: 2002-03-19 :: 62
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1st HTML Editor 2.03 :: 2003-07-19 :: 27
1st Journal 1.1 :: 2004-02-02 :: 57
1st Look 2.0.1 :: 2005-03-01 :: 23
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1st Mail Bomber Pro :: 2003-06-01 :: 44
1st Mail Sender 2.5 :: 2004-01-15 :: 60
1st Mail Sender 2.6 :: 2005-01-10 :: 83
1st Mail Sender v3.1 :: 2006-08-13 :: 58
1st Mail Server v1.7 :: 2006-08-13 :: 89
1st Mail Server v2.1 :: 2006-12-24 :: 58
1st Mass Mailer 1.8 :: 2003-03-03 :: 30
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1st mass mailer V2.6 :: 2005-09-12 :: 75
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1st MP3 Wav Converter 2.60 :: 2001-09-10 :: 58
1st Network Admin v1.6 :: 2006-08-13 :: 22
1st Network Admin v2.0 :: 2007-01-21 :: 50
1st Screen Lock 6.0 :: 2004-08-01 :: 65
1st Screen Lock v6.4 :: 2006-06-26 :: 44
1st Screen Lock v6.5 :: 2006-08-09 :: 57
1st Screen Saver Studio key v2.0 :: 2006-03-21 :: 28
1st Screensaver PHOTO Studio Pro Plus 2.02.177 :: 2003-05-11 :: 54
1st Security Administrator Pro :: 2003-06-01 :: 26
1st Security Agent 1.2 :: 2002-02-13 :: 25
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1st Security Agent 4.1 :: 2002-10-04 :: 50
1st Security Agent 4.2 :: 2002-10-17 :: 12
1st Security Agent 4.7 :: 2003-06-17 :: 23
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1st Security Agent 5.2 :: 2003-12-15 :: 72
1st Security Agent 5.3 :: 2004-02-16 :: 63
1st Security Agent 6.0 :: 2005-01-03 :: 77
1st Security Agent 6.1 :: 2005-10-17 :: 86
1st Security Agent v4.6 :: 2003-01-05 :: 53
1st Security Agent v6.4 :: 2006-06-26 :: 70
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1st Security Agent with IE Internet Security 6.1 :: 2005-10-17 :: 27
1st Security Agent with IE Internet Security v6.2 :: 2006-05-19 :: 33
1st Security Agent with IE Internet Security v6.3 :: 2006-06-04 :: 33
1st Security Agent with IE Internet Security v6.4 REAL :: 2006-07-10 :: 27
1st Security Agent with IE Internet Security v6.5 :: 2006-08-09 :: 64
1st Security Agent with.1st Screen Lock v6.2 :: 2006-05-19 :: 42
1st Security Agent with.1st Screen Lock v6.3 :: 2006-06-04 :: 18
1st Security Center Pro 4.2 :: 2004-12-16 :: 45
1st Simple HTML Editor 2.0.3 :: 2003-05-18 :: 44
1st Simple HTML Editor 2.1 Build 5 :: 2003-10-19 :: 15
1st SMTP Server 2.2 :: 2003-05-18 :: 87
1st SMTP Server 2.4 :: 2004-03-01 :: 83
1st SMTP Server v2.6 :: 2006-04-04 :: 66
1st SMTP Server v2.7 :: 2006-05-19 :: 62
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1st Sound Recorder :: 2005-04-19 :: 64
1st Sound Recorder 2.5 :: 2002-08-02 :: 47
1st Sound Recorder 4.1.63 :: 2003-02-16 :: 81
1st Sound Recorder 4.1.71 :: 2003-04-02 :: 46
1st Sound Recorder 4.1.75 :: 2003-04-19 :: 91
1st Source 1.0 :: 2004-01-18 :: 46
1st STMP Server 2.5 :: 2004-08-01 :: 54
1st There 1.1 :: 2004-01-18 :: 50
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1st video converter v5.3.7 :: 2004-11-03 :: 42
1st Warkanoid II : Total 2.8.2 :: 2003-02-16 :: 30
1st Warkanoid II : WildLife 2.8.1 :: 2003-02-16 :: 60
1st Warkanoid II : WildLife 2.9.0 :: 2003-07-19 :: 57
1st Webcollector 1.28 :: 2002-08-18 :: 33
1st Webcollector 1.68 :: 2002-10-17 :: 35
1stCalendar :: 2006-10-07 :: 0
1stCalendar 1.1 :: 2005-03-08 :: 44
1stCalendar 1.2 :: 2005-04-08 :: 23
1stclass 3000.5 :: 2002-03-11 :: 76
1step MP to CD.maker 1.2.2 :: 2002-01-23 :: 50
1Step MP3 To Audio CD Maker 2.0.0 :: 2001-09-10 :: 47
1Stop Organizer v1.0 :: 2006-07-11 :: 62
1toX 2.57 :: 2002-01-23 :: 38
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2 2.0 :: 2005-12-29 :: 33
2 Decoder and Streaming Pack 3.0 :: 2005-12-29 :: 40
2 Find MP3 :: 2006-10-04 :: 21
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20/200 2.2 :: 2005-02-17 :: 40
2000 1.08o :: 2005-02-13 :: 100
2000 1.10 :: 2005-04-14 :: 23
2000 1.10.2 :: 2005-02-22 :: 0
2000 1.10.5 :: 2005-10-14 :: 40
2000 1.11.1 :: 2006-03-05 :: 0
2000 Fractal Calendar :: 2006-07-11 :: 50
2000i :: 2004-06-01 :: 28
2000th Firestorm 2.0 (PC) :: 2003-02-14 :: 21
2000th Firestorm 2.0 Screensaver :: 2003-02-14 :: 17
2000th FireStorm Screen Saver :: 2002-01-23 :: 18
2000th HellFire Screen Saver :: 2003-12-28 :: 13
2001 TetRize 2.14 :: 2002-03-19 :: 71
2002 Fifa World Cup Korea Japan :: 2005-10-26 :: 88
2006 Fifa World Cup :: 2006-06-13 :: 49
2006 FIFA World Cup (TM) :: 2006-07-30 :: 72
21 And Fast 1.26.1 :: 2004-02-02 :: 20
21 Dic 5.0 :: 2004-01-18 :: 20
21 Flying Images Screen Saver :: 2002-01-23 :: 58
21 Hearts 1.0 :: 2003-08-17 :: 55
232Analyzer 4.1 :: 2006-03-07 :: 33
232Analyzer v4.3 :: 2006-05-02 :: 58
24x7 Automation Suite 3.4.13 :: 2003-10-02 :: 50
24x7 Automation Suite 3.4.16 :: 2003-12-15 :: 75
24x7 Automation Suite 3.4.17 :: 2004-03-01 :: 50
24x7 Automation Suite 3.4.21 :: 2005-02-13 :: 50
24x7 Automation Suite 3.4.24 :: 2005-02-13 :: 75
24x7 Automation Suite 3.4.5 :: 2003-05-11 :: 25
24x7 Automation Suite 3.4.6 :: 2003-05-18 :: 58
24x7 Automation Suite 3.4.7 :: 2003-06-01 :: 43
24x7 Automation Suite 3.4.8 :: 2003-06-17 :: 68
24x7 Scheduler Java Edition 2.1.104 :: 2005-05-03 :: 52
24x7 Scheduler Java Edition 2.1.95 :: 2005-04-08 :: 30
2BrightSparks SyncBackSE 3.2.7.410 :: 2005-03-18 :: 73
2BrightSparks SyncBackSE 4.0.3 :: 2005-08-23 :: 39
2BrightSparks SyncBackSE 4.0.4 :: 2005-09-21 :: 30
2BrightSparks SyncBackSE 4.0.6 :: 2005-12-07 :: 35
2BrightSparks SyncBackSE v4.0.10 :: 2006-10-18 :: 85
2BrightSparks SyncBackSE v4.0.8 :: 2006-05-11 :: 67
2D 3D Puzzle Dreamy Kiss v1.0 :: 2003-01-05 :: 81
2D 3D Puzzle Flowers No1 v1.0 :: 2003-01-05 :: 88
2D 3D Puzzle Say I Do 1.0 :: 2003-02-02 :: 30
2D 3D Puzzle War Craft No1 1.0 :: 2003-02-02 :: 55
2D 3D Screensaver Maker 3.10 :: 2005-10-31 :: 28
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2D and 3D Animator Deluxe 1.4 :: 2003-03-03 :: 60
2D and 3D Animator Deluxe v1.4 :: 2003-01-05 :: 60
2D DLL Aztec 3.30 :: 2005-01-10 :: 33
2D DLL DataMatrix 3.30 :: 2005-01-10 :: 0
2D DLL MaxiCode 3.30 :: 2005-01-10 :: 100
2D DLL PDF417 3.30 :: 2005-01-10 :: 50
2D DLL RSS 3.30 :: 2005-01-10 :: 0
2D DLL Universal 3.30 :: 2005-01-10
2D IMG Server for IIS 2.0 :: 2005-01-10 :: 50
2D plus 3D_Screensaver_Maker_v3.6 :: 2007-09-26
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2D&3D Animator 1.5 :: 2004-03-01 :: 59
2D+3D Screensaver Maker :: 2007-07-05 :: 30
2Flyer Screensaver Builder 3.0 :: 2002-02-13 :: 27
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2Flyer Screensaver Builder Pro 6.3.5 :: 2004-12-16 :: 80
2Flyer Screensaver Builder Pro 7.0 :: 2005-02-22 :: 78
2Flyer Screensaver Builder Pro 7.1 :: 2005-04-14 :: 65
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2Flyer Screensaver Builder Pro 7.2.0 :: 2005-08-14 :: 35
2Flyer Screensaver Builder Pro 7.3.0 :: 2005-09-21 :: 53
2Flyer Screensaver Builder Pro 7.3.1 :: 2005-10-17 :: 40
2Flyer Screensaver Builder Pro 7.3.2 Screenpresso Pro 1.10.3.0 With Activation Key 2021 [Latest] 2005-11-21 :: 50
2Flyer Screensaver Builder Pro 7.4 :: 2006-02-05 :: 60
2Flyer Screensaver Builder Pro 7.4.1 :: 2006-03-07 :: 45
2Flyer Screensaver Builder Pro v7.5.0 :: 2006-04-04 :: 38
2Flyer Screensaver Builder Pro v7.5.4 :: 2006-09-19 :: 57
2Flyer Screensaver Builder Pro v7.6 :: 2006-11-20 :: 42
2Flyer Screensaver Builder Professional 4.71 :: 2002-08-02 :: 47
2Flyer Screensaver Builder Standard 5.0.2 :: 2003-03-17 :: 31
2Flyer Screensaver Builder v6.2.2 :: 2004-09-10 :: 60
2Gif 2.7 :: 2005-03-01 :: 0
2JPEG 4.0 :: 2002-03-01 :: 72
2Jpeg v2.7 :: 2006-07-11 :: 25
2M Arcade Bubbles 1,3 :: 2003-09-16 :: 30
2M Arcade Bubbles 1.2 :: 2003-08-17 :: 37
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2M Blocks Swapper :: 2004-08-14 :: 33
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2M Blocks Swapper 1.8 :: 2003-09-02 Uninstaller Archives s 42
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2M Bubble Lines 1.0a :: 2005-02-13 :: 42
2M Flower Garden 1,1 :: 2003-09-16 :: 41
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2M Tetrix Collection 1.4 :: 2003-04-19 :: 53
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30 Happy Easter Riddles Screen Saver 5.0 :: 2003-07-19 :: 66
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32 Developers Kit 7.10 :: 2005-01-10 :: 33
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Global SMT & Packaging July 2010 US edition

www.globalsmt.net

The Global Assembly Journal for SMT and Advanced Packaging Professionals

False top coatings of a counterfeit component revealed layer by layer Wafer-level solder sphere placement and its implications Steps toward closing the software quality gap

Volume 10 Number 7 July 2010 ISSN 1474 - 0893

David David Raby Raby Interview Interview Inside Inside NEW NEW PRODUCTS PRODUCTS INDUSTRY INDUSTRY NEWS NEWS INTERNATIONAL INTERNATIONAL DIARY DIARY



Contents

Volume 10, No. 7 July 2010

Global SMT &amp; Packaging is distributed by controlled circulation to qualified personnel. For all others, subscriptions are available at a cost of £181.50 for the current volume (twelve issues), #1 DVD Ripper 1.3.0.8 crack serial keygen. No part of this publication may be reproduced, stored in a retrieval system, transmitted in any form or by any means electronic, mechanical, photocopying, recording or otherwise without prior written consent of the publisher. No responsibility is accepted for the accuracy of information contained in the text, illustrations or advertisements. The opinions expressed in the articles are not necessarily those of the editors or publisher. ISSN No. 1474-0893 © Trafalgar Publications Ltd Designed and Published by Trafalgar Publications Ltd, #1 DVD Ripper 1.3.0.8 crack serial keygen, Bournemouth, United Kingdom Printed by Ovid Bell, Fulton, MO, USA.

Contents 2

Foxconn and the power of tier one EMS companies Trevor Galbraith

European edition

12

Technology Focus

10 False top coatings of a counterfeit component revealed layer by layer Art Ogg, World Micro 14 Wafer-level solder sphere placement and its implications Andrew Strandjord, Thomas Oppert, Thorsten Teutsch, #1 DVD Ripper 1.3.0.8 crack serial keygen, and Ghassem Azdasht, PacTech—Packaging Technologies, Inc.

30

26 Steps toward closing the software quality gap Frederick R. Hume, Data I/O Corporation, and Mary Beth Soloy, Ford Motor Company Special Features

52

30 Interview—David Raby, STI Electronics 32 Show report: SMT/HYBRID/PACKAGING rises above the ashes

regular columns

4

Desoldering braid/solder wick Bob Willis

20 Strong global growth throughout supply chain Walt Custer and Jon Custer-Topai Other Regular Features

6 Industry News 36 SMT Answers 38 New Products

48 Association News 50 IMAPS Europe 52 International Diary

With Inovar’s Shop Floor Tracking, products are tracked from initial kit release until the completed assembly is moved into finished goods.

www.globalsmt.net

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 1


Editorial

Trevor Galbraith

Editorial Offices

Europe Global SMT &amp; Packaging Trafalgar Publications Ltd Unit 18, 2 Lansdowne Crescent Bournemouth Dorset BH1 1SA United Kingdom Tel: +44 (1202) 388997 E-mail: news@globalsmt.net Website: www.globalsmt.net United States Global SMT &amp; Packaging PO Scan Score 2.0 crack serial keygen 7579 Naples, FL 34102, USA Tel: +1 (239) 245-9264 Fax: (239) 236-4682 E-mail: news@globalsmt.net China Global SMT &amp; Packaging Electronics Second Research Institute No.159, Hepin South Road Taiyuan City, PO Box 115, Shanxi, Province 030024, #1 DVD Ripper 1.3.0.8 crack serial keygen, China Tel: +86 (351) 652 3813 Fax: +86 (351) 652 0409 Editor-in-Chief Trevor Galbraith Tel: +44 (0)20 8123 6704 (Europe) Tel: +1 (239) 245-9264 x101 (US) E-mail: editor@globalsmt.net Managing Editor Heather Lackey Tel: +1 (239) 245-9264 x105 E-mail: hglackey@globalsmt.net

Circulation &amp; Subscriptions Kelly Grimm Tel: +1 (239) 245-9264 x106 E-mail: subscriptions@globalsmt.net

Advertising

Global SMT &amp; Packaging offers effective print, web, email and video advertising opportunities. Contact your local sales rep today. Americas—Derek Laborie (print &amp; video) Tel: +1 (239) 245-9264 x102 Mobile: +1 (603) Allavsoft Video Downloader Converter 3.23.7 Build 7903 + Crack [Latest-2022] dlaborie@globalsmt.net Sandy Daneau #1 DVD Ripper 1.3.0.8 crack serial keygen Tel: +1 (239) 245-9264 x104 Cell: +1 (603)-686-3920 sdaneau@globalsmt.net Europe—Andy Kellard Tel: +44 7766 951665 akellard@globalsmt.net Asia/Pacific— Debasish P. Choudhury Tel: +91 120 6453260 dchoudhury@globalsmtindia.in Nitesh Madan +91-9818429457 nmadan@globalsmtindia.in Asia— Carol Chen tancarole@yahoo.com.tw

Editor-in-Chief

Foxconn and the power of tier one EMS companies There have been many column inches expounded on the recent suicides at Foxconn plants, particularly in their South China facility in Shenzhen. While these deaths are tragic, if you compare the number of suicides to the national average per capita, then the Foxconn deaths actually fall below the national average. This is not to say that working and living condition in a Foxconn plant are any great shakes, but the bigger story is the ramifications these sensationalist headlines produce. Not four months ago there was an incident in Juarez where some workers were wrongly told the bus was not available at the end of their shift to take them into town. When one suspicious worker walked outside to verify this and found they had been lied to, a small riot ensued and they started a bonfire at the end of one of the production lines. The negative press was quickly followed by an announcement from Foxconn corporate about their intention to revive attempts to build the industry’s first ‘lights-out” factory. The furor over the suicide jumpers produced another strong reaction from the world’s largest CEM. It started with announcement to double factory workers salaries to around $132 per month. This in itself was a little suspicious. According to the company, this will add 10-12% to the bottom line, but what about these razor thin profit margins of 2-3% we keep hearing about? Nevertheless, it was a generous response to a baying global public that was starting to impact on their biggest customer, Apple. Steve Jobs was duly dispatched to Shenzhen and did a less than convincing PR job. The next step by the EMS giant was more menacing—according

to recent reports, they are planning to move the majority of their manufacturing outside of China. Even to a country the size of China, this is a serious threat, #1 DVD Ripper 1.3.0.8 crack serial keygen. 400,000 workers would be laid-off, making the difficult job the Chinese government has containing social unrest even harder. This reminded me of the time when Hungary applied for membership #1 DVD Ripper 1.3.0.8 crack serial keygen the European Union. A condition of membership was to stop all the capital gains and other tax incentives they offered foreign companies for inward investment. At the time, #1 DVD Ripper 1.3.0.8 crack serial keygen, the biggest reaction came from Flextronics who were the country’s biggest #1 DVD Ripper 1.3.0.8 crack serial keygen. They threatened to pullout if these rules were implemented and the country was forced to go back to the European Union and negotiate a more acceptable phase-out of these incentives over ten years. The power of tier one manufacturers should not be underestimated. Given the number of jobs (albeit low-paid and sometimes in less than desirable conditions), the taxes paid and the spending power of the employees back into the local economy, they make a significant contribution. Notwithstanding the strange number surrounding the recently announced wage hike in Southern China, tier one manufacturers perform a very necessary job in very demanding conditions. These conditions are not set by themselves, or even their customers, but by us, the consumer. The constant goal of smaller, faster, cheaper looks like it may finally be finding its lowest point. —Trevor Galbraith.

Correction: Dr. George Riley, author of the article “New Opportunities for Controlling Pressure in Flip Chip Assembly,” printed in our March issue, is employed by flipchips.com and not Sensor Products Inc.

2 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

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Henkel – Materials Partner of Choice for the Electronics Industry No matter where you are or what your process requires, you can count on Henkel’s expertise. Our unmatched portfolio of advanced materials for the semiconductor and assembly markets, all backed by the innovation, knowledge and support of Henkel’s world-class global team, ensures your success and guarantees a low-risk partnership proposition.


Title

Desoldering braid/solder wick

Bob Willis

Desoldering braid/ solder wick May be low tech but still vital in rework and repair areas

Figure 1. Manual desoldering using solder braid.

Solder wick or braid is supplied in two forms, tin plated or plain copper woven braid which is impregnated with flux. Today the bare copper option is the most popular and most often seen in production. The flux coating helps provide protection to the copper braid during storage and helps the solder wet the braid and capillary quickly during soldering. If is often seen in production that braid held in an operator’s toolbox does not have the same wicking or capillary action during desoldering. This is due to the copper braid ageing, so don’t lock it away or order a large stock to save money—new is best!! Also, don’t let braid supported with liquid flux become part of your standard shop floor operation!! Copper is the preferred braid as it is far easier to see soldering, or rather the desoldering action, taking place. The solder can be seen to wick up into the braid when new material is used along with the correct gauge. It also provides a simple guide to the solderability or the age of the braid being used.

Desoldering single-sided through hole joints with copper braid Solder braid is used in two main applications during assembly: • On conventional through hole boards for solder short removal and on single-sided, non-plated through hole boards for desoldering terminations. Heated vacuum desoldering systems, however, are the preferred method for professional desoldering of plated through hole boards • For the removal of solder from surface mount and area array pads after component removal or during solder short removal on SOIC or on other fine pitch components.

The basic method for using braid is as follows: Solder short removal on through hole and surface mount component terminations. Select a braid width the same size or slightly smaller than the short being removed. This allows the desoldering operation to be seen. It also reduces the heat input required to allow the solder to

4 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

reflow. Clean and tin the iron bit, making sure the bit is the correct size and temperature. Normally the tip temperature would be 600˚F for work on printed circuit boards. The size of the tip would be the same size as the braid width. Before desoldering, make sure the end of #1 DVD Ripper 1.3.0.8 crack serial keygen braid is free from solder. The more braid and solder in contact will affect the time to reflow or the time required on the joint area for all the solder to be removed. Apply the braid onto the surface of the solder short and place the iron tip on to the braid. By tinning the bit the solder on the tip will speed up heat transfer to the braid and the whole desoldering operation. This is often where damage occurs, when operators do not tin the bit and try to speed up heat transfer by applying pressure to the braid that is not necessary. When the solder becomes a liquid, it will wet up the braid by capillary action, but also based on the type and age of the braid. After the solder short has been removed #1 DVD Ripper 1.3.0.8 crack serial keygen the joint, check that the solder remaining on the adjacent joints

www.globalsmt.net


Desoldering braid/solder wick

Figure 2. Avoid having excess braid when desoldering on pads with a wide tip tool.

Figure 3. Avoid braid which has become unwoven.

meets your inspection standard. If it does not, #1 DVD Ripper 1.3.0.8 crack serial keygen, resolder the terminations to meet the standard requirements

may be removed, #1 DVD Ripper 1.3.0.8 crack serial keygen. If all leads have been correctly desoldered, no damage can occur on the pads.

Desoldering non-plated through hole joints Select a braid width the same size or slightly smaller than the solder joint being desoldered. This allows the desoldering operation to be seen it also reduces the heat input required to allow the solder to reflow. Clean and tin the bit on the iron making sure the bit is the correct size and temperature. Normally the tip temperature would be 600F for work on printed circuit boards. The size of the tip would be the same size as the #1 DVD Ripper 1.3.0.8 crack serial keygen width. Before desoldering make sure the end of the braid is free from solder. The #1 DVD Ripper 1.3.0.8 crack serial keygen braid and solder in contact will either affect the time to #1 DVD Ripper 1.3.0.8 crack serial keygen or the time required on the joint area for all the solder to be removed. Staff #1 DVD Ripper 1.3.0.8 crack serial keygen often observed on the shop floor using a solder loaded braid tail several inches long before cutting the braid tail off. Apply the braid onto the surface of the solder joint and place Adobe Premiere Elements v8.0 crack serial keygen iron tip on to the braid. By tinning the bit, the solder on the tip will speed up heat transfer to the braid and the whole de-soldering operation. This is often where damage occurs, when operators do not tin the bit and instead try to speed up heat transfer by applying unnecessary pressure to the braid. It is relatively simple to see solder left between surface pads, normally referred to as sweat joints. After the solder has been removed from the joint, check that the leads of the component are free from the pads and that no damage is visible on the pads. Using tweezers or snip-nose pliers should allow the leads to move freely in the hole. When all leads have been checked the component

Solder removal from surface mount pads In the first place, only remove solder from surface mount pads when it is really necessary. In most cases it is not. It is, however, for many fine pitch and all BGA applications due to the difficulty of replacing the new components or printing paste onto the repair site. Select a braid width the same size or slightly smaller than the pad being reworked. This allows the desoldering operation to be seen; it also reduces the heat input required to allow the solder to reflow. Clean and tin the bit on the iron ensuring the bit is the correct size and temperature. Normally the tip temperature would be 600˚F for work on printed circuit boards. The size of the tip would be the same as the braid width or slightly smaller. Before desoldering, ensure the end of the braid is free from solder. The more braid and solder11—Underfill in contact withreservoir the pad will affect the time to reflow or the time required on the pad area during solder removal. Try and avoid having excess braid when desoldering on pads with a wide tip tool, as shown in Figure 2. It requires more heat/time. Also avoid braid which #1 DVD Ripper 1.3.0.8 crack serial keygen become unwoven as shown in Figure 3. Cut the damaged braid and start again— the capillary action will be faster during desoldering. Apply the braid onto the surface of the pad and place the iron tip on to the braid. By tinning the bit, the solder on the tip will speed up heat transfer to the braid and the whole de-soldering operation.

www.globalsmt.net

This is often where damage occurs, when operators do not tin the bit and instead try to speed up heat transfer by applying unnecessary pressure to the braid. As the braid and solder are directly in contact with the pad, more care needs to be taken during this operation. It is perfectly feasible to desolder pads in this manner provided care is taken and no pressure is applied to the pads. It is not the heat which lifts or misplaces pads, it is the combination of heat and pressure. You can hold the solder on the pad in a liquid for a number of seconds without damage to the bond. If you apply pressure during this stage the pad is lifted. This is due to the bond between the copper and the laminate becoming weak. Remove the heat, and within a minute the original strength of the bond is retained. Remember not to leave pads with no or very little solder on for weeks after desoldering as the pad solderability will deteriorate. In the case of nickel gold plated boards after desoldering, the nickel could be exposed. This will become unsolderable in a matter of days. The most important things to remember: • Use the right size of braid • Use new copper braid • Don’t apply pressure with your iron • Practice makes perfect in everything you do!!!! Bob Willis is a process engineer providing engineering support in conventional and surface mount assembly processes.He runs production lines for suppliers at exhibitions and also provides seminar and workshops world wide. Bob will be presenting Master Classes at SMT Nurenberg in Germany for those engineers visiting the show. For further information on how Bob may be able to support your staff contact him via his web site, bobwillis.co.uk.

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 5


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advantages of electronics manufacturing solutions, traceability and cost savings, #1 DVD Ripper 1.3.0.8 crack serial keygen, view a recent interview with Bob Black, Microscan President Jeff Timms, and Global SMT &amp; Packaging Magazine at http://www.microscan.com/en-us/ TrainingAndResources/Videos/ ApexExpo2010JeffTimmsInterview.aspx. Vi TECHNOLOGY welcomes Koen Gutscoven as worldwide sales VP Vi TECHNOLOGY is pleased to welcome Koen Gutscoven as worldwide sales vicepresident to head up Vi TECHNOLOGY worldwide sales activities. Koen joined ICOS Vision Systems in 1994 as sales manager Asia, and was promoted in 1999 to VP marketing &amp; sales of automatic vision and inspection systems to the semiconductor final assembly industry, where he knows all key players. He was responsible for the Americas, South East Asia, Japan, Korea, #1 DVD Ripper 1.3.0.8 crack serial keygen, China, Hong Kong, Taiwan, Philippines and Europe, including customer application support and internal sales administration. www.vitechnology.com GEM Expo attracts leading names in SMT industry Trafalgar Publications Ltd. announces that many of the biggest names in the SMT industry will be participating in GEM Expo 2010, scheduled to take place October 5-7, 2010 at Expo Center Norte in São Paulo, Brazil. Major companies such as FUJI, Juki, Panasonic, Asymtek, BTU International, #1 DVD Ripper 1.3.0.8 crack serial keygen, MIRAE, Aqueous Technologies, KIC and many more have confirmed their attendance at Brazil’s first dedicated EMS manufacturing event. The show is also supported by all of the key distributors in the region including Hi-Tech, PSP, Celtra, SMA and others. The show will feature IPC Training courses, a series of workshops by international experts and a comprehensive vendor conference. www.gemexpobrazil.com Fabrico and Henkel partner to provide Loctite® bonding, joining &amp; sealing solutions Fabrico is working with Henkel to offer custom, high-performance Loctite® solutions for liquid adhesives for a

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Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 7


Industry News

variety of applications, including coating, gasketing, and potting. The two companies blend Fabrico applications and converting expertise with Loctite high-value products to provide customers with exceptional bonding, joining, fastening, and assembly solutions. www.fabrico.com, www.henkel.com SEHO Academy to provides efficient training, higher knowledge, added value and reduced costs SEHO Systems GmbH introduces the SEHO Academy, an innovative, flexible training concept. By investing in the professional development of its staff, every company can achieve added value and reduce its production costs sustainably. It always is worthwhile to train employees in the professional operation of soldering systems, and the SEHO Academy was developed to help companies do this. SEHO’s training concept, designed to provide employees with required qualifications, delivers optimal performance in practice. Customers can select one #1 DVD Ripper 1.3.0.8 crack serial keygen several training blocks from the existing courses to best suit their individual needs, #1 DVD Ripper 1.3.0.8 crack serial keygen. The seminars are subdivided into three categories: REFLOW, SELECTIVE and WAVE. Each category offers both basic training courses on maintenance of soldering systems as well as optimization of processes and workflow. www.seho.de JJS Electronics extends EMS capabilities UK and Czech Republic-based JJS Electronics has extended its EMS capabilities even further with the appointment of Richard Barratt to the new post of principal NPI engineer. Joining the company as part of the ongoing expansion taking place at its state-of-theart Lutterworth facility following recent growth, the new recruit brings with him extensive new product introduction experience. www.jjselectronics.com Aqueous Technologies sells several machines during IPC APEX Expo Accurex Solutions Pvt. Ltd. of Bangalore, India has purchased the Trident III automatic defluxing and cleanliness testing system. Accurex provides complete engineering services that ensure that both system hardware and software are capable of

performing all testing functions required by customer specifications and test requirements documents. The Trident III will help Accurex evaluate its customers’ test requirements and develop efficient test strategies. Advance Circuit Technology of Rochester, NY, also purchased a Trident III. The Trident III will join contract electronics manufacturer ACT’s impressive repertoire of manufacturing solutions that work together to exceed customer requirements. Finally, Consysis of San Diego, CA, purchased a Zero-Ion g3 ionic contamination (cleanliness) tester. www.aqueoustech.com DYMAX earns export achievement certificate

DYMAX Corporation was recognized by the U.S. Department of Commerce for its innovation and exportation to foreign companies. DYMAX officers were presented the chamber’s Export Achievement Certificate at company headquarters in Torrington, CT, in April. The award recognizes companies that have shown growth in exports, remained in good financial standing, and demonstrated a willingness to talk with other businesses about expanding their export market. Foreign exports are driving DYMAX’s growth and most of the company’s manufacturing and research and development jobs are related to their exports. www.dymax.com DRAM growth approaches record territory, setting stage for best year ever How hot was the DRAM market in the first quarter? So hot that during the first three months of 2010, global DRAM sales exceeded the total for the initial six months of 2009. So hot that the first quarter delivered the third highest quarterly DRAM revenue seen during the past 11 years, #1 DVD Ripper 1.3.0.8 crack serial keygen. So hot that DRAM pricing actually rose in the first quarter compared

8 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

to the fourth quarter of 2009, defying the normal double-digit seasonal decline. Worldwide DRAM revenue in the first quarter of 2010 neared $9.5 billion, up 9.7 percent from $8.7 billion from the fourth quarter of 2009, and up a stunning 181.6 percent from $3.4 billion in the first quarter of 2009. Second-half demand also promises to be even more robust than in the first half as supply growth for the year will not be able to significantly exceed the expansion in demand. www.isuppli.com Televés invests in innovative SIPLACE line The Spanish company Televés S.A., a market leader in radio and TV installation solutions, has been at the forefront of innovations since its foundation in 1958. One of Televés’ main success factors is the 25 years of close cooperation with Siemens Electronics Assembly Systems (SEAS). In order to be prepared for further innovations #1 DVD Ripper 1.3.0.8 crack serial keygen growing product demands, Televés invested once again in a new SMT production line consisting of the latest SIPLACE SX2 and SIPLACE CA (chip assembly) machines. With the new SIPLACE line Televes acquired the potential to cover all future requirements with optimum flexibility combined with bare-die and classic component processing. www.siplace.com Rutronik awarded ESD and Dry Pack certifications Rutronik Elektronische Bauelemente GmbH’s systematic implementation of its quality management has currently been confirmed by a further two certificates: The Electrostatic Discharge (ESD) Protective Measure certification ensures Rutronik’s customers will not receive any components damaged in advance by electrostatic discharge. The Dry Pack Packaging System certificate confirms that Rutronik repackages all moisture-sensitive components solely in accordance with the internationally-approved standards (J-STD 033B.1, J-STD 020D and JEP 113-B). www.rutronik.com

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Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 9


False top coatings of a counterfeit component revealed layer by layer

False top coatings of a counterfeit component revealed layer by layer

Art Ogg, World Micro, Roswell, Georgia, USA Much has been written about the curse of counterfeit electronic components having such a compounding effect on the security and economy of the United States. This paper will demonstrate one of the techniques used by those responsible for polluting the open market inventories of the world with counterfeit components. This sample of a counterfeit component and the photos shown are examples of a real inspection rejection event that successfully detected what could have been a tragic failure in an aerospace, military or mission critical system somewhere in the world. It is the intent of this paper to share the knowledge and experience it took to detect this counterfeit component, with the hope that every organization may benefit from this information.

Introduction The general inspection processes employed to detect the fraudulent examples shown below are contained in the current IDEASTD-1010 inspection standard published by the Independent Distributors of Electronics. See their website at WWW. IDofEA.ORG. The experience of the individual quality inspector can be measurably enhanced by participating in the Professional Inspector Certification Program, also conducted by the IDEA. This effective program of training quality inspectors is known as the IDEA-ICE-3000 Exam.

The suspicious top surface topography was compared to the bottom surface. The bottom surface displayed the typical small and grainy topography of a factory fresh component (Figure 2).

Counterfeit example This is a study conducted on Maxim part number MAX154XXXX. This component is characterized as an ADC single semi flash, 400KSPS 8-bit parallel, 24 pin SOIC component.

Visual inspection #3 During the visual inspection, what appeared to be a false top coating that did not belong on this component was noted. The top and sides were observed under 40X power microscopy to confirm there was indeed a layer that did not come from the factory. In Figure 3, the false top coating is captured in the red highlighted box. The photo is taken from the side of the component looking over the top of the part.

Visual inspection #1 Using the IDEA-STD-1010 visual inspection standard, these components were subjected to the multipoint inspection process. It was immediately noticed that the top surface was very shiny and the texture was smooth. Additionally, the topography of factory fresh components has a small textured surface compared with the somewhat larger texture exhibited by these parts (Figure 1).

Visual inspection #2 As noted above, the top surface had a very smooth and shiny surface. Each of the components in this lot were inspected and found to be equally shiny and smooth. A highly reflective surface on an electronic component is not normally what an inspector would expect to see under examination.

Visual inspection #4 The leads on this component were also given a thorough visual inspection under high-powered microcopy, #1 DVD Ripper 1.3.0.8 crack serial keygen. There were no traces of alteration or counterfeiting

Keywords: Counterfeit Detection, IDEA-STD-1010

Figure 1. Top surface of modified part.

10 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

Figure 2. Bottom surface of modified part.

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False top coatings of a counterfeit component revealed layer by layer

Figure 3. False top known as blacktopping.

activity detected. This will be an important data point in the conclusion of this paper. See Figure 4 to observe that there are no issues of lead coplanarity, corrosion or retinning that may have been the result if subjected to a rework process. Date code comparison Maxim components will routinely have a component date code on both the top and the bottom surfaces. Not all manufacturers take this manufacturing step, but Maxim is one. Notice in Figure 1, the last line has the date code of 9812. This tells the inspector the component was allegedly manufactured during the twelfth (12th) week of 1998. However, notice the date code on the bottom of this component in Figure 2. The bottom line has a date code of 9609, #1 DVD Ripper 1.3.0.8 crack serial keygen. Occasionally a certified inspector will see a variation between the two date codes on a Maxim part of one or maybe even two weeks. Any variance over two weeks is a variance that needs #1 DVD Ripper 1.3.0.8 crack serial keygen explanation. This is a very big “red flag” to an inspector. In this case, the markings tell us that the bottom section of this component was manufactured two years and three weeks prior to the top portion being attached. This is impossible and will never happen. The overconfident counterfeiter has made the assumption that the inspector will not compare the top and bottom date codes and reject the lot based upon the lengthy variations in dates. They will also assume that most activation code for turbotax premium version Archives have no inspection procedure at all and the parts will be received and shipped without anyone taking a look for component flaws such as these.

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Figure 4. Component leads pass inspection.

Resistance to solvents The experienced professional inspector has learned that, in most cases, a mixture of three parts mineral spirits and one part alcohol will remove the ink from a counterfeited component. The reason this happens is the counterfeiter will seldom cure the ink like the original component manufacturer (OCM) does during their production runs. The process where this solution is used to test the ink is known as the “Marker Permanency Test” and is documented in MIL-STD-883. This solution and test procedure was administered to a sample of the components, #1 DVD Ripper 1.3.0.8 crack serial keygen. The results were negative. This is another important data point to be discussed in the conclusion, #1 DVD Ripper 1.3.0.8 crack serial keygen. The experienced professional inspector has also learned that pure acetone will typically remove a false top coating placed on a component. An acetone wash was administered to the top surface of this component with negative results. Component measurements The experienced inspector has been trained to download the component’s datasheet from the Internet. This document has several very important tables, drawings and explanations about the component. One of the more important data points contained in the datasheet is the measurements. In the case of this particular Maxim component, the thickness has a specification of between 1.73 mm and 1.99 mm. A random sample of five parts was taken from the lot and measured. The average thickness between these five parts was 2.36 mm. This resulted in +.63 mm above the shallowest

measurement of 1.73 mm (36%) and +.37 mm (19% out of specification) thicker than the high end of the thickness specification. These components were far above the allowable thickness of acceptability. This will weigh heavily in the preliminary conclusions and how to proceed with proving these parts to be counterfeit. Preliminary conclusions Acceptable inspection findings 1. The texture and topography of the bottom surface is consistent with a factory fresh part. 2. The component leads remain untouched and are in pristine shape. 3. The components are not affected by the normal solvents used to validate if parts are indeed counterfeit.

Unacceptable findings 1. The parts have an untypical shiny reflective top surface. 2. The top surface topography is not consistent with a factory fresh component. 3. High power microscopy shows the addition of a false top coat on the top surface. 4. There is a two-year variance between the top surface date code and the bottom surface date code. This should never happen to a part coming from the factory. 5. The thickness specification has been exceeded by 19% above the high end of the thickness specification. At this point, when the unacceptable findings of this inspection are weighed against the acceptable findings, there is more than enough evidence detected thus far to reject these components due to

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 11


False top coatings of a counterfeit component revealed layer by layer

Figure 5. Clear epoxy top coat material.

quality issues. The inspector has now applied most of the thorough inspection protocols found in the IDEA-STD-1010 inspection standard. The parts could be rightfully rejected at this point. In an attempt to learn more about the techniques being used by this counterfeiter, the decision was made to proceed further. The goal was to reconstruct the steps the

Figure 7. Original component surface.

Figure 6. Clear epoxy removed.

counterfeiter must have taken to produce the modified parts shown in this report Removal of the clear and shiny top coating The use of the solvents normally used to remove false top PlayClaw serial key Archives and uncured ink stampings resulted in failure. Apparently, the counterfeiter has used a process to prevent their use in testing parts for uncured ink stampings. The second attempt to remove the clear top coating also resulted in failure. A razor blade was used to scrape the coating from the top. This step caused more material to be removed than was desired. The decision was made to discontinue this procedure. A piece of the clear coating that was removed from the top appears in Figure 5. The piece, shown in this photo, is estimated to be one-fifth the size of a period used in this report. Under very high-powered

Figure 8. Layers of counterfeiting rework.

microscopy (300X), it was established that the thin clear top coating is actually just partially clear. The top layer of the false coating directly below the clear coat can be easily observed. Apparently, #1 DVD Ripper 1.3.0.8 crack serial keygen, over time the clear epoxy coating has absorbed some quantity of the material used in the false top coat directly below it. It has become dark in color as shown #1 DVD Ripper 1.3.0.8 crack serial keygen Figure 5. Small pieces of 3M 401Q Imperial™ Wetordry™ 2,000 grit sandpaper was applied to one side of the component as shown in Figure 6. ESD tape was applied to the left side of this component to protect it from the abrasive qualities of the sanding. The right side was slowly abraded until the clear top coating was removed. The sanding process continued until the part markings were still visible on the right side, but all of the highly reflective material had been removed. All that remains in this photo on the right side depicts the beginning of the false top coat. A calibrated caliper was used to measure the #1 DVD Ripper 1.3.0.8 crack serial keygen of the component to the right of the red line. The thickness of the clear coating was determined to be .05 mm thick. The component was further abraded to remove the entire thickness of the false top coat applied to this part. The same process and sandpaper used to remove the clear epoxy was also used to remove the false top coating. Once the entire false top coating had been removed, the component thickness was once again measured with the calipers. The component was now back to its original thickness and measured 1.86 mm, placing it well within the 1.73 mm-1.99 mm specification. Figure 7 shows the original component

12 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

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False top coatings of a counterfeit DL Trade Ad 4_9:Layout 1 5/1/09 3:49 PM component Page 1 revealed layer by layer

surface the component would have had when it left the factory. At this point the part has had all of the material placed on it by the counterfeiters to conceal the true identity of the part. Important items to notice Figure 7 shows the original top surface and markings as it came from the factory. Notice the original P/N was MAX154ACWG and the date code was 9609, shown on the bottom line. Figure 1 shows this same part at the beginning of this investigation prior to any testing or chemical analysis being conducted. Notice the new P/N placed on the part by the counterfeiters is MAX154BEWG and the date code is 9812. The original date code on the part is two years and three weeks older than the newer #1 DVD Ripper 1.3.0.8 crack serial keygen code placed on the false top coat. The original P/N has a suffix of “ACWG,” meaning it had an operating temperature of (0˚C to + 70˚C). The second P/N placed on the part has a suffix of “BEWG,” meaning it had an operating temperature of (-40˚C to +80˚C). Figure 8 illustrates the layers of rework that were done on the counterfeit component. Layer 1 is the original component measuring 1.86 mm thick with the original part number ink stamped showing MAX154ACWG. Layer 2 shows the original part number and the original date code of 9609. Layer 3 is a .45 mm thick false black topping placed on the top to hide the original P/N. It was made from a material that would not dissolve in acetone. This is very unusual since most false coatings will wash away using this solvent. Layer 4 is the new part number of MAX154BEWG and a new date code of 9812. Layer 5 is the clear coating of epoxy that is .04 mm thick. Epoxy is a material that is not affected by an acetone wash. It was placed there to prevent failure #1 DVD Ripper 1.3.0.8 crack serial keygen the marker permanency test used by a certified inspector. Overall conclusions The workmanship on these parts is exceptional. The materials used, the clear epoxy top coating and the black topping placed over the original top surface were chosen to prevent detection by the usual marker permanency test and the use of acetone for testing false top coatings. An inexperienced inspector may not have detected these reworked parts. The

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visual attributes that gave them away were that the top surface topography did not match the bottom surface, the clear coating was shiny and reflective, and the date code on the top did not match the one on the bottom, #1 DVD Ripper 1.3.0.8 crack serial keygen. The ultimate proof, however, was the remarked part number that was for a part that can operate in a much wider temperature range, meaning it is more expensive, and that the original date of the part was two years younger than the remarked date code. By definition, this is a

reworked part. Art Ogg, World Micro’s director of quality, is responsible for World Micro’s quality initiatives, product quality, ISO certifications, technical documentation and quality team. Prior to joining World Micro, Mr. Ogg held senior management positions with Seagate Technology and Digital Equipment Corporation. He brings 40 years of high tech electronics experience to his position, and is noted expert and regular speaker at industry trade events.

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 13


Wafer-level solder sphere placement and its implications

Wafer-level solder sphere placement and its implications

Andrew Strandjord, Thomas Oppert, Thorsten Teutsch, and Ghassem Azdasht, PacTech—Packaging Technologies, Inc., Nauen, Germany There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing, electroplating, or sphere dropping1. The choice between these technologies is highly influenced by the following criteria: the bump size &amp; pitch requirements, cost and overall yield. As the bumping industry evolves, many of the deficiencies and trade-offs associated with the three bumping technologies are no longer acceptable. As a consequence, a significant transition is occurring toward a fourth bumping alternative: solder sphere placement2. This technique offers wide flexibility in bump size (40760 µm), very high bump yields (&gt;&gt;99%) and low cost (sphere price dominated). Keywords: Solder #1 DVD Ripper 1.3.0.8 crack serial keygen, Solder Sphere, Ball Placement, Sphere Transfer, Flip Chip, WLCSP

Figure 1. Ultra-SB2™ solder sphere placement tool.

Introduction Solder bumping is often separated into several different categories: flip chip bumping (FC), wafer level chip scale packaging (WLCSP) and ball grid array (BGA). This categorization and affiliated nomenclature is partially based on the solder bump size and the type of equipment used to create the bump. Pushing the limits of each of the three traditional bumping technologies has allowed some overlap between these bumping classifications. But for the most part, volume manufacturing of flip chip, WLCSP, and BGA bumps are carried out using different processes steps on different types of equipment. Solder sphere placement is a technique that has been

shown to completely bridge this technology gap. The basic principle of this technology is to simultaneously pick up preformed solder spheres using a patterned vacuum plate and then accurately place them onto the bond pads of the wafer. The solder sphere placement technique allows a single technology to be used for an array of different bumping applications. These include: Advanced Installer 15.6 license key Archives All wafer sizes from 100 to 300 mm and fan-out substrates • All solder alloys (lead based, lead-free, polymer core) • FC, WLCSP, and BGA bump sizes (60760 μm spheres) This up-and-coming technology has been associated with several different names in the literature. These include: gang ball placement, solder ball transfer, wafer level solder sphere transfer, ultra solder ball bumping, and solder sphere placement, #1 DVD Ripper 1.3.0.8 crack serial keygen. The versatility of this technology can be further enhanced by coupling several other technologies into the solder sphere placement system. These include adding: 2D inspection capabilities, single sphere removal and replacement capabilities (repair and rework), and in-situ solder reflow (inert atmosphere hotplate). The ultimate solder sphere placement system incorporates all of these discrete technologies into a single tool in order to increase versatility and assure high yields.

Figure 2. Solder sphere reservoir filled with solder spheres.

14 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

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Wafer-level solder sphere CAMTASIA 8 [May 2020] crack serial keygen and its implications

allowed the technique of solder sphere placement to expand within the industry. Typical lead-free spheres (SAC alloys) range in price between $25-50 per million when purchased in volume. As the volume of sphere consumption continues to increase, the cost will continue to come down. Spheres of other alloys, including polymer core and copper core spheres, are also starting to become more prevalent within the industry as alternatives to SAC alloys. Figure 3. Sphere placement head positioned over the solder sphere reservoir.

Figure 4. Sphere placement head lowered onto sphere reservoir. Vacuum and ultrasonics applied to reservoir.

Figure 5. Shear placement head with solder spheres passing over deionizing air knife to remove any excess spheres.

Figure 6. A pre-fluxed wafer is automatically placed onto the vacuum wafer chuck.

The final configuration of the tool is often dictated by the product distribution (flip chip vs WLCSP vs BGA volumes). Wafers or substrates for WLCSP and BGA applications have relatively large solder bumps and have relatively few interconnects compared to flip chip applications. These larger spheres are placed in extremely high yields by the solder sphere placement tool and the

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added expense of incorporating inspection and rework capabilities might not be justified. High I/O flip chip applications, on the other hand, often require very high bump yields in order to achieve high die yields. In these applications, integration of all the options makes good economical and throughput sense. The recent availability of highly uniform solder spheres at lower costs has

Process flow A predetermined number of spheres are automatically dispensed into a sphere reservoir (Figure 2). The amount of spheres in this reservoir is important in order to achieve high transfer yields. This value is approximately 20-30% more than the number of I/O on the wafer. The fixture which picks up the spheres consists of two main components: a vacuum head which is mounted to a high precision x-y-z translation stage and a tooling plate which contains small holes that is mechanically mounted to the vacuum head (Figure 3). The tooling plate is patterned with openings that correspond directly with the locations of the I/O pads on the wafer, #1 DVD Ripper 1.3.0.8 crack serial keygen. This tooling is created using similar methods to that of making a nickel-plated surface-mount stencil. There are a large number of vendors who can now manufacture these stencils using #1 DVD Ripper 1.3.0.8 crack serial keygen techniques. The size of openings in the tooling plate is designed to be slightly smaller than the size of spheres that will be placed onto the wafer. The sphere placement head is then lowered onto the sphere reservoir and the vacuum is applied to the vacuum port (Figure 4). The vacuum alone is not sufficient to efficiently transport and relocate the solder spheres into each opening in the stencil template. The application of ultrasonics is applied to the reservoir to aid in sphere movement. Optimization of the ultrasonic amplitude and frequency, #1 DVD Ripper 1.3.0.8 crack serial keygen, in addition to the vacuum, is required for each spheres size and I/O density in order to maximize sphere relocation to the template. Even with this optimization, an unwanted sphere can occasionally adhere to the stencil. This is commonly a result of static electricity. Removal of these extra spheres is accomplished passing the head over a deionizing air knife (Figure 5). The placement head is then moved over to the transfer station within the tool, #1 DVD Ripper 1.3.0.8 crack serial keygen. A prefluxed wafer has been pre-positioned from a wafer cassette onto the

Global SMT &amp; Packaging â&amp;#x20AC;&amp;#x201C; Celebrating 10 Years â&amp;#x20AC;&amp;#x201C; July 2010 â&amp;#x20AC;&amp;#x201C; 15


Wafer-level solder sphere placement and its implications

Figure 7. Optical sensor extended between the wafer and placement head. Aligning the template to the wafer and also inspecting for missing or unwanted spheres.

Figure 8. Tooling head lowered on wafer to bring spheres into contact with #1 DVD Ripper 1.3.0.8 crack serial keygen fluxed wafer pads.

Figure 9. Raise placement head and insert optical sensor over wafer.

Figure 10. SB2 repair head positioned over a pad with a missing solder bump.

vacuum chuck at this station (Figure 6). The application of tacky flux is applied in a separate tool prior to being loaded into the sphere placement tool. For WLCSP and BGA applications, screen-printing or stencil printing are used to apply this flux.

For flip chip applications, spin coating is used to apply the flux. The important criteria for all applications include flux thickness and viscosity. The solder transfer head is then moved over the wafer chuck and a bidirectional

16 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

optical sensor is extended in between the head and the chuck (Figure 7). This inspection system allows the spheres within the apertures of the stencil template to be aligned to the bond pads on the wafer. In addition to alignment, this sensor performs a 2D scan of the stencil template to confirm that all apertures contain a solder sphere and also inspects for unwanted stray spheres that may still be attached to the template. The tool software can then make a decision based on user criteria to continue to the transfer step, return further cleaning at the air knife station, or go completely back to the sphere pickup station to fill in empty apertures with spheres. The solder placement head is then lowered toward the wafer until the solder spheres penetrate the flux and touch the wafer bond pads (Figure 8). The mechanical downward force is adjusted #1 DVD Ripper 1.3.0.8 crack serial keygen help drive the spheres onto the pads. The vacuum is then released and a N2 back pressure is applied to the placement head to assist in releasing the spheres. The head is then raised and the optical inspection sensor is reinserted over the wafer, and the wafer is scanned to quantify transfer yields #1 DVD Ripper 1.3.0.8 crack serial keygen 9). This scan will document the x-y coordinates of any missing or misplaced spheres that may have moved after the transfer process. For flip chip applications, where high bump yields are an absolute requirement to give high die yields, integration of rework/repair capabilities is critical. It is common for high-end applications, such as microprocessors, to have hundreds of interconnects per die. Even small bump yield losses can translate into high die yield losses. A repair head, which is based on the SB2 ™ sphere bumping process3, is used to repair any defects identified in the 2D inspection (Figure 10), #1 DVD Ripper 1.3.0.8 crack serial keygen. For missing bumps, a sphere is dropped onto the pad where the bump is missing. This process has no mechanical contact with the wafer and solder bumps are deposited at a rate of 6-10 spheres per second. For misplaced or damaged spheres, the capillary head of the SB2 tool is lowered over the sphere, the capillary heated, and a vacuum is applied to the tube, which removes the sphere. In both cases a laser pulse can be added to help liquify the flux or melt the solder sphere. The wafer is then ready for final reflow. For most WLCSP and BGA devices the wafers are placed back into the wafer cassette. Once all 25 wafers are bumped, the cassette is moved over to a linear

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SEM

IC We ON s #91 t 1


Wafer-level solder sphere placement and its implications

conduction oven for reflow. Alternatively the wafers can be moved over to a reflow chamber located within in the tool (Figure 11). This is more common for fine pitch flip chip devices. After reflow, the wafers are placed back into the process cassette and cleaned in a batch process using a combination of ultrasonics, solvents and water rinsing (Figure 12). Conclusions The wafer level solder sphere placement tool can perform flip chip, WLCSP, and BGA bumping operations (Figure 13). The configuration of the tool is dictated by the product distribution (Tables 1 and 2). Defects in the ppm range result in die yields greater than 99%. Wafer throughputs are between 20-45 wafers per hour. Acknowledgements The authors would like to thank all the engineers and technicians of PacTech for their help in developing the solder sphere placement technology. References 1. D, #1 DVD Ripper 1.3.0.8 crack serial keygen. S. Patterson, #1 DVD Ripper 1.3.0.8 crack serial keygen, P. Elenius, and J. Leal, “Wafer Bumping Technologies – A comparative analysis of Solder Deposition Processes and Assembly Considerations”, EEP Vol. 19-1, Advances in Electronic Packaging, Hawaii, 1997, pp. 337-351.

M. Whitmore, M. Staddon, D. Manessis: “Development of a Low Cost Wafer-Level Bumping Technique”, International Wafer-Level Packaging Conference, 2004.

Figure 11. Solder bumps reflowed on heated vacuum chuck.

Figure 12. Bumped, reflowed and cleaned wafer.

Process Step

Equipment

Process Step

Equipment

1. Flux deposition

Stencil or screen printer

1. Fluxing

Spin coating

2. Sphere transfer

Basic solder sphere placement

2a. Sphere transfer

Integrated solder sphere placement tool

3. Reflow

Linear oven

4. Wafer clean

Solvent and/or DI water tools

d. Hot plate reflow

5. Inspection

2D scanner

3. Wafer clean

Table 1. Process steps for WLCSP and BGA applications.

b. 2D inspection c. Rework

Solvent and/or DI water

Table 2. Process steps for flip chip applications.

J. Ling, T. Strothmann, D. Stepniak, P, #1 DVD Ripper 1.3.0.8 crack serial keygen. Elanius, “Flex-On-Cap Solder Bump for 300mm Wafer”, Semicon, Singapore, 2001. T. Flynn, C.W. Argento, and J.Obrien, “Electro-plated flip chip Wafer Bumping Interconnect Technology Solutions for the 21st Century”, Proceedings of International Symposium on Microelectronics, Chicago, Illinois, October 26-28, 1999, pp. 8-12. 2. K. Tatsumi, K, #1 DVD Ripper 1.3.0.8 crack serial keygen. Shimokawa, E. Hashino, Y. Ohzeki, T. Nakamori, and M.Tanaka, “Micro-Ball Bumping Technology for flip chip”, The International Journal of Microcircuits and Electronic Packaging, Volume

Figure 13. SEM image of 60 μm flip chip bumps and 300 μm WLCSP solder bumps.

22, Number 2, Second Quarter 1999 (ISSN 1063-1674), pp.127-136. Andrew Strandjord, Thorsten Teutsch, Axel Scheffler, Thomas Oppert, Ghassem Azdasht, and Elke Zakel, “WLCSP Production Using Electroless Ni/Au Plating #1 DVD Ripper 1.3.0.8 crack serial keygen Wafer Level Solder Sphere Transfer Technology”, #1 DVD Ripper 1.3.0.8 crack serial keygen, IWLPC, San Jose, CA, October 14th, 2008.

18 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

Andrew Strandjord “Solder Ball Transfer for flip chip and WLCSP”, Advanced Packaging, March 19, 2008. 3. P . Kasulke, W. Schmidt, L. Titerle, H. Bohnaker, T. Oppert, E. Zakel, “Solder Ball Bumper SB2-A flexible manufacturing tool for 3-dimensional sensor and microsystem packages”, Proceedings of the International Continued on page 25

www.globalsmt.net


Addressing package advancement challenges with innovative contactor probe technology

SEM

IC We ON #63 st 56

www.globalsmt.net

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 19


Integrated testing, modeling and failure Strong global growth throughout supplyanalysis chain of CSPnl for board level reliability

Walt Custer and Jon Custer-Topai

Strong global growth throughout supply chain Using global semiconductor shipments as a measure of world electronic manufacturing activity, Chart 1 shows the magnitude and timing of our most recent global recession (&amp; recovery) relative to the “Internet Bubble” crash of 2001/2002. Recovery was much quicker in 2010, thanks to dramatically better inventory control. Ten years ago, large finished goods and electronic component stocks had to be consumed (or written off) before new purchases could resume. That is not the case today. Chart 2 is a companion to Chart 1, showing 3-month growth (rather than actual US$) of monthly world semiconductor shipments. 3/12 chip growth recently peaked (at a whopping +58%) in March. The early-2010 massive chip shipment growth rates were of course calculated relative to Advanced uninstaller Pro n6.7.4 crack serial keygen deep trough of early 2009. As we look to the second half of this year, growth will slow (chip shipments will still be increasing but at a more moderate pace). 2010 should still end with almost a 20100604

25

30% semiconductor expansion compared to last year. From Chart 1 note that world April 2010 chip shipments exceeded their precrash high of 2008. The global electronics industry has quickly recovered (to pre-crash levels)! Global electronic equipment shipment growth (Chart 3) is now in positive territory (3/12 &gt; 1.0) in all regions. Converted to monthly US dollars (Chart 4), the vast majority of the present electronic equipment production expansion is in SE Asia—but all regions are improving. Looking forward, #1 DVD Ripper 1.3.0.8 crack serial keygen shipments (Chart 5) are projected to jump 28.6% in 2010 followed by an added 5.6% in 2011, with further growth until at least 2012. Semiconductor capital spending (Chart 6) is forecasted to increase 83.5% this year and then an additional 13.9% in 2011. Spending for capital equipment (Chart 7) remains highly volatile! Feast or famine #1 DVD Ripper 1.3.0.8 crack serial keygen the rule! World printed circuit shipments

World Semiconductor Shipments

US$ Billions (3-month average)

20100604

3-Month Growth Rates on $ Basis

1.6

3/12 Rate of Change

1

2

1.4

8

6

3

13

10

5 4

1.2

15

End markets • Worldwide IT spending will increase by 3.8% this year at constant currency, #1 DVD Ripper 1.3.0.8 crack serial keygen, to $1.47 trillion; hardware to grow 6.4% at constant currency; IT market will increase by 13.7% in China, and by 13.8% in India.—IDC • Digital #1 DVD Ripper 1.3.0.8 crack serial keygen grew 62%y/y in 2009 to 800 billion gigabytes (0.8 Zettabytes).—EMC

Global Semiconductor Shipments

Monthly US$

20

are also strong (Chart 8) with SE Asia dominating global production. On a consolidated (world) basis PCB shipments dropped about 20% in 2009 but now appear to be on track for 28% growth this year (up from Custer Consulting Group’s +20% growth #1 DVD Ripper 1.3.0.8 crack serial keygen made in early 2010). Most supply chain prognosticators have recently revised their 2010 forecasts upwards due to stronger than expected demand. The global recovery is certainly well underway as we move into the normal late summer/early autumn “busy season.”

7

9 11

12

1 10

0.8

2009 recession much sharper but shorter than 2001

5

0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10

SIA

Chart 1.

20 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

0.6 0.4 1591591591591591591591591591591591591591591591591591591591591591591591591591591 5/10 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10

Total $ Shipments from All Countries to an Area SIA website: www.sia-online.org/

Chart 2.

www.globalsmt.net


Strong global growth throughout supply chain

• Chinese electronics manufacturing

export delivery value increased 24.4% y/y and 5.7% m/m to CNY 267.8 billion in April 2010.—MIIT • Global smart homes market will grow at a 16.5% CAGR from 2009 to 2014 to $13.4 billion by 2014. Computers &amp; peripherals • Worldwide mobile PC shipments grew 43.4% y/y to 49.4 million units in 1Q10.—Gartner • Global PC shipments will rise 22% to 376.6 million units in 2010 plus an additional 10 million media tablets.— Gartner • Notebook sales rose 21% to $36.1 billion in 1Q’10. —Gartner • Worldwide media tablets shipments will reach 7.6 million in 2010.—IDC • Netbook shipments are expected to grow from 36.3 million in 2009 to 58 million in 2010.—ABI Research • Stereo 3-D PC market shipments will rise from rising from nearly one million to 75 million by 2014.—Jon

users in April 2010 reaching a total of 786.5 million.—MIIT Consumer electronics • U.S. household spent $1,380 (on an average) on consumer electronics products in the past 12 months, an increase of $151 from last year.—CEA • Global 3D TV shipments are expected to grow from 4.2 million units in 2010 to 12.9 million units in 2011, 27.4 million units in 2012 and 78.1 million units in 2015.—iSuppli • U.S. videogame hardware, software and accessories sales fell to $766.2 million in April from $1.03 billion a year earlier.—NPD Group Automotive electronic systems are expected to rise from $125 billion in 2009 to $244 billion by 2017.—Strategy Analytics Global commercial navigation system shipments will grow from 3 million units in 2010 to 7.5 million units in 2015.—ABI Research

expected to increase 4.6% y/y to $10.4 billion in #1 DVD Ripper 1.3.0.8 crack serial keygen • HDD industry will deliver more than 300,000 petabytes of storage capacity over the next five years to enterprise datacenters and clouds.—IDC • Worldwide hardcopy peripheral shipments grew 9.1% y/y to 28.7 million units in 1Q10.—IDC Mobile communications • Worldwide mobile phone sales to end users grew 17% to 314.7 million units in 1Q10.—Gartner • Worldwide converged mobile device (smartphone) market grew 56.7% y/y to 54.7 million units in 1Q10.—IDC • Handset navigation shipments will rise from 30 million units in 2010 to 181 million units in 2015.—ABI Research Forecast • Touch screen shipments expanded 29% y/y to 606 million units in 2009.—DisplaySearch 20100620

20100620

Global Electronic Equipment Shipment Growth

1.6

• China #1 DVD Ripper 1.3.0.8 crack serial keygen 8.497 million phone

Peddie Research

• Worldwide server market revenue is

Converted @ Constant 2008 Exchange Rates

Taiwan/China Europe Japan USA 0

3/12 rate of growth in local currency

1.5 1.4

World Electronic Equipment Monthly Shipments

100

$ Billions

N America

Europe

Japan

SE Asia

80

1.3 1.2

60

1.1 1

40

0.9 0.8

20

0.7

Europe = Eurostat EU27 NACE C26 (computer, iTubeGo YouTube Downloader Crack For Pc &amp; optical products)

0.6

1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 7 10 1 4 02 03 04 05 06 07 08 09 10 00 01

0 1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 02 03 04 05 06 07 08 09 10 00 01

CALENDAR YEAR

Source: Custer Consulting Group

Chart 3.

Chart 4.

20100622

Worldwide Semiconductor Market by Geography WSTS Forecast 350.0

20100622

Worldwide Semiconductor Capital Spending

+28.6% +5.6% 320.0

300.0 250.0

213.1

204.4

200.0 150.0

227.4

247.7 255.6 248.6

-9%

291.0

307.4

70.0 60.0

226.3

138.9 140.8

63.4 +83.5 %

44.0

30.0

47.5

+13.9 %

54.1

58.3

51.7

49.4

-41%

25.9

20.0 10.0

50.0

Asia Pacific Japan Europe N, #1 DVD Ripper 1.3.0.8 crack serial keygen. America

60.0

40.0

166.3

149.4

$ Billions

50.0

100.0

0.0

CALENDAR YEAR

0.0 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 37.2 32.8 31.9 47.5

51.3 46.7 42.3 64.1

39.8 33.1 30.2 35.8

51.2 30.5 27.8 31.3

62.8 38.9 32.3 32.3

88.8 45.8 39.4 39.1

103.5 44.1 39.1 40.7

116.5 46.4 39.9 44.9

123.5 48.8 41.0 42.3

124.0 48.5 38.2 37.9

119.6 38.3 29.9 38.5

159.9 44.8 38.2 48.1

169.6 47.3 40.1 50.4

177.1 49.2 41.6 52.1

Other Capital Spending Automated Test Equip Packaging &amp; Assembly Equip Wafer Fab Equip

WSTS 6/2010

Gartner 6/2010

Chart 5.

Chart 6.

www.globalsmt.net

2006 17.9 4.1 5.4 32.5

2007 18.7 3.6 5.2 36.0

2008 13.3 2.4 4.0 24.2

2009 9.3 1.1 2.7 12.7

2010 12.1 2.7 5.5 27.2

2011 16.3 3.0 5.6 29.1

2012 17.5 2.8 5.0 33.0

2013 16.9 2.1 3.4 29.3

2014 14.8 2.3 3.9 28.4

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 21


Strong global growth throughout supply chain

20100622

Semiconductor Capital Equipment Shipments by Area 16.0

$ Billions

14.0

13.0 12.9 11.7

12.0 10.0

11.3

11.0

10.1

9.8

8.0

9.4

8.7 8.8

10.3

11.2 10.811.0 9.8

9.6 9.6

9.4 7.6

10.6

8.0 8.0

7.8

6.6

6.0

7.5 6.6

5.7

5.6 4.1 4.1

4.0

4.7

5.1

5.6 4.4

4.9

5.7

5.4 4.6

4.5 3.1

2.7

2.0 0.0 ROW China Taiwan Korea N America Japan Europe

1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 2 3 4 1 01 02 03 04 05 06 07 08 09 10 00

1.1 1.5 1.7 1.6 1.2 0.3 0.8 0.4 0.4 0.7 0.9 0.5 0.8 4.4 4.9 2.3 0.8 2.4 2.2 1.4

2.5 1.2 3.2 1.8 1.5

2.5 0.9 3.5 2.6 1.7

2.0 0.9 3.9 2.6 1.9

1.1 1.0 3.0 3.4 1.6

1.0 0.5 2.2 1.8 1.0

0.7 0.3 1.7 1.5 0.7

0.4 0.4 1.4 1.0 0.6

0.5 0.3 1.5 0.9 0.4

1.1 0.4 1.3 0.8 0.5

1.1 0.5 1.6 1.1 0.5

0.8 0.6 1.6 1.0 0.6

0.5 1.1 1.4 1.3 0.5

1.2 1.0 1.1 1.5 0.7

0.3 1.9 2.0 1.5 1.2 2.2 0.8

1.5 0.9 1.7 1.1 1.4 2.0 0.9

0.7 0.5 1.9 1.2 1.4 2.1 0.9

0.7 0.4 2.2 0.9 1.7 2.0 0.9

0.7 0.3 1.4 2.3 1.6 2.1 0.9

0.7 0.2 1.6 1.2 1.4 1.6 0.8

0.7 0.4 1.3 1.0 1.4 2.5 0.7

0.7 0.4 1.4 1.3 1.3 2.0 0.9

0.8 0.4 1.6 1.8 1.8 2.3 0.9

1.0 0.6 1.8 1.5 1.8 1.9 0.9

1.0 0.9 1.9 2.0 1.8 2.7 0.9

0.9 0.5 2.1 1.8 1.9 2.3 0.9

0.8 0.7 2.0 2.5 1.8 2.3 0.8

0.6 1.2 3.2 1.8 1.5 2.1 0.6

0.8 0.5 3.2 1.6 1.7 2.6 0.8

0.8 0.5 2.3 1.6 1.6 2.4 0.7

0.7 0.8 2.4 1.7 1.8 2.4 0.7

0.8 0.5 1.5 1.4 1.3 1.9 0.5

0.8 0.4 0.8 1.2 1.1 1.7 0.6

0.4 0.2 0.4 0.5 1.4 1.1 0.6

0.1 0.1 0.3 0.3 1.1 0.8 0.4

0.2 0.1 0.7 0.4 0.7 0.3 0.2

0.5 0.4 1.4 0.8 0.7 0.5 0.2

0.6 0.3 2.0 1.1 0.9 0.6 0.3

0.8 0.4 2.2 1.9 0.9 0.9 0.3

www.semi.org, 6/2010

Chart 7.

EMS, ODM &amp; related assembly • EMS industry had 11 merger #1 DVD Ripper 1.3.0.8 crack serial keygen acquisitions in 1Q10.—Lincoln International • Solar contract manufacturing is expected to grow from 1,100 MW in 2010 to 4.1 GW in 2014.—iSuppli Ability Enterprise set up production base in eastern China for cameras, video recorders, optical lenses, digital photo frames, LCD monitors and projectors. Adeptron received a US$ 1.3 million EMS contract from a defense OEM customer and a $1.5 million assembly order for smart grid applications. Aero Stanrew obtained BE EN 9100:2003 and ISO 9001:2008 certifications. Assel added a NORDSON Asymtek SL-940 conformal coating system and a TC2600 V4 IR oven. Assembly Contracts entered a contract manufacturing partnership with Cinterion. Bogart invested in a MYDATA P&amp;P SMT line with jet printer MY500 and vaporphase reflow soldering system. Celestica: • received a manufacturing order for LumiSmart devices from Cavet Technologies. • received an outsourcing agreement from HP Ireland that included the transfer of 140 workers. China Wireless Technologies will open a handset assembly plant in India by 2012. Compal earned US$0.064 EPS in 1Q10, becoming world‘s most profitable NB contract manufacturer. CSM added an Asymtek Century C-740

automated, conformal coating application system. MacBooster 8.0.5 Crack Free & License Key [Latest Version] 2021 Systems ended operations, #1 DVD Ripper 1.3.0.8 crack serial keygen. Elcoteq: • Bangalore received Excellent Award from Quality Circle Forum of India, #1 DVD Ripper 1.3.0.8 crack serial keygen. • becomes Sharp’s partner for the KIN Windows phones. • elected Jorma Vanhanen chairman and Heikki Horstia deputy chairman. • #1 DVD Ripper 1.3.0.8 crack serial keygen ZAO Elcoteq (St Petersburg, Russia) operation to Optogan CJSC. 20100620

3500

Electronqiue Lacroix Tunisia obtained EN9100 certification. Elprog added an Assembléon pick &amp; place machine and screen printer. EPE moved to larger facility to accommodate 150% growth over past three years. EPIC Technologies received Volkswagen Group Award, 2010. #1 DVD Ripper 1.3.0.8 crack serial keygen Europe launched used SMT division. Flextronics: • celebrated production of 25,000 Redbox DVD rental kiosks in Creedmoor, North Carolina. • expanded Citrix Systems’ partnership to include joint design of new hardware products. • was named ‘Strategic Partner of the Year’ and ‘Best-in-Class’ supplier by LSI. • expanded notebook PC capacity in China to 15 million units/ yr. • received solar panel manufacturing contract from SunPower. • added 1,500 workers at its NB PC production in Taiwan. Foxconn /Hon Hai: • installed safety nets and asked workers to sign ‘no suicide’ agreement at its Shenzhen, China plant, #1 DVD Ripper 1.3.0.8 crack serial keygen. • employees were arrested for stealing $60,000 in processors at the Santa Teresa plant in Mexico. • received Dell enterprise notebook orders for 2011. • plans to ship 24 million 4G iPhones in 2010. Frontline India added a DEK Horizon 03iX platform.

World PCB Monthly Shipments

Converted @ Constant 2008 Exchange Rates N America

Europe

Japan

SE Asia

3000 2500 2000 1500 1000 500 0 1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 99 00 01 02 03 04 05 06 07 08 09 10

Source: Custer Consulting Group

CALENDAR YEAR

Chart 8.

22 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

www.globalsmt.net


Surface Mount Technology

AOI solutions to reduce defective PCBAs

automotive

consumer computer telecom Innovative by Synapse

3DSPI

Fast and Compact

Large board

5K

SERIES

Dual-lane

7KDL SERIES

CREATING VALUE www.vitechnology.com


Strong global growth throughout supply chain 20100620

World PCB Shipments (with forecast)

Converted @ Constant 2008 Exchange Rates 60

50

$ Billion Assumptions: Europe = composite European SIA &amp; local PCB assoc data Japan &amp; N. America from JPCA &amp; IPC data Taiwan/China based upon 44 rigid &amp; flex company composite Rest of Asia growth #1 DVD Ripper 1.3.0.8 crack serial keygen Taiwan/China 44 company composite Data scaled to match Henderson Ventures annual totals 2007 based upon sum of monthly totals

+28%

-20%

40

30

20

31.6 38.6 31.2 29.4 31.7 37.6

42.9 51.7 54.3 51.1 40.9 52.6

1 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 3 5 7 9111 01 02 03 04 05 06 07 08 09 10 11 99 00

CALENDAR YEAR Source: Custer Consulting Group - synthesized from Henderson Ventures annual estimates and N. American, Japanese &amp; Taiwan/China monthly PCB shipments and SIA European chip shipments

Chart 9.

Hanza Intressenter acquired all outstanding shares of Hanza from HSF Group. Incap received a rotor component manufacturing supply contract from ABB Oy, Machines. Interphase Engineering expanded its design &amp; contract manufacturing services. Itron added 40 new jobs and $4 million in new equipment. Jabil implemented carbon footprint, on-demand program throughout entire organization. JJS Electronics: • appointed Richard Barratt principal NPI engineer. • developed training process which promotes step-by-step analysis supported by pictorial guidance. Kimball Electronics received a manufacturing contract for Third Eye retroscopes from Avantis Medical Systems. King Jim began offering EMS services in Malaysia. Kitron received a NOK 45 million/year contract for electronics manufacturing and assembly of industrial tools from Atlas Copco Tools. LaBarge: • received ANSI/ESD S20.20 certification at its Appleton (WI), Pittsburgh (PA) and Tulsa (OK) manufacturing facilities. • received a $1.5 million electronic assemblies contract from Northrop Grumman for F-16 fighter fire control radar system, #1 DVD Ripper 1.3.0.8 crack serial keygen. Macrotron Systems moved to 75,000 SF

manufacturing plant in Fremont, CA. Nortech Systems acquired Trivirix. PartnerTech added six Trumpf machines at its new Myslowice, Poland, plant. Plexus: • received a solar inverter EMS contract from Sustainable Energy Partners. • invested in a 1,800 SF Renewable Energy Lab. Proxy Electronics (Sweden) filed for bankruptcy protection. Sanmina-SCI Israel Medical Systems is spending $10 million to build a plant in Suzhou, China. Season Group expanded into the U.S. with the acquisition of DC Electronics and its San Antonio facility. SinoHub commenced operations at its new 77,500 SF mobile phone manufacturing facility in Shenzhen, China. SMTC began providing Kontron with PCB and module level assembly manufacturing in Chihuahua, Mexico, and Dongguan, China. Sparton received a $830,000 manufacturing contract for SP3004D digital compass for military warfare equipment, #1 DVD Ripper 1.3.0.8 crack serial keygen. Spectrum Control received $13.1m multiyear contract for complex microwave assembly. Stadium Electronics appointed Peter O’Keeffe business improvement manager. Suntron consolidated its Manchester, NH, and Lawrence, MA, operations into a larger facility in Methuen, MA. Surface Mount Technology: • completed renovation of SMT

24 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

Engineering, LLC.

• will add 25,000 additional SF of manufacturing space by 4Q’10. Televés S.A. invested in a SMT production line consisting of Siplace SX2 and Siplace CA (chip assembly) machines. Vega Grieshaber KG (Schiltach, Germany) implemented Siplace Facts for its SMT production inventory management system, #1 DVD Ripper 1.3.0.8 crack serial keygen. Victron: • opened Victron de Mexico. • passed UL DQS’ tri-annual audit of ISO14001:2004 Environmental Management System, and ISO9001:2008 and ISO13485:2003 quality systems. Videoton Electronics Assembly Services received a EMS manufacturing contract from Linak for furniture electronics. Xenterio appointed Ernst Gockel sales &amp; marketing manager. Materials &amp; process equipment Industrial automation electronics equipment (excluding software and services) revenue declined 14.3% y/y to $74.9 billion in 2009.—IMS Research Azuma renewed its PCB copper plating lines. 3M: • Electronic Solutions Division introduced a halogen-free embedded capacitance material. • released its material library for ANSYS simulation software. Agilent Technologies acquired Varian, #1 DVD Ripper 1.3.0.8 crack serial keygen. AIM appointed Andy Dolan business development manager. Arlon and Rogers Corporation resolved their patent infringement litigation. BASF will expand its annual methanesulfonic acid capacity in Ludwigshafen, Germany, to 30,000 tons. Chemtura opened a Technical Center of Excellence in Nanjing, China for the AsiaPacific region. ChipChecker launched electrical inspection services. Co-Tech • is developing copper foils for electric car batteries. • will ship 15,000 tons of copper foil in 2010. CyberOptics named Daniel Good VP of corporate development and Tim Skunes VP of technology and business development. DEK expanded its presence in South America in partnership with Fuji Do Brasil. DKN Research began supplying substrates for printable electronics engineering trials. Dow Electronic Materials: • opened a new iData Transfer Archives - Kali Software Crack and

www.globalsmt.net


Strong global growth throughout supply chain

• development center in Seoul, Korea. • received Excellent Supplier award from

HannStar Board. Dow Europe raised epoxy products prices in Europe. Electro Scientific Industries received Provectus Award for advanced IP processes. EMC will ramp up CCL capacity at each of its plants in Taiwan and China in 4Q. Europlacer opened 3,000 SF facility in Tampa, Florida. Fabrico and Henkel entered a partnership for Loctite bonding, #1 DVD Ripper 1.3.0.8 crack serial keygen, joining &amp; sealing solutions. Furukawa Electric will expand capacity for general grade copper foil for rigid PCBs to 1,200 tons/ month with construction of 2nd factory in Taiwan which is scheduled for operation at end of fiscal 2014. GCT started production at its diamond coating facility in Weingarten, Germany. GOEPEL electronic and InterElectronic Hungary entered a partnership to distribute AOI systems for electronic assemblies in Hungary and Romania. Isola received OHSAS 18001:2007 and DIN EN ISO 14001:2004 3-year recertification from TÜV Rheinland (Technical Inspection Authority). Kester appointed Michael Fullbrecht European sales manager. Laird released a low-cost high-performance thermal substrate for LED module applications. Mallinckrodt Baker: • named former Rohm &amp; Haas CEO Raj Gupta chairman. • is expanding its solar panel and flatscreen TV businesses. Manncorp introduced two “HighThroughput Flex Lines” turnkey SMT lines, which include twin MC-385 pick and place machines and “Box Builder Line” with MC-387 placer. Nissan Chemical developed a organicinorganic hybrid polymer for optical printed circuit boards. Park Electrochemical: • elected Emily Groehl to its board of directors. • appointed Dr. Ke Wang director of research &amp; development and W. Douglas Leys director of advanced material applications. • introduced E-710 Easycure low temperature cure epoxy prepreg. Seica named Zero Defects International its North American sales agent for bare board flying probes. Siemens Electronics Assembly Systems (SEAS) introduced capacity-on-demand business models: SIPLACE Peak Demand and SIPLACE Floating Demand. Sun Chemical named Toryon

www.globalsmt.net

Technologies its national distributor for circuit product materials. Taiflex PV’s back sheet factory in China began production in July. Tamura started volume production of a flexible black light absorber for flexible circuits designed as LED module substrates. Taiwan Glass Industrial plans to raise glass fabric capacity by 20,000 tons in 2H’11. Ticona acquired Dupont LCP and PCT product lines. T-Tech introduced its Quick Circuit QCJ5 advanced prototyping system. TUC expanded its CCL front-end processing capacity to 300,000 units/ month. Unimicron began offering Shocking Technologies’ XStatic™ voltage switchable dielectric material to its customers. Vi TECHNOLOGY appointed Koen Gutscoven worldwide VP of sales. Viking: • formed an equipment supply and service division for the electronics production industry. • Test named Peter Collins sales manager Walt Custer is an independent consultant who monitors and offers a daily news service and market reports on the PCB and assembly automation and semiconductor industries. He can be contacted at walt@custerconsulting.com or visit www.custerconsulting.com. Jon Custer-Topai is vice president of Custer Consulting Group and responsible for the corporation’s market research and news analysis activities. Jon is a member of the IPC and active in the Technology Marketing Research Council. He can be contacted at jon@custerconsulting.com.

Wafer-level solder sphere placement and its implications— continued from page 18

1. Electronics Manufacturing Technology Symposium (22nd IEMT), Berlin, #1 DVD Ripper 1.3.0.8 crack serial keygen, April 27-29, 1998. Elke Zakel, Lars Titerle, #1 DVD Ripper 1.3.0.8 crack serial keygen, Thomas Oppert, Ronald G. Blankenhorn, “High Speed Laser Solder Jetting Technology for Optoelectronics and MEMS Packaging”, Proceedings of the International Conference on Electronics Packaging (Tokyo, Japan), Apr. 17-19, 2002. Andrew Strandjord is senior manager of advanced packaging at PacTech USA. He received his Ph.D, #1 DVD Ripper 1.3.0.8 crack serial keygen. in organic chemistry from the University of Minnesota. strandjord@pactech-usa.com Mr. Oppert is vice president global sales &amp; marketing at PacTech in Nauen, Germany. He earned a master’s degree in electrical engineering from the Technical University of Berlin in 1995. Thomas Oppert has co-authored more than 50 technical papers related to semiconductor packaging. oppert@pactech.de Dr. Thorsten Teutsch is president of PacTech-USA. He received his Ph.D. in physical chemistry and surface science from Fritz-Haber Institute of the Max Planck Society. Teutsch@pactech-usa.com Mr. Ghassem Azdasht is co-founder and CTO of PacTech GmbH. He studied mechanical engineering and laser technologies at the Technical University Berlin. Mr. Azdasht has authored of over 100 publications and patents related to wire bonding, #1 DVD Ripper 1.3.0.8 crack serial keygen chip, and laser assembly. azdasht@pactech.de

Global SMT &amp; #1 DVD Ripper 1.3.0.8 crack serial keygen – Celebrating 10 Years – July 2010 – 25


Steps toward closing the software quality gap

Steps toward closing the software quality gap Frederick R. Hume, Data I/O Corporation, and Mary Beth Soloy, Ford Motor Company

The production programming process of loading firmware into the semiconductor device must be controlled if the quality and integrity of the software content in the outgoing product is to be assured. Keywords: Quality, Firmware, #1 DVD Ripper 1.3.0.8 crack serial keygen, Production Programming

A few years ago, while visiting a successful United States manufacturer of networking and communications equipment, the host provided a tour of the facility including a walk through their programming center filled with equipment from many vendors. A colleague asked, “Do you ever find circuit boards on the factory floor that contain devices mis-programmed with the wrong software?” Our host’s response was “It happens all the time.” It is surprising that a gap in quality methods of this apparent frequency was accepted as matter-of-fact. In an era when Six Sigma #1 DVD Ripper 1.3.0.8 crack serial keygen statistical methods have been widely deployed to drive out process variation throughout the factory, here was an example of a leading manufacturer that seemingly had no demonstrable control of the programming process for loading firmware1 into their products. The circuit boards containing the mis-programmed devices had to be identified during test, thus reducing first-pass yield, and required rework before delivery to final assembly. While one might suspect that this firm’s experience is an anomaly, a deviation from good manufacturing practice isolated to a few firms, these gaps in quality methods are far more common than one could have expected. The sophisticated quality methods that industry has deployed have been focused primarily on hardware,

things that are visible, that are built by their factory. However, the software is generally built outside of the factory and then released to the factory electronically to be loaded into the device or product as a data file. In this way, it circumvents the normal quality control processes used with hardware production so mistakes in the loading of the data file are not found until circuit boards fail to operate correctly. In most cases, the result is scrap and/or rework in the factory, but in some cases the defect is not discovered until the product is in the field. A leading wireless handset manufacturer recently delivered 200,000 phones to a well-known Fortune 50 service provider in the US. Half of the phones operated correctly; the other 100,000 did not and had to be returned to the manufacturer. The subsequent investigation found that the phones were built on two production lines. One line was using the correct programming algorithm; the other wasn’t, #1 DVD Ripper 1.3.0.8 crack serial keygen. The expense to identify which phone was built on which production line #1 DVD Ripper 1.3.0.8 crack serial keygen then to return the incorrectly programmed phones to the factory for rework ran into the millions of dollars. This error could have been identified earlier or eliminated with the use of a simple data collection plan and a statistical test such as Chi-Square to show

Figure 1. Typical firmware supply chain. 1 The term firmware used in this article refers to the software programmed into a semiconductor device such as a microcontroller or Flash memory that contains non-volatile memory. This software often represents a firm’s most valuable intellectual property.

26 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

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Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 27


Steps toward closing the software quality gap

the difference in production output from the different lines. A typical firmware supply chain is shown Auto clicker mouse and board keygen,serial,crack,generator the flow chart in Figure 1. Many firms assume that because their software, or source code, is under revision control during development and release they have a quality process. Unfortunately, their process may fail to account for the multitude of mistakes that are possible when loading the software into a semiconductor device shown as production programming in the flow chart in Figure 1. Production Author Archives: admin involves selecting the appropriate data file to be loaded into the semiconductor device, selecting the appropriate algorithm for the device, actual setup of the programming equipment, physical handling of the devices during programming, and operation of the programming equipment. Mistakes in any of these may lead to defective devices on the circuit board or to devices that contain the wrong firmware. Table 1 identifies a number of the common mistakes possible at this step that lead to scrap and rework and, if not detected during test, may lead to field failures. While these fifteen are the most common mistakes, more than forty potential mistakes have been identified. Although many of the common mistakes are easily identifiable and have minor consequences, some of them are not easily detected and have severe financial consequences in terms of the scrap and rework. In cases where the mistakes are not detected until products are deployed at the customer’s location, the damage to a firm’s reputation may be more significant than the cost of the corrective action. This is an opportunity to utilize a Cause and Effects Matrix or Failure Mode Effects Analysis (FMEA) to plan for what could go wrong and put prevention in place based on the severity, #1 DVD Ripper 1.3.0.8 crack serial keygen, occurrence and ease of detection. Figure 2 graphs the frequency and impact of the fifteen common mistakes from Table 1. While these data do not have statistical significance, #1 DVD Ripper 1.3.0.8 crack serial keygen, since they are drawn by one programming equipment manufacturer from the experience of its customers in a variety of industries and countries, we have no reason to believe that they are not representative of many other firms’ experiences as well. As you can see from this chart, some of the frequently recurring mistakes have substantial impact (1, 7, and 10). With respect to mistakes in handling

Category

Common mistakes in:

Failure to create jobs correctly

1. Handling of data files 2. Choosing the appropriate algorithm or adapter or both 3. Identifying the device to be programmed

Failure to run the programming job correctly

4. Starting or stopping jobs

Failure to operate equipment correctly

7. Setting up the equipment

5. Acting on machine error messages 6. Setting up the job 8. Selecting package files 9. Loading software/firmware 10. Physically handling devices 11. Preventative maintenance

Failure to achieve statistical process control

12. Extracting information from equipment log files 13. Supervisory monitoring of the programming process Correlating yield statistics across equipment platforms Detecting non-conforming lots

Table 1. Common mistakes in firmware process control. Source: Data I/O Corporation.2

data files (item 1 in the chart above), an electronics manufacturing firm in China recently told us that they used more than one hundred types of data files and “sometimes the operator just programs the wrong data.” These errors tend to occur most often when the firm is using a manual process to load the firmware into the semiconductor device or circuit board. Automated methods for loading firmware can eliminate many of these mistakes and particularly the ones that have the greatest financial impact. Also, automation provides a means for closing the loop around the process achieving effective process control by generating log files that can tie revision levels of the firmware to manufacturing dates or serial numbers. This provides a high-integrity means to ensure configuration control and traceability of the finished product that extends beyond #1 DVD Ripper 1.3.0.8 crack serial keygen to include the firmware. Yield and trend information can also be extracted from the log files. One automotive electronics manufacturer located in the Southeast of the USA uses automated equipment to load the firmware that also connects to barcode scanning equipment. This Poka-Yoke/ Mistakeproofing enables them to ensure that the algorithm and data file are the correct ones, both for the semiconductor device and for the circuit board. Automated methods for loading firmware also provide a means for remotely monitoring the programming process even when it is conducted in factories halfway

around the world. Statistical information, such as knowing the number of devices being programmed each day, enables a firm to track production levels, yield, and other vital manufacturing data including downtime to ensure effective control regardless how disintegrated the supply chain. A recent IBM survey3 of 1,130 CEOs of electronics manufacturing companies found that 43% of them were worried about counterfeiting and piracy, but it appears there is a disconnect between Mahogany Row and the factory floor as the programming process presents one of the greatest vulnerabilities with respect to the potential loss of a firm’s intellectual property, #1 DVD Ripper 1.3.0.8 crack serial keygen. With manual programming, multiple copies of the firmware reside on multiple sets of equipment in an unprotected state and subject to theft. Using automated programming solutions, however, it is possible to encrypt data files and transmit them to remote manufacturing sites securely. Once there, the files remained stored in an encrypted state on a secure server. Access to the data files can be restricted to authorized personnel. Files remain encrypted until decrypted inside of the automated programming equipment where they are not easily accessed by operators. System level software incorporated in the automated equipment also has the means to program encrypted serial numbers that contain vital information about the manufacturing process such as when, where, who. Even if a manufacturer

Extracted from calls for assistance to the firm’s customer service organization. “The Enterprise of the Future; The Global CEO Study 2008.” IBM Institute for Business Value. May 2008

2 3

28 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

www.globalsmt.net


Steps toward closing the software quality gap

of software IP and injection of malware as wireless. As the electronic 3600CPH = 120 + (8mm) feeders component units SQ foot print = L (42”) x W (42”) (ECUs) within the MaX Board Size: 558.8mm (22.0”) x 609.59mm (24.0”) vehicle proliferate and the data communication 4000C = Traditional Dependability + New Technology between the vehicle and the external world increases, the exposure is magnified. There is no reason ® to assume that automotive electronics systems will not become future targets for criminal activity. The production programming process of loading firmware into the semiconductor #1 DVD Ripper 1.3.0.8 crack serial keygen must be controlled if For more info visit: www.goppm.com the quality and Email: ppm@goppm.com or Call: 603.895.5112 integrity of the Windows is a registered trademark of Microsoft Corporation software content in the outgoing product is to be provides for the real-time monitoring of assured. Automation of this process, while yield and job statistics to ensure effective not a panacea, #1 DVD Ripper 1.3.0.8 crack serial keygen, can substantially reduce process control. Security software can the potential for mistakes that result in also be added to program encrypted serial scrap and/or rework. Automation also numbers to further ensure traceability and configuration control over the firmware supply chain throughout the software life cycle.

is unable to prevent the theft of its intellectual property, it can later read back the encrypted serial number to ascertain when and where the loss occurred. This is particularly useful if a firm subcontracts production to facilities outside of its direct control. The point of production programming (deployment) is also the easiest place in the software life cycle (requirements, design, coding, testing, deployment and operations) to add malware4 without the risk of detection. Malware has become so commonplace that a recent study found that each US adult had a 66% chance of experiencing at least one data exposure in 20085. We are now beginning to see the increasing risk with wireless handsets as they begin to take over many of the functions normally performed by personal computers and store sensitive data. Rich Cannings, security leader for the Android operating system (OS), recently said, “The smartphone OS will become a major security target. Attackers can already hit millions of victims with a smartphone attack, and soon that number will be even larger. I think this will become an epiphany to malware authors.”6 The point of production programming must be protected since malware injected at this point circumvents the extensive filtering for spam and malicious content provided by the wireless carriers. Fortunately the same methods that protect the software from theft at this point also provide protection from the injection of spurious content. Automotive electronics systems share the same vulnerabilities to the theft

Severe Not Easily Detectable

Lesson 1 :

$28,750.00

5

1

7

Frederick R. Hume is president and CEO of Data I/O Corporation, Redmond, WA, #1 DVD Ripper 1.3.0.8 crack serial keygen. Mary Beth Soloy, ASQ CQE, CRE, CSSBB, is the global product development quality functional lead with Ford Motor Company.

10

FINANCIAL IMPACT

9 15

Not Severe Easily Detectable

3

4

14

6

13

8

2

11

Seldom

Occasionally

FREQUENCY Figure 2. Frequency and impact of the fifteen common mistakes

www.globalsmt.net

12

Frequently

4 Malware, short for malicious software, is software designed to infiltrate or damage a product and may take a variety of forms such as hostile, intrusive, or annoying software. 5 Chang, Frederick R, #1 DVD Ripper 1.3.0.8 crack serial keygen. “Is Your Computer Secure? SCIENCE, Vol. 325, p550, 31 July 2009 6 Cannings, Rich, Usenix Security Symposium, 13 August 2009

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 29


Interview

Interview—David Raby, STI Electronics David Raby is CEO of one of America’s most successful tier 3 EMS manufacturing companies. A past president of SMTA, David and his father, #1 DVD Ripper 1.3.0.8 crack serial keygen, Jim Raby, have grown STI Electronics from a small contracting house to a multi-faceted business with a unique business model, #1 DVD Ripper 1.3.0.8 crack serial keygen. Trevor Galbraith spoke to David about the origins and evolution of STI #1 DVD Ripper 1.3.0.8 crack serial keygen. David, your father, Jim Raby, founded the business. Can you tell us the origins of STI Electronics? Actually, the whole family founded the company, but it was #1 DVD Ripper 1.3.0.8 crack serial keygen on Dad’s expertise. He had spent his career with NASA and the US Navy studying and testing electrical connections as well as developing manufacturing, quality and training specifications for their contractors. In 1982, we incorporated Soldering Technology International—Mom (Ellen) was the only “full time” employee—and began conducting seminars around the country teaching government contractors how to successfully and efficiently #1 DVD Ripper 1.3.0.8 crack serial keygen military hardware to MIL-STD-2000. By 1984, the business had outgrown Mom &amp; Dad’s living room in Ridgecrest, California and we opened an office in San Dimas, California. Dad left his government job and began consulting on a full time basis. I left my “real job” in early 1985 to manage the business side and hope we could all make a living for some period of time. We also soon began to do some hand solder training of companies’ operators and, because of their requests, #1 DVD Ripper 1.3.0.8 crack serial keygen, began selling training kits very similar to the ones we still sell today. In 1993, we moved back home to Madison, Alabama, #1 DVD Ripper 1.3.0.8 crack serial keygen, and eventually changed our name to STI Electronics. At the end of 2008, we moved about 500 yards into our current 54,000 ft2 building in Madison. The business is divided into three unique business segments. Can you explain the rationale behind this and how the three business units integrate with each other? We are unusual in the combination of businesses we operate, but we believe they

all complement each other. Our original consulting business led to what is now our #1 DVD Ripper 1.3.0.8 crack serial keygen Services department, which includes our Prototype and Manufacturing area, our Analytical/Failure Analysis Lab, and our Microelectronics Lab. If you are working with any of those areas, you are building (or contemplating building) a product and should be able to benefit from our Training Resources department. Training Resources consists of Training Services, which provides IPC and NASA certifications as well as customized training, and Training Materials, which provides training kits, dummy parts and other training materials and aids. If you are using either of the above departments, you are building hardware and can use our Distribution Sales department, which provides primarily benchtop equipment as #1 DVD Ripper 1.3.0.8 crack serial keygen as consumable manufacturing materials (solder, flux, etc…). If you use our Distribution Sales department, obviously you are a candidate for our Engineering Services and Training Resources areas…. From the outside, they may seem like an odd combination of businesses, #1 DVD Ripper 1.3.0.8 crack serial keygen, but the reality is that anyone who uses one probably has a need for at least one and probably both of the others. It also helps our customers tremendously

30 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

when they have issues arise, because of the unmatched variety of expertise we have under one roof. One of our biggest challenges through the years has been educating customers of one department on all of our capabilities in other areas. STI invented and patented embedded active die technology. Can you explain the features and benefits of this technology and the most likely applications? STI’s Imbedded Component/Die Technology (IC/DT) is helping customers

www.globalsmt.net


Interview

address size, weight, and power problems (SWAP). IC/DT is all about size reduction—utilization of the smallest form factor components and bare die available today. This reduction in component size allows STI to imbed these bare die minus their secondary packaging to achieve the lowest size and weight possible. Utilizing these small form factor devices and lowest power driven devices allows STI to meet and reduce #1 DVD Ripper 1.3.0.8 crack serial keygen requirements and thus gain battery life and minimize power consumption while maximizing heat dissipation. SWAP is a major driver in military and some industrial applications. IC/DT also helps with component obsolescence because, as die size shrinks over time, the wiring out format does not change, but the package size does, which drives redesign of the printed circuit boards. Guidance systems and power supplies are great applications for IC/DT, as well as sensors and monitoring devices. You have a well-equipped failure analysis laboratory. Typically, what differentiates your lab from other facilities, and is the business US-based or further afield? The percentage of international business in our Analytical/Failure Analysis Lab is higher than in any other segment of STI. We perform analysis work from the component level through printed circuit board fabrication all the way to fully assembled system level analysis. We also perform material qualifications from the component level thru PCB fabrication and ultimately at the fully assembled state. This level of detail allows STI to differentiate ourselves from the competition because not only can we perform analytical services for customers, but with our prototype line we also have the capability to replicate the variables of their processes and truly understand the problems. The ability to use all our departments’ expertise to give solutions that are proven and correct is the main difference between our lab and other labs. STI have been involved in IPC Standards from the early days of the association. Recently, you were awarded a contract with IPC to update the existing IPC-A-610 and J-STD-001 training and certification programs from the D to the recently released E revision of the standards. Can you tell us about what was changed as part of the update? Many changes have been made to the documents as IPC’s staff and industry committee volunteers work to make sure

www.globalsmt.net

the IPC-A-610 and J-STD-001 documents are in agreement with each other and contain new component package styles and technology as needed. The most notable changes in the E revision of J-STD-001 are the addition of criteria for non-collapsing solder balls to the BGA section, that materials criteria have been combined in one section, and the criteria for solder sleeves has been expanded to match IPC/WHMA-A-620. The most notable changes for IPC-A-610 include the addition and/or replacement of drawings with actual hardware photos, all damaged criteria moved to one section, and added new criteria for SMT termination style “flattened post.” In 2008 you quadrupled the size of your manufacturing plant. Have you managed to find sufficient contract work to feed this expansion, and how many lines do you have now? When we moved into the new facility in mid-December of 2008, we brought our prototype line from our previous facility and added a complete new SMT line. We’ve also added a third small but very capable SMT line inside of our cleanroom. In addition to size and SMT line capacity, we’ve added a tremendous amount to our capabilities including a high speed aqueous cleaner, a flying probe tester and a conformal coater. Of course, we had no idea what 2009 was going to be like for the industry, but we actually managed to grow our manufacturing business by more than 35% during that year and have continued at roughly the same pace in 2010. This week, we added a business development/sales manager to help guide our centralized sales force to help drive our overall sales and fill up the manufacturing area. You have extensive capabilities in your microelectronics lab and cleanroom. What kind of advanced packaging technologies can you undertake, and how does this feed into the SMT assembly side of the business? Our Microelectronics Lab operates in a 3,000 ft2 class 1,000 cleanroom. We now have the capability to build multichip #1 DVD Ripper 1.3.0.8 crack serial keygen, sensors and miniaturized hybrid packages for military and industrial customers. We are starting to acquire customers and build volume production hardware in this facility. The knowledge and experience from our manufacturing floor is definitely a plus in the cleanroom production, and, as well, the engineers

from microelectronics are always available to the manufacturing floor. Will the end of the NASA space program have a negative effect on your business? Today there are still several scenarios being discussed regarding the future of NASA, but right now I don’t expect any to have a tremendous effect on STI. Even if the manned program does end, the unmanned programs still require the engineering, workmanship and training that STI provides. Because of our history, we take a lot of pride in working with NASA, and we definitely want that to continue, but it does not make up a high percentage financially of our overall business. Your sales division stocks a large number of different solder, adhesive, encapsulants and other materials. Was this division badly affected during the downturn, and what percentage of the overall business is it? Last year was not a good year to be selling benchtop equipment and consumable supplies. I was very glad to have our diversification because this division took a pretty bad hit, but we weathered it without losing any people and have already begun to enjoy growth again. As I mentioned earlier, overall our sales were up last year, but our Distribution Sales department dropped to less than 20% of our total sales. Looking forward five years, where do you think STI Electronics will be? We will be the top training company in the world. (I wish I was smart enough to know exactly what things we will be teaching.) We will be known for our quality manufacturing and lab services, #1 DVD Ripper 1.3.0.8 crack serial keygen. IC/DT will be an accepted technology for several applications. Our Distribution Sales will be providing the best quality materials (I don’t know whose) and outstanding service. I have no idea where we’ll be regarding sales volume or head count but I do believe we will be well known around the world because of our reputation of doing things the right way. I’ll also have a daughter headed off to her first year of college, so as a father, I’ll be terrified. David, many thanks for joining us today. Trevor Galbraith.

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 31


Show report: SMT/HYBRID/PACKAGING rises above the ashes

Show report: SMT/HYBRID/

PACKAGING rises above the ashes

After more than 20 years of travelling to Nuremberg every year for SMT/ HYBRID/PACKAGING, I have come to the conclusion that it is not only the most consistent event in the electronics calendar, but also the best organized. Perhaps that’s why it’s the most consistent! Being a non-Productronica year, European manufacturers used this platform to roll out new equipment, upgrades and improvements. Here is a selection of companies I visited during the show. NORDSON Dage probably had one of the biggest new product Intervideo WinDVD Creator 2 crack serial keygen with the 4000 Plus BondTester, #1 DVD Ripper 1.3.0.8 crack serial keygen. Dage already own this market worldwide with over 4,500 machines in the field. This latest version is a complete redesign offering improved data integrity, accuracy, a stepback before sheer of ± 1µm, #1 DVD Ripper 1.3.0.8 crack serial keygen, camera assisted tool alignment and improved automation.

Among the new applications the 4000 Plus offers are fatigue testing, crack initiation and growth, creep and relaxation tests. On the materials testing front, it has the option of additional Borescope for fine pitch applications and a hot bump pull test. Data I/O were celebrating their best Q2 ever and at the same time delivered

their first customized X-series Roadrunner to a Siemens customer in Hungary. Kyzen introduced Exaklean 5612 to the European market for the first time. This readyto-use stencil cleaner contains the Kyzen inhibitor package that makes it compatible with all pastes, fluxes and adhesives. The Exaklean 5612 does not need a rinse cycle, is PH neutral, #1 DVD Ripper 1.3.0.8 crack serial keygen, fast drying and has a low odor. This makes it a more economical alternative using less waste and no need for the operator to monitor the cleaning cycle. In other news from Kyzen, they have started a contract cleaning service from their facility in Belgium. The company hopes to expand these services over the coming months. MIRTEC were fortunate to make two sales of their newly introduced SPI system on the first day of the show. The company is expanding their manufacturing facilities in Korea to meet the surge in demand for their inspection products. MIRTEC introduced a real game-changer at APEX earlier this year with their new ISIS (Infinitely Scalable Inspection Sensor), comprising a 15 megapixel #1 DVD Ripper 1.3.0.8 crack serial keygen. JUKI officially unveiled the EPV monitoring system on their FX2070 placement machine. This ultimate quality-monitoring system takes no less than five

32 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

photographs of every component from each nozzle. The first photo determines if the component is present after pick up. The second determines if has tombstoned or changed position. The third takes a photo of the pads on the board as a reference designator. The fourth checks the alignment during placement, and the fifth checks that the placement is still good after the nozzle has retracted. This new system is factory fitted on all new FX2070 machines and will soon be available on 2080’s. Europlacer introduced the RC5.15 software, which contains an NPI wizard that leads the operator through the setup for quick, efficient NPI programming. The company have also relocated some staff recently and added two more support staff in the United States. Viscom launched the S2088BO-II, a desktop system for automatic optical wirebond inspection. Developed to inspect medium and small product runs and reliable defect detection on die, ball-wedge, wedgewedge and security bonds, the S2088BO-II inspects everything from aluminum thick wire and aluminum or gold thin wire connections, down to diameters of 17 μm. The inspection library includes inspection Age of Empires III Full Version Download for die, ball-wedge, wedge-wedge and security bonds as well as for damaged and misplaced components. Another new product from Viscom was their vVision software. A new, GUI based software interface on a Windows®7 platform. It is fully touch-screen operated and simplifies the operation of Viscom

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Show report: SMT/HYBRID/PACKAGING rises above the ashes

inspection equipment, #1 DVD Ripper 1.3.0.8 crack serial keygen, while allowing access for experienced programmers to go deeper into the software to fine-tune inspection routines. Mentor Graphics’ Valor Division revealed that their MSS system has now been fully beta tested in a Chinese facility and has the unique ability to see work orders in advance and predict potential bottlenecks. This new software system can balance jobs across multiple lines, #1 DVD Ripper 1.3.0.8 crack serial keygen, reduce the three-day inventory rule and achieve real job scheduling. The latest release of Valor V-Plan 2.1 in June 2010 can now program the entire line from end to end, producing machine code, DFM programs and documentation. Essemtec are never short of new product introductions. They kept up their blistering pace with the COBRA pick and place machine. Constructed on a composite frame, it offers better damping and stability. The COBRA has a unique v-shaped clamping system for boards, a carbon-fibre gantry on linear motors with magnesium heatsinks, all designed to reduce weight and increase speed. The COBRA boasts 240 feeders and an IPC placement speed of 15,000 cph. It is available from September 2010. The Tucano printer is high precision printer with a cycle time of MRT Dongle 3.26 toreent Archives seconds and a price tag of €47,000. It has automatic stencil alignment and a maximum board size of 608 x 540 mm. The other big news from Essemtec was the acquisition of Vermes Microdispensing GmbH. The company currently #1 DVD Ripper 1.3.0.8 crack serial keygen two types of microdispensing valves, the MDS 3200 for high viscosity materials and the MDS 3010 for low/medium viscosity materials, #1 DVD Ripper 1.3.0.8 crack serial keygen, capable of dispensing materials of 0-300 mpas and a droplet size of &lt; 1 nlitre. DEK were demonstrating their dual layer stencils using their VectorGuard Platinum products. The double layer stencil is fabricated through a two-step lithography and nickel electroforming process before being mounted on the VectorGuard tensioning frame. The mesh layer of the two-

layer structure serves to hold the stencil intact while accurately controlling the flow of paste to the second layer. The circuit layer determines the thickness and shape of the print deposits to deliver high tolerance, fine dimension printing. Ideal for accuracy-critical applications such as solar cell manufacture or LTCC manufacture. DEK also introduced the Sentinel inspection system onto their Galaxy, Europa/Photon and Horizon printers. Sentinel operates concurrently with the print cycle to bring 100% inspection at line beat rates and provides full verification and traceability. Marrantz introduced a new iSpector desktop #1 DVD Ripper 1.3.0.8 crack serial keygen. The iSpector Desktop offers 10 µm resolution using eight 1-megapixel cameras and one 2-megapixel #1 DVD Ripper 1.3.0.8 crack serial keygen camera, using a telecentric lens. The system uses three angled light sources and an 18-LED centre light. It has a GUI software interface and sells for €65,000. The iSpector Desktop is available from August. Assembléon is now leasing entry level machines from as little as €55 per day, #1 DVD Ripper 1.3.0.8 crack serial keygen, #1 DVD Ripper 1.3.0.8 crack serial keygen a residual payment at the end of the lease. The new True Capacity on Demand system, where manufacturers rent heads to meet peaks in demand, is gaining popularity. Assembléon also introduced their new Twin Placement Robot. This robotic feeder picks from reels or trays and is an ideal plug-in for the DRAM or memory market. The TPR handles a maximum component size of 45 x 45 mm with a placement accuracy of ± 25 µm. The placement speed from tapes is 16,000 cph (IPC) and from the trays it is 13,000 cph (IPC). ERSA introduced the ECOCELL selective soldering system. The ECOCELL offers two integrated preheaters. Up to four boards can be processed simultaneously, and dual solder bath systems offer the possibility to efficiently process multiple panels. Both the miniwave and the multiwave baths have the possibility to use different alloys in each bath. This function, together with #1 DVD Ripper 1.3.0.8 crack serial keygen possibility to perform maintenance on a multiwave bath

34 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

while the other bath is operating, reduces downtime to an absolute minimum. The ECOCELL has a tightly controlled spray fluxing system, #1 DVD Ripper 1.3.0.8 crack serial keygen, and the under-board IR preheaters can be upgraded to convection systems for heavy-duty boards. SEHO won a local environmental award for a novel approach to harnessing the ambient heat that escapes from the top of their reflow oven chambers. A collector between the machine’s two outer hoods collects the wasted heat from the reflow soldering machine. In addition, #1 DVD Ripper 1.3.0.8 crack serial keygen, this heat recovery concept also covers the exhaust system of the reflow oven, the cooling aggregate, #1 DVD Ripper 1.3.0.8 crack serial keygen, and the cyclone unit used for process gas cleaning. This reclaimed heat can be transported to the manufacturing building either for use in a heat sink for the generation of tap water or in a preheating system for the fresh air supply. Warming of tap water in the manufacturing area is ideal because the soldering machine’s uptime is identical to the usage period of tap water, and water heating is the most efficient way to use wasted heat.

That is a short overview of some of the new products released at SMT/HYBRID/ PACKAGING 2010. This year the show attracted 555 exhibitors and 22,300 visitors. Next year, the show moves back to the #1 DVD Ripper 1.3.0.8 crack serial keygen timeslot, and we can safely predict it will be another success. —Trevor Galbraith

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Presenting.

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What is AOI Resolution?

The 2010 GLOBAL Technology Awards The ONLY global awards program in the industry A GLOBAL Technology Award sends the message that your product or service is an innovation and quality leader in an industry crowded with competing products. Sponsored by Global SMT &amp; Packaging magazine, the GLOBAL Technology Awards are now in their sixth year of recognizing and celebrating innovation in the electronics manufacturing industry. Entries are being accepted now through July 31st. Entries are invited from equipment, materials and EMS companies of all sizes. In addition to the award statue, winners receive publicity in a special awards issue of each of Global SMT &amp; Packaging magazine’s five editions #1 DVD Ripper 1.3.0.8 crack serial keygen, Europe, China, Korea &amp; South East Asia) as well as on the Global SMT &amp; Packaging and GLOBAL Technology Award websites and in the Global SMT &amp; Packaging email newsletters. Winners also receive a small poster for use at trade shows and an image and logo for use in advertising, websites and other promotional materials.

Enter now: http://awards.globalsmt.net

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Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 35


SMT Answers

SMT Answers SMT Answers, found online at answers.globalsmt.net, offers a place for members of the electronics manufacturing community to ask and answer questions—it’s a community-based ‘help board.’ Registration is not required for participation. Here are some recent questions and answers. Jump online any time to ask your own questions or help others out. When we solder FR1 board, we are facing problems with bubbles. What would be the possible reasons and how do we eliminate this issue?

the solder from the hole. Not all the holes were outgassing, we could test it with soldering iron. Outgassing continues when the solder remelts. The cause of the plating issue was the borehole’s surface roughness, #1 DVD Ripper 1.3.0.8 crack serial keygen. You can test the holes like this: http:// www.youtube.com/watch?v=HCh_oyts9WE —Istvan

A: Most likley humidity. Check your screen printers humidity and temprature controls and make sure they are functioning properly, #1 DVD Ripper 1.3.0.8 crack serial keygen. This has been the problem when we had bubbles or blow holes. This may require a solder paste brand change, #1 DVD Ripper 1.3.0.8 crack serial keygen. —jt A: The laminate might have absorbed moisture. You could try baking it before use. A: We used to have issues with FR4 boards where the plating of the through holes

Tombstoning small parts on HASL boards—is there a solution or are we going to have to look into another kind of board? were not continuous and had a rough surface. The boards had outgassing during wave soldering what formed large boubles inside the solder joint and pushed out

36 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

A: No, #1 DVD Ripper 1.3.0.8 crack serial keygen, you should not have to get new boards, although HASL finish is where I have seen all tombstoning. If you went to an ENIG board your tombstoning would

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SMT Answers

most likley go away, but that costs. Try decreasing the amount of paste being deposited onto the pad, #1 DVD Ripper 1.3.0.8 crack serial keygen. You have enough solder that surface tension is pulling the part upright. Also, as I am sure you have done already, make sure that chip is dead center. If you have a glue machine in line you may just want to brute force it and add glue. Most glue cures at about 180˚F before solder reflows. —J Torrez, Production Manager, Transparent Technologies

This is for a Sn/Pb based material. —Dr. Brian Toleno, Director of Technical Service, Henkel

A: Have you tried an ’anti-tombstoning’ paste, available for tin/lead process, through Indium Corp? —Mark

We find it difficult to find a subcontractor to do these short run assemblies. Getting the bare PCBs made is no problem. Having SMT components properly assembled is a problem. Since we are a subcontractor we cannot promise the large board houses any future volume business if they produce the short run prototypes. So we have a “Catch-22” situation in our business. Our past designs have created product for our clients in volumes of 100K-1M PCBs. Yet we find it difficult to produce the prototypes and lead boards that ultimately produce this larger volume. We have thought of investing in table top pick &amp; place, stencil screens and

A: LT (Low Tombstoning) versions of AIM SnPb and SAC solder pastes are available. These work well with convection reflow ovens and vapour phace. —Andrew Clarke, #1 DVD Ripper 1.3.0.8 crack serial keygen, European Business Manager, AIM A: There are several ways to reduce tombstoning without changing the PWB finish. The two main factors are design and materials. See Toleno, B., Poole, N. “A Materials Based Solution for AntiTombstoning”, APEX 2003. In this study, on #1 DVD Ripper 1.3.0.8 crack serial keygen board designed to produce tombstones, we reduced the defects from 444 to 211.

Market for short run prototypes? I run a small R&amp;D business in which we do custom electronic and firmware (software) design. Our typical project produces 2 or 3 prototype PCBs and then 10-20 first beta product boards. From there the client usually sends the design off to a large board house for volume production.

reflow ovens. The cost of these tools are affordable; however, the cost of labor to run these tools may be far below breakeven. Has anyone out there dealt with such problem? How did you resolve it? A: I would not recommend setting up a short run facility for your designs. We explored the same situation a few years ago. Instead of producing first prototypes for clients, we now provide a paper design package which includes schematics, PCB gerbers, and component lists. The production of PCB prototypes is now the responsibility of the client company, #1 DVD Ripper 1.3.0.8 crack serial keygen. And as you elude to above, the client does have the clout to negotiate short-run production with a promise of full production runs later. As a part of our contract, we accept built up prototype units back from the client to perform extensive testing, firmware design, and revisions as necessary, #1 DVD Ripper 1.3.0.8 crack serial keygen. Have we lost much business with this approaoh? Not really, #1 DVD Ripper 1.3.0.8 crack serial keygen, once the client understands the economics of this approach. Furthermore, we are preparing to exit this business in the USA as low cost labor in Asian countries will soon dominate.

These questions and answers are the opinion of the author(s). The Publisher does not accept responsibility for the accuracy or veracity of the information contained on this page.

www.globalsmt.net

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 37


Teaming for improved ruggedized product reliability New Products

New products Seika Machinery introduces PR1 pocket handy BGA solder ball checker Seika Machinery, Inc., introduces M.S. Engineering Co. Ltd.’s PR1 BGA solder ball checker for fast and accurate inspection of BGA soldering and QFP lead sections. The easy-to-use system is the ideal solution for checking BGA solder balls. The handheld system provides fast #1 DVD Ripper 1.3.0.8 crack serial keygen accurate inspection of the soldered points and surface of BGAs, and features a conductive body for ESD. It also enables visual inspection of QFP leads as well as chip parts. As an additional benefit, the small checker (50 x 30 x 15 mm, weighing 25 g) fits in a handy pocket and comes standard with a wrist strap for convenience. www.seikausa.com Manncorp adds two higherthroughput PCB assembly systems to turnkey line-up In response to increased interest from OEMs aiming to cut costs by bringing PCB assembly in-house, Manncorp has expanded the top end of its turnkey lines. The two new systems are the “HighThroughput Flex Line” which includes twin MC-385 pick and place machines with a combined placement rate of 10,000 cph, and the “Box Builder Line” with the MC-

Nordson DAGE launch 4000Plus multi-purpose bondtester Nordson DAGE, a subsidiary of Nordson Corporation, introduces the 4000Plus multi-purpose bondtester. The 4000Plus represents the new industry standard in bond testing, providing unsurpassed data accuracy and repeatability and offering complete confidence in results. The system is able to perform a wide range of shear and pull applications as well as new push functionality up to 50kg. The 4000Plus is suitable for the full spectrum of traditional bond tests as well as meeting the requirements of emerging test applications including ribbon pull, new hot bump pull and fatigue. Ergonomically it also sets new standards with innovative user interfaces. www.nordsondage.com

387 placer that houses a huge 224-feeder capacity. The Flex Line enables assemblers to increase throughput by balancing their line and is Internet-priced at $199,995. The Box Builder Line, with its pick and place having an IPC9850-rated speed of 5,500 cph, is particularly suitable for short-run assemblers who require abundant feeder capacity. The Box Builder is Internet-priced at $139,995. www.manncorp.com Major new functionality in the vSure DFM Product Mentor Graphics Corporation announced the release of the vSure™ version 9.0 product, the successor of Valor Enterprise 3000™ Design-for-Manufacturing (DFM)

38 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

product. The enhancements in this release enable designers to more easily perform extensive DFM analysis during the PCB design process, thus improving their productivity, avoiding costly design re-spins, and speeding the time to target highvolume production. Electronics companies can now better meet their aggressive business goals of getting a more competitive product to market on time and at reduced manufacturing costs. go.mentor.com New upgrade possibilities make the KE-2050/60light mounters even more attractive With the 2050Light and 2060Light, JUKI offers a perfect match for current

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The Adventures of James Bondless production environments at a very affordable price. Time and again, so called “light machines” are heavily stripped down machines but this is not the case at JUKI. To keep up with new requirements JUKI adapts new market trends to these machines and is able to offer new options: • The long wide option #1 DVD Ripper 1.3.0.8 crack serial keygen the board size from 410 mm x 360 mm to 510 mm x 360 mm. • The KE-2060light now places components up to 20 mm height, and a 20 mm upgrade is available to existing 2060Light customers with 12 mm machines. • The #1 DVD Ripper 1.3.0.8 crack serial keygen are now available with “blue light,” which makes it easier for the operator to see the components on the board for visual checks. www.jas-smt.com

integrate its customers’ manufacturing processes. www.assembleon.com

New software for Assembléon’s A-Series cuts NPI time by 30% Royal Philips Electronics subsidiary Assembléon is cutting new product introduction (NPI) time on its A-Series pick &amp; place equipment by 30%. The improvement is the first result of Assembléon’s strategic partnership with Valor—a division of Mentor Graphics— which brings a full suite of NPI and MES factory integration tools to automate machine- line- and factory-level workflows and business processes. The result is a lean manufacturing operations management framework that is open, modular, and flexible. And it connects flawlessly to Assembléon’s enriched interfaces enabling performance monitoring, traceability and warehousing solutions. All that helps

Microscan announces the availability of Visionscape® 4.1. Microscan’s Visionscape® is a completely scalable, single-software package that can be used on machine vision boards, GigE solutions, and smart cameras. Visionscape®’s comprehensive machine vision toolset includes blob analysis, OCR, OCV, #1 DVD Ripper 1.3.0.8 crack serial keygen, barcode, vector and edge algorithms, plus the industry leading pattern-matching tool, #1 DVD Ripper 1.3.0.8 crack serial keygen, Intellifind. Visionscape® 4.1 brings additional tools such as color matching and color segmentation, #1 DVD Ripper 1.3.0.8 crack serial keygen. #1 DVD Ripper 1.3.0.8 crack serial keygen matching can be used in high-speed applications such as sorting parts, and color segmentation enables other tools to be applied in a specific color plane. www.microscan.com

Microscan upgrades Visionscape®, the most comprehensive machine vision software for multi-platform use

Smart Sonic’s 440-R® SMT Detergent is guaranteed to safely clean any type of solder paste from any fine-pitch stencil and is the only stencil-cleaning chemistry verified for specific parameters of Environmental Safety, User Safety and Cleaning Efficiency by the U.S. EPA’s Environmental Technology Verification Program.

Request your sample today! .improving print yields

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New Products

thermal conductivity adhesives from LORD Corporation, MT-815 has a modulus of &lt;1 GPaallowing it to be more flexible and therefore less likely to crack or delaminate under the stresses of temperature cycles. MT-815 was also formulated to achieve thermal conductivity of &gt;10 W/m-K, creating a new class of flexible adhesives with high thermal conductivity, #1 DVD Ripper 1.3.0.8 crack serial keygen. www.lord.com

VJ Technologies announces IR pre-heaters with advanced control VJ Technologies, Inc. #1 DVD Ripper 1.3.0.8 crack serial keygen its IR Pre-heater Series, designed to preheat assemblies that require additional heat to compliment manual soldering and desoldering of SMT, #1 DVD Ripper 1.3.0.8 crack serial keygen, through-hole and other thermal applications. The IR Pre-heater Series is designed to work in conjunction with hand soldering and desoldering tools. IR Pre-heaters were developed for manual rework or for use with equipment, such as selective soldering systems for preheating boards to help eliminate board warping prior to rework. The pre-heaters also compliment underpowered rework systems lacking effective bottom heating. VJ Technologies’ infrared pre-heaters provide the additional heat and control required for lead-free applications, especially for multi-layer circuits. www.vjt.com LORD Corporation develops thermal conductivity adhesive LORD Corporation has announced the availability of a new low modulus, high thermal conductivity adhesive. Created in response to a market need for a more flexible, high thermal conductivity adhesive, MT-815 can be used in a variety of applications including as a thermal adhesive for large die, in die attach applications, or as a solder replacement. The first in a series of new low modulus,

Christopher Associates introduces new SPC software package for solder paste inspection Christopher Associates Inc. today introduced a powerful new yield improvement tool for the solder paste printing process. SPC+ Software, developed by Koh Young Technology, is a high-functionality statistical process control (SPC) package that can be run on the system or offline. The new software is included free of charge on all new Koh Young equipment. The software offers the ability to analyze both images and data to track performance, improve manufacturing yields and provide complete traceability under real-time conditions. Defect review, X Bars &amp; S charts, Cp and CpK calculation, histograms, and other analytical tools can be calculated quickly and accurately with Pareto charts and the ability to drill down on specific data points. www.christopherweb.com Loctite PowerstrateXtreme Printable raises the bar on thermal management flexibility Addressing the challenges posed by traditional greases and phase-change thermal interface materials, Henkel has developed and commercialized Loctite PowerstrateXtreme

Essemtec upgrades MIS 6.6 software suite Essemtec’s Management Information System (MIS) for SMD placement machines has been enhanced with additional functions, including the support of automatic PCB identification with bar code and the splitting of production and placement data for each individual PCB. MIS is a software suite for the complete work-flow management on SMD pick-and-place machines. The system supports production planning, enables set-up optimization and control, includes a component stock management tool, and stores all production and placement data for traceability. MIS version 6.6 has been optimized for tracing both panels and PCB clusters. With the upgrade, MIS now saves production and assembly data with reference to each individual circuit. Therefore, data can be analyzed and tracked for each PCB. This is particularly important for the medical, automotive and aviation industries. www.essemtec.com

40 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

Printable (PSX-P), a new print-friendly thermal management product. Delivering unprecedented process flexibility, Loctite PSX-P allows for thermal management materials to be deposited using traditional screen and stencil printing methodologies and is offered in both medium dry and extended dry version to accommodate varying manufacturing conditions and requirements. The reliability and performance of PSX-P is consistent with that of Loctite PowerstrateXtreme phasechange films but its paste format enables the material thickness to be adjusted as required. www.henkel.com/electronics. SEHO adds features to GoSelective product line

SEHO Systems GmbH enhanced its GoSelective light to include additional features and capabilities. With the upgrades, the product has been renamed to communicate the new features. The GoSelective light standalone will now be referred to as the GoSelective. With its enhanced capabilities, the system is no longer considered “light”, #1 DVD Ripper 1.3.0.8 crack serial keygen. Also, the GoSelective light inline is now called the SelectiveLine to express the systems’ inline capability and to highlight the modular concept, which allows the soldering machine to be upgraded with fluxer and preheat modules up to a complete manufacturing line. #1 DVD Ripper 1.3.0.8 crack serial keygen BPM Microsystems announces support for Exar’s PowerXR family of programmable power solutions BPM Microsystems L.P., now supports the PowerXR family of high-performance programmable power controllers from Exar Corporation on their automated and manual programmers, #1 DVD Ripper 1.3.0.8 crack serial keygen. Exar’s PowerXR ICs, combined with BPM Microsystems’ unrivaled universal device programmers, significantly reduce development time, cost and are easily reconfigured for real-

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New Products

time design changes. BPM Microsystems supports the XRP7704 and XRP7714, a 5Amp/channel regulator, and the XRP7740, a 16 Amp/channel version, on its full line of universal device programmers. www.bpmmicro.com

from lead-free versions. In addition, Count On Tools now offers custom selective solder nozzles based on specific application requirements. This includes special wave form sizes and extended or shortened lengths. www.cotinc.com

Count On Tools introduces selective soldering nozzles for ACE equipment Count On Tools Inc. is now manufacturing ACE Bullet nozzles for the KISS range of selective soldering machines. By utilizing superior steel alloys made in the USA, along with the latest precision machining technologies, Count On Tools is able to produce selective soldering nozzles that are more durable and last longer than those from the OEM, while still maintaining all of the original design properties. The nozzles are available in all standards sizes from 3mm (0.125”) to 25mm (1.0”). Count On Tools also provides identification marks that enable customers to easily identify lead nozzles

Multitest’s MT9928 platform combines ROI and high efficiency

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has successfully passed the strict QA and production approval requirements of an international IDM. The state-of-the-art gravity feed handler offers a variety of loading and un-loading options. With a throughput of up to 14,500 uph, #1 DVD Ripper 1.3.0.8 crack serial keygen, the bowl feed loading module is the loading option of choice for small package sizes. The bowl feed module offers the modularity and conversion of the MT9928 platform without limiting the flexibility of the base machine. The system can be combined with all types of un-loaders, further improving the return on investment. www.multitest.com MEMS cavity seal integrity As part of its bonded wafer inspection

Multitest announces that its nextgeneration MT9928 bowl feed module

Global SMT &amp; Packaging – Celebrating 10 Years – July 2010 – 41


New Products

technology, Sonoscan has recently demonstrated acoustic imaging of defects in the seal that surrounds and protects the cavities in MEMS devices. The defects most frequently take the form of voids (Device 1 above) within the seal, which may be direct Si, metallic, glass or polymer, depending on the reliability level of hermetic seal required as per SEMI MS8-0309, #1 DVD Ripper 1.3.0.8 crack serial keygen. In some locations on a wafer the seal may be breached (Device 2 above). Another frequent defect is delamination of the seal from one or both substrates, the result of poor wetting or contamination during fabrication. The defects are risky because thermal and mechanical stresses can cause them to grow until they cause a leak in the seal. Defects in the seal may be only a few tens of microns in diameter and of sub-micron thickness, but can be imaged by Sonoscan’s C-SAM® systems because they represent a gap that reflects &gt;99.99% of the VHF/UHF ultrasonic pulse. In production, a percentage of MEMS devices may be imaged with C-SAM acoustic micro imaging systems in order to verify that process parameters are preventing the formation of voids. Where high reliability is essential, as in mil/aero or medical MEMS, 100% of devices may be inspected. www.sonoscan.com New radiometer ensures consistent light curing

DYMAX Corporation addresses this condition and offers accurate intensity and dosage measurements for LED curing equipment. The easy-to-operate ACCU-CAL™ 50-LED radiometer offers accurate measurement of curing energy. This radiometer can measure energy levels emitted from lightguides (3 mm, 5 mm, and 8 mm) and LED flood lamps. A specially designed photo-sensor assembly provides repeatable measurements and protection from high temperatures associated with some LED systems on the market. www.dymax.com Techcon Systems introduces updated product catalog Techcon Systems, a product group of OK International, #1 DVD Ripper 1.3.0.8 crack serial keygen, introduces its updated product catalog.The enhanced catalog highlights the new Easy Flow Blue Piston Series, designed with close tolerances to precisely fit inside the syringe barrel. The Easy Flow Blue Series Piston requires less pressure to dispense fluids consistently and prevent air from becoming trapped during the dispensing process. Techon’s new Techkit TS 6500 Series Cartridge Mixer has also been added to the new product catalog. The catalog also features syringes, needles, cartridges, dispensing guns and accessories. www.techconsystems.com Orthodyne Electronics introduces HD series wire bonders Orthodyne Electronics’ new High Density Series wire bonders are designed to address the demand for smaller, thinner and denser discrete power semiconductor packages such as SO-8, PDFN, PQFN, DSO and DrMos. #1 DVD Ripper 1.3.0.8 crack serial keygen HD Series includes the 7200HD dual-head semiconductor bonder and the 7600HD semiconductor Bonder, available in one to four Red Alert 2 1.00 crack serial keygen. Both systems can be equipped with large and small aluminum wire or PowerRibbon®. www.orthodyne.com New resource for electronics engineers and electronics products manufacturers

Electronics engineers and electronics products manufacturers seeking to use rapidly advancing laser die cutting technology for membrane switches, flexible circuits and other electronic component fabrication can now determine if the materials they use can be handled by modern laser die cutting technology by sending samples for engineering studies and analyses to the new Spartanics Laser Cutting Applications Laboratory for Materials Research, #1 DVD Ripper 1.3.0.8 crack serial keygen. The Spartanics Laser Die Cutting Applications #1 DVD Ripper 1.3.0.8 crack serial keygen for Materials Research provides no-cost detailed engineering analyses of maximum material thicknesses that can be handled with these different substrates, including brand name materials, correlated to laser power and other variables. To arrange for a no-cost materials analysis of suitability for finishing, marking and other detailing with laser die cutting, contact Mike Bacon, Spartanics VP, at mbacon@spartanics.com. www.spartanics.com The thinnest compliant board-to-board interposer Custom Interconnects, LLC announced the thinnest compliant board-to-board

Although many UV and visible radiometers currently available have a wide range of sensitivity in the UVA through visible portions of the spectrum, their sensitivity levels may not effectively match at the specific narrow band frequencies emitted by LED #1 DVD Ripper 1.3.0.8 crack serial keygen systems. The new ACCU-CAL™ 50-LED radiometer from

42 – Global SMT &amp; Packaging – Celebrating 10 Years – July 2010

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interposer ever developed: the Thinnerposer®. The Thinnerposer® is expected to draw a great deal of interest from the RF design community. Targeted applications for the new Thinnerposer® technology include UAV/UAS, avionics, radar arrays, space probes and orbital satellites—a natural fit for the superior flexibility, impedance matching, and shock/vibration attributes of this product set. www.custominterconnects. com

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New Products

New Horizons in Bond Testing The Nordson DAGE 4000Plus is the most advanced bondtester on the market, representing the industry standard in bond testing.

Boundary scan tools keep on developing

Data Integrity Developed by the world leader in bond testing technology, the 4000Plus offers unsurpassed accuracy and repeatability of data providing complete confidence in results.

JTAG Technologies announced further advances in the boundary-scan tool arena with the latest release of its development and hardware debug tool, JTAG ProVisionT V1.8, that features on the latest tools CD (release 16 - May 2010). ProVision combines advanced automation with the level of control and precision that engineers demand when creating test programs and in-system programming (ISP) routines for PLDs, FPGAs, flash memories, serial PROMs and other devices. Enhancements to the ProVision version (V1.8) include new pin-level ActiveTest, multi-board and scan bridge support for JFT (Python) script routines, and an expanded ProVision model library covering more than 78,00 devices. www.jtag.com The stock you need, when &amp; where you need it; Paragon VMI service cuts cost of component supply In the wake of recent economic challenges, the pressure is on manufacturers to find new ways to remain competitive. Against this backdrop, Bedford-based Paragon’s Vendor Managed Inventory (VMI) service is fast becoming the supply chain management service of choice for production environments in the UK and beyond. Part of Paragon’s Total

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Extensive Testing Capability

Intelligent Software

Load cartridges combined with standard and specialized fixtures perform shear tests up to 500kg, pull tests up to 100kg and push tests up to 50kg, covering all your test applications including new hot bump pull and fatigue applications.

The 4000Plus utilizes Nordson DAGE’s next generation Paragon™ software which boasts a highly configurable and intuitive interface as well as a wide variety of advanced functionality such as automatic GR&amp;R calculation, built-in diagnostics, a unique database search engine wizard and superior reporting.

Ultimate Versatility A range of XY stages, with a 160mm XY stage as standard, meets a wide range of requirements. The image capture system for advanced analysis is quick to set-up and in close proximity to the test head aiding faster testing.

Learn more at www.nordsondage.com/4000Plus See the 4000Plus bondtester in action at Semicon West 2010: Booth No. 5947

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